• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.133-133
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• 2004

박막이나 초미세 구조체의 경도 및 탄성계수 측정을 위한 나노 압입실험에서는 Oliver ＆ Pharr가 제안한 하중-변위 측정 나노압입법이 널리 쓰이고 있다 위 실험법에서, 나노경도(nano-hardness; H$_{n}$)는 최대하중을 계산된 접촉면적 (A$_{c}$)으로 나누어 평가하고, 압입자 및 박막의 탄성성질을 포함하는 환산 탄성계수 (reduced modulus ; E$_{r}$)는 하중제거곡선의 초기 기울기인 접촉탄성강성 (S)를 이용하여 계산한다. 그러나, 하중-변위 측정 나노압입법에서는 탄성 및 소성변형만이 고려되고 시간 의존적 변형거동 (time dependent deformation; TDD)은 고려되지 않는다.(중략)

• Transactions of the Korean Society of Mechanical Engineers B
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• v.36 no.2
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• pp.117-123
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• 2012

This paper discusses two different techniques used to measure the mechanical properties of thin films: the bulge test and the nanoindentation test. In the bulge test, a uniform pressure is applied to one side of the film. Measurement of the membrane deflection as a function of the applied pressure allows one to determine the mechanical properties such as Young's modulus, and the residual stress. A nanoindentation test is performed by pushing an indenter tip into the specimen and then withdrawing it, and then recording the indentation force as a function of the indenter position. A modified King's model is used to estimate the mechanical properties of the thin film in order to avoid the effects of the substrate layers. A combination of both the bulge test and the nanoindentation test can determine both Young's modulus and Poisson's ratio simultaneously.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.38-38
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• 2003

최근 나노기술의 발달과 더불어 나노재료에 대한 특성평가 요구가 높아지고 있고, 따라서 나노스케일로 재료의 기계적 거동을 분석할 수 있는 나노인덴테이션 기법이 심도있게 연구되고 있다. 본 연구에서는 나노인덴테이션을 이용하여 여러 가지 재료의 탄성 소성 변형 거동을 관찰 조사하고 이를 다시 유한요소법(FEM)으로 모사하여 해석하였다. 나노인덴테이션으로 재료 표면에 압입하여 탄소성 변형을 일으켰으며 이때의 가하중과 변형깊이를 측정하여 하중-변형 곡선을 얻었다. 매우 작은 접촉응력 조건하에서는 탄성변형의 비율이 매우 높았는데 하중-변형 곡선으로부터 재료의 나노 경도와 탄성 계수값을 얻을 수 있었다. 실험적으로 얻은 하중-변형 곡선을 3 차원의 유한요소법(FEM)을 이용하여 모사하였는데 상호간에 매우 근접한 결과를 얻을 수 있었다. 이 때 압자의 모양, 압입 깊이, 재료의 종류, 둥을 변수로 하여 여러 가지 조건하에서 압입실험을 하였으며 그 결과를 유한요소법으로 모사하였다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.244-244
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• 2003

나노인덴테이션은 시편에 압자를 침투시켜 재료의 기계적 특성을 파악할 수 있는 경도시험법이다. 압입범위를 나노미터범위로 조절할 수 있어 기존에 접근할 수 없었던 극 미소부분에로 응용이 넓어지고 있다. 경도시험시 재료의 탄성 및 소성 작용에 의해 재료는 변형되고, 표면변화 관찰을 통해 표면아래 부분에서 이루어지고 있는 거동을 예측할 수 있다. 이러한 관점에서 나노인덴테이션 시험시에도 발생하는 파일업과 싱크인 현상에서 재료가 나노미터 범위에서 어떠한 양상으로 변형을 하는지를 고찰하는 것은 의미가 있을 것이다. 본 연구에서 파일업과 싱크인의 양상을 파악하고 그 양을 정량화하기 위하여 가공경화양에 따른 표면변화와 압입하중 변화에 따른 표면변화를 관찰하였다. 어닐링한 봉상 알루미늄을 압축변형을 0%, 5%, 20%, 40%, 50% 로 변형시켜 가공경화를 일으켰고, 표면은 전해연마하여 나노압입시험이 가능하도록 하였다. 각각의 시편을 나노인덴테이션 압입하중을 변화시켜 재료에서 하중 변화에 따라 나타나는 표면변화를 관찰하였고, 위의 각 조건에서 파일업양을 정량화 하였다. 연구결과에 대해 ANSYS 유한요소분석 프로그램을 사용하여 재료의 변형양상을 시뮬레이션 하였고, 실제 실험데이터와 비교 분석하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.182-182
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• 2010

나노 소재의 물성을 측정하기 위하여 대부분의 연구 구룹에서는 크게 두 가지 분석 기법인 분광학을 이용한 분석과 나노트라이볼로지를 이용한 분석을 사용하고 있다. 분광학을 이용한 분석에는 NMR, IR, Raman, SEM, TEM 등이 대표적이라 할 수 있고, 나노트라이볼로지를 이용한 분석에는 AFM, EFM, KFM, Nano-indenter 등의 탐침을 이용한 측정 기법이 대표적이다. Nano-indenter는 물질의 탄성 및 경도를 측정 할 수 있으며 이를 통해 물질의 특성을 연구하는데에 사용된다. 그러나 이런 Nano-indenter의 압입 실험에서는 그 결과값이 압입 조건 등의 통제변수의 함수가 될 것이다. 이를 확인하고 변화값의 parameter를 추출하기 위하여 본 실험에서는 이런 압입 조건 중 Load - Hold - Unload force의 속도 및 시간을 변화시켜 물질의 탄성계수와 경도가 어떻게 변하는지에 대한 역학관계를 연구하였다.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.95-100
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• 2019

Nanoindentation has been widely used for evaluating mechanical properties of nano-devices, from MEMS to packaging modules. Residual stress is also estimated from indentation tests, especially the Knoop indenter which is used for the determination of residual stress directionality. According to previous researches, the ratio of the two stress conversion factors of Knoop indentation is a constant at approximately 0.34. However, the ratio is supported by insufficient quantitative analyses, and only a few experimental results with indentation depth variation. Hence, a barrier for in-field application exists. In this research, the ratio of two conversion factors with variation in indentation depth using finite elements method has been attempted at. The magnitudes of each conversion factors were computed at uniaxial stress state from the modelled theoretical Knoop indenter and specimen. A model to estimate two stress conversion factor of the long and short axis of Knoop indenter at various indentation depths is proposed and analyzed.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.83-88
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• 2020

The evolution of smartphones has led to numerous researches in the mechanical behavior of flexible devices. Due to the nano-size of the thin flexible film, nanoindentation is widely used to evaluate its mechanical behaviors, such as elastic modulus, and hardness. However, the commonly used Oliver-Pharr method is not suited for analyzing the indentation force-depth curves of hard films on soft substrