• Journal of the Korean Society of Safety
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• v.30 no.1
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• pp.34-39
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• 2015

The feasibility of recycling wasted printed circuit board (PCB) is investigated by preparing PCB added flame retardant composites filled with either unsaturated polyester or polyurethane. In order to improve electroconductive properties, copper powder was added into the composites, which results also in improving their antistatic properties. The prepared composite samples showed a binding between the polymer fillers observed by a scanning microscope. The sample group using unsaturated polyester is elastomeric that led to appreciable elongation and elasticity. In case of polyurethane, the tensile strength increased proportionally as increase of the amount of PCB powder. The composite materials can be utilized as antistatic composite materials, since the surface resistivity result showed increase of the electroconductive properties by adding Cu. The flammability of the samples is not satisfactory according to UL-94 vertical test. However, the flame retardant properties were improved by adding PCB power. This study, therefore, showed that it is feasible to fabricate polymer composite materials and improve the material characteristics by adding PCB powder, which can replace existing additives used for the preparation of polymer composite materials and can reduce the environment contamination by recycling the wasted PCB.

• IE interfaces
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• v.10 no.1
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• pp.155-167
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• 1997

The purpose of this study is to develop the program for efficient operation of a multi-functional surface mounting device(SMD) which mount various components on a printed circuit board(PCB). These components are provided by diverse types of feeders such as cassette, stick and tray feeders. The SMD has one or two heads. In the SMD, the positions of PCB and feeders and fixed, and the head moves to pick up a component from a feeder and to mount it on the PCB. The number of lanes occupied by each feeder and the nozzle used for each component can be different. We develop an off-line program to minimize the cycle-time of the SMD by studying the optimal assignment of feeders and the optimal mounting sequence of components. Graphical User Interface(GUI) is also developed. Additionally, we consider the line balancing problem which appears when two SMDs are used sequentially.

• The Optical Journal
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• s.124
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• pp.28-32
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• 2009

초정밀 초고속 레이저 가공공정 및 장비는 유연소재의 태양전지, 인쇄전자소자(printed electronics devices)의 초고속 절단공정, 고기능 다기능 모바일 기기용 고부가 PCB의 초정밀 초고속 레이저 드릴링 및 복합 유연 가공 등에 적용된다. 최근 레이저 가공기 연구개발 패러다임은 레이저 의존형 장비 개발에서 레이저 맞춤형 장비 개발로 변화되고 있다. 즉, 수입된 레이저 발진기 및 광학기기를 사용하여 레이저 공정 및 장비를 개발하는 방식에서 벗어나, 개발하고자 하는 공정 및 장비에 최적화된 레이저 발진기 개발을 병행하는 것이다. 이러한 상황에서 최근 지식경제부 산업원천기술개발사업으로 신개념 레이저 기반 초정밀 초고속 가공시스템 개발이 착수되었으며, 본 고에서는 이에 대한 전반적인 내용들 소개하고자 한다.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.4 no.4
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• pp.54-60
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• 2005

In a $CO_2$ inverter welding machine, stable arcs can be generated and a welding performance that is a goal of welding can be improved when stable electric power with a low voltage and a high current is supplied to a electrode that is the secondary part (output load terminal) and the base metal. For such a stable power supply, therefore, the AC arc welding machine, the thyristor welder, and the inverter welder have been developed in order according to development of the power electronics techniques. Up to now, the thyristor welding machine is still broadly used but the application volume is gradually reduced by development of the inverter welder. Because the welding performance of the inverter welder is very good and the weight and size of the welder is remarkably light and small. The final goal of this research is to develop the voltage loss compensator that is a drawback of the inverter welder and improve the welding performance using the developed compensator.

• Proceedings of the KIEE Conference
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• 1998.07b
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• pp.660-662
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• 1998

실장 PCB에 대한 검사업무는 많은 인력과 시간비용을 요구 제품의 생산성을 저하시킴으로써 제품에 대한 경쟁력 확보에 큰 장애요인이 되고 있다. 따라서, 기업들은 검사 자동화를 추진하여 왔는데, 검사 생산성을 획기적으로 개선하기 위해서는 검사패턴을 자동 생성하고 아날로그 회로나 디지털 회로상의 전자 소자나 회로 기능을 선택적으로 검사함으로써 검사비용을 최소화할 수 있는 다기능 검사 기능이 요구된다. 따라서, 본 연구에서는 회로 보오드상의 부품 특성에 따라 최적의 검사패턴을 자동 작성하고 동시에 실행할 수 있는 지능형 검사 시스템을 개발하고자 한다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.315-315
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• 2010

