• Journal of the Korean Institute of Telematics and Electronics D
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• v.36D no.9
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• pp.31-36
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• 1999

A capacitance-type sensor using porous silicon layer is developed to measure aqueous alcohol concentration. Since alcohol, so called ethanol, is very permeable into the silicon wafer, it is often used to help chemical reaction when the silicon wafer is processed under some aqueous solution. In this work, the sensing property was measured for the alcohol concentration from zero to near 100 percent with two types of samples with porous silicon layer formed in 25 and 35% HF solution, respectively. Good reliability as well as fast response time and good linearity were shown over 10kHz and the measured capacitance was observed to be inverse to alcohol concentration due to the decrease of the whole dielectric constant in porous silicon layer.

• Journal of the Korean Vacuum Society
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• v.6 no.3
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• pp.242-248
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• 1997

Porous silicons were prepared by dry etching as well as by chemical etching. The latter is a conventional method used by many researchers. Meanwhile, the former is a new method we developed. Also the porous silicon structure was made by E-beam lithography technique. However, due to the limit of this technique, minimum size we could produce was about 0.3 $\mu\textrm{m}$ in diameter on silicon wafer. In a new method, the porous silicon microstructure was fabricated by using Reactive Ion Etching method after covering with diamond powder on 4 inch wafer by using spin coater. In this method, diamond powder acted as a mask. The morphology of samples prepared under many different conditions were analysed be SEM and AFM. And we measured PL spectra for the samples. Based on these results, we observed the structure of a few hundreds $\AA$ in size from porous silicon which was made by dry etching with diamond powder. Also the PL peak for these samples lied around 590 nm compared to 760 nm for chemically etched porous silicon.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.1760-1762
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• 2000

본 논문은 기존의 $Si_{3}N_4$, SiN 물질 대신 Pt를 사용해 HF 용액속에서 다공질 실리콘과 전극을 동시에 형성하는 기술을 개발하였다. Pt를 실리콘 웨이퍼 위에 직접 증착한 후 습식 에칭과 Lift-off 공정을 사용하여 Pt를 패터닝하였다. 습식 에칭은 에칭용액의 온도를 일정하게 유지하는 것이 중요하며, 증착한 Pt 박막이 BOE 에칭에 견디고, Lift-off 공정이 가능하기 위해서는 기판온도를 l100$^{\circ}C$ 이하로 해야한다. Pt를 사용하면 기존의 mask에서 발생하는 가장자리 부분에서의 전류 집중이 방지되기 때문에 다공질 실리콘이 일정한 깊이로 형성되고, Al대신 오믹 전극으로 사용할 수 있다. 현재 Pt를 mask와 전극으로 이용한 P-I-N UV detector, 광 바이오센서, 습도센서 제작등에 응용 연구가 진행되고 있다.

• Journal of the Korean Electrochemical Society
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• v.2 no.1
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• pp.17-22
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• 1999

Since the use of porous silicon for microsensors and microactuators is in the euly stage of study, only several application devices, such as light-emitting diodes and chemical sensors have so far been demonstrated. In this paper we present an overview of the present status of porous silicon sensors and actuators research with special emphasis on the applications of chemical sensors and optical devices. The capacitive type porous silicon humidity sensors had a nonlinear capacitance-humidity characteristic and a good sensitivity at higher humidity above $40\%RH$. The porous silicon $n^+-p-n^+$ device showed a sharp increase in current when exposed to an ethanol vapor. The $p^+-PSi-n^+$ diode fabricated on porous silicon diaphragm exhibited an optical switching characteristic, opening up its utility as an optical sensor or switch. The photoluminescence (PL) spectrum, taken from porous silicon under 365 nm excitation, had a broad emission, peaked at -610 nm. The electroluminescence(EL) from ITO/PSi/In LED had a broader spectrum with a blue shifted peak at around 535nm than that of the PL.

• Journal of Sensor Science and Technology
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• v.8 no.1
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• pp.32-37
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• 1999

A capacitance-type humidity sensor with mesa structure in which porous silicon layer is used as humidity-sensing material is developed and its humidity sensing properties are measured. This sensor has a structure where two electrodes are set on the up-side of the wafer against the past typical structure having these electrodes on the up and down-side of the wafer. Therefore, the sensor can be fabricated monolithically to be more compatible with the IC process technology, and is possible to detect more correct output capacitance by removing the effect of the parasitic capacitance from the bottom layer and other junctions. To do this, the sensor was fabricated using process such as localized formation of porous silicon, oxidation of porous silicon layer, and etching of oxidized porous silicon layer. From the completed samples, the dependence of capacitance on the relative humidity of 55 to 90% more was measured at room temperature. As the result, the measured capacitance increased monotonously higher at the low frequency of 120 Hz, where the capacitance was observed to increase over 300%.