휴대용 전자 기기는 얇고 가벼우면서 빠른 대용량을 처리하는 속도와 다기능이 필요한 추세로 가고 있다. 기기 크기가 작아짐에 따라서 내장 되는 칩 또한 소형화, 고집적화, 고성능화가 요구되므로 이에 상응하는 발전된 패키징 기술이 필요하게 되었고, 이에 대응하기위해서 embedded components device 패키징 기술이 필요로 하게 되었다. 본 연구에서는 $21{\Omega}$ 의 저항 값을 갖는 1005 수동 소자를 prepreg를 이용하여 PCB기판에 내장 한 후 micro via를 이용하여 무전해 구리 도금으로 전기적인 연결을 하여 기판을 제작하였다. 제작되어진 기판으로 Reflow, Aging 테스트 후 칩과 계면간의 금속화합물 반응을 관찰하였다. 또한 Reflow외 시효처리를 끝마친 기판을 사용하여 drop test를 실시한 후 fail 발생 시 저항 값의 변화와 접합부의 미세조직을 관찰하였다.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.22 no.3
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• pp.371-379
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• 2011

Active phased array antenna structure is used for modern multi-function radars. To search targets in high clutter environment, the radar receiver needs high dynamic range performance. Though active phased array antenna structure lead to increase of SNR, the SFDR is not increased. In this paper, high SFDR receiver of X-band active phased array radar was designed and manufactured. One channel digital receiver is connected to 32 T/R modules and one PCB assembly is composed to 2 channel digital receivers with RF part, ADC part, LO distribution part and digital down conversion part. A commercial FIFO board was used for digital receiver measurement about major performance in digital output signal condition. The measured digital receiver gain and SFDR is 33 dB and more than 81 dBc each.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.7-15
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• 2012

Semiconductor packages are increasingly moving toward miniaturization, lighter and multi-functions for mobile application, which requires highly integrated multi-stack package. To meet the industrial demand, the package and silicon chip become thinner, and ultra-thin packages will show serious reliability problems such as warpage, crack and other failures. These problems are mainly caused by the mismatch of various package materials and geometric dimensions. In this study we perform the numerical analysis of the warpage deformation and thermal stress of 4-layer stacked FBGA package after EMC molding and reflow process, respectively. After EMC molding and reflow process, the package exhibits the different warpage characteristics due to the temperature-dependent material properties. Key material properties which affect the warpage of package are investigated such as the elastic moduli and CTEs of EMC and PCB. It is found that CTE of EMC material is the dominant factor which controls the warpage. The results of RSM optimization of the material properties demonstrate that warpage can be reduced by $28{\mu}m$. As the silicon die becomes thinner, the maximum stress of each die is increased. In particular, the stress of the top die is substantially increased at the outer edge of the die. This stress concentration will lead to the failure of the package. Therefore, proper selection of package material and structural design are essential for the ultra-thin die packages.

• Journal of the Korean Society of Marine Environment & Safety
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• v.26 no.2
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• pp.206-218
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• 2020

Located mostly inside the megacity of Busan, the Busan Southern Port is a multifunctional port with various nearby industry activities, including a joint fish market, ship repair facilities, and fishing boat facilities. If toxic chemicals generated by the industrial activities continue to flow into and accumulate in the sediment of the port, they can affect aquatic ecosystems and humans. Therefore, in this study, distribution levels and potential influent sources of organic pollutants, including polycyclic aromatic hydrocarbons (PAHs), polychlorinated biphenyls (PCBs), and butyltin compounds (BTs), in the sediment were investigated. The sediment samples were collected from eight sampling sites in November 2013 (first phase) and November 2014 (second phase). The mean concentrations of PAHs, PCBs, and BTs in the first and second sampling phages were 4174.0 ng/g-dry wt. and 1919.0 ng/g-dry wt., 166.3 ng/g-dry wt. and 21 ng/g-dry wt., and 50.9 ng/g-dry wt. and 30.8 ng/g-dry wt., respectively. The concentrations of the organic pollutants detected in the seabed sediments were lower in the second phase than in the first phase. In this study, the inflow sources of PAHs, PCBs, and BTs were found to be combustion, land, and municipal sewage or industrial wastewater, respectively.