• Journal of Sensor Science and Technology
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• v.8 no.2
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• pp.202-209
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• 1999

Microstrip line was fabricated on the oxidized porous silicon layer which has nearly electrically and chemically identical properties with thermally oxidized silicon layer. Thick oxidized porous silicon layer of few tenth of micrometers was prepared by thermal oxidation of porous silicon layer on silicon substrate. Multi-step thermal oxidation process was used to obtain high Quality and thick oxidized silicon layer and to release thermal stress. Microstrip line was fabricated on the oxidized porous silicon layer. Its microwave characteristics were measured and the availability for MMIC substrate was investigated.

• Proceedings of the KIEE Conference
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• 2002.07c
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• pp.2026-2028
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• 2002

본 논문에서는 실리콘 기판상의 전송선로 특성을 개선하기 위하여 표면 마이크로머시닝 기술을 이용하여 $10{\mu}m$ 두께의 다공질 실리콘 산화막으로 제조된 기판 위에 에어브리지를 가진 CPW 전송선로와 phase shifter를 제작하였다. 간격이 $30{\mu}m$, 신호선이 $80{\mu}m$인 CPW 에어브리지 전송선의 삽입손실은 4 GHz에서 -0.25 dB이며, 반사손실은 -28.9 dB를 나타내었다. CPW phase shifter의 크기는 S-W-$S_g$ = 100-30-400 ${\mu}m$로 설계되었다. "ㄷ" 모양을 가진 에어브리지의 폭은 $100{\mu}m$. 길이는 400-460-400 ${\mu}m$이다. 낮은 손실을 얻기 위한 Step된 에어브리지를 가진 phase shifter 구조가 step이 없는 에어브리지를 가진 구조보다 삽입손실이 보다 더 향상되었다. 제작된 CPW phase shifter의 위상특성은 28 GHz의 넓은 주파수 범위에서 $180^{\circ}E 의 천이를 타나내었다. 이상과 같은 결과로부터 두꺼운 다공질 실리콘은 고 저항 실리콘 집적회로 공정에서 고성능 저가의 마이크로파 및 밀리미터파 회로 응용에 충분히 활용 될 수 있으리라 기대된다.

• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1908-1910
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• 2001

본 논문은 마이크로머시닝 기술을 이용하여 lift-off 공정으로 패턴닝 한 후 TMAH (Tetramethylammonium Hydroxide) 용액으로 $5{\sim}100{\mu}m$ 두께의 실리콘 다이어프램을 제작하였다. Pt/Ti 박막을 HF 전해질의 mask 물질로 사용하여 HF 용액 내에서 전기화학적 방법으로 정전압을 인가, 다이어프램 영역에 다공질 실리콘을 성장시켜 관통하였다. 140$^{\circ}C$의 질소 분위기에서 $10{\sim}15{\mu}m$두께의 LDPE(Low Density Poly Ethylene) 필름을 물리적으로 다이어프램 영역에 코팅하고 $K_2CO_3$ 용액내에서 ${CO_3}^{2-}$ 이온의 barrier에 의한 전류의 감소를 전기화학적인 분석방법에 의하여 측정하였다. 일정 전압하에서 이온 농도에 기인하는 다공질 실리콘과 LDPE 표면에서 Barrier의 두께에 따른 저항의 증가를 전극으로 감지하여 농도-전류의 특성을 측정하고 이것을 기준으로 하여 미지농도의 $K_2CO_3$ 용액내의 ${CO_3}^{2-}$ 이온 농도를 측정하였다.

• Proceedings of the KIEE Conference
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• 2002.11a
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• pp.77-78
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• 2002

본 논문은 Pt/Ti 박막을 HF-ethanol 혼합 용액에 대한 매스킹 물질과 오믹 전극으로 사용하였다. 다공질 실리콘 층에 정공과 전자의 주입을 용이하게 하기 위해 이온 주입 공정으로 애노드(anode)와 캐소드(cathode) 전극을 실리콘 다이어프램에 구성하였다. 실리콘 다이어프램 영역에 정전압을 인가하여, 전기화학적 방법으로 관통된 PSi 층을 다이어프램 영역에 성장시켰다. 또한, 제작된 소자를 UV에 대한 광 특성을 고찰하였다.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.40 no.5
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• pp.285-289
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• 2003

This paper proposes a 10 ${\mu}{\textrm}{m}$ thick oxide air-bridge structure which can be used as a substrate for RF circuits. The structure was fabricated by anodic reaction, complex oxidation and rnicrornachining technology using TMAH etching. High quality films were obtained by combining low temperature thermal oxidation (50$0^{\circ}C$, 1 hr at $H_2O$/O$_2$) and rapid thermal oxidation (RTO) process (105$0^{\circ}C$, 2 min). This structure is mechanically stable because of thick oxide layer up to 10 ${\mu}{\textrm}{m}$ and is expected to solve the problem of high dielectric loss of silicon substrate in RF region. The properties of the transmission line formed on the oxidized porous silicon (OPS) air-bridge were investigated and compared with those of the transmission line formed on the OPS layers. The insertion loss of coplanar waveguide (CPW) on OPS air-bridge was (about 1 dB) lower than that of CPW on OPS layers. Also, the return loss of CPW on OPS air-bridge was less than about - 20 dB at measured frequency region for 2.2 mm. Therefore, this technology is very promising for extending the use of CMOS circuitry to higher RF frequencies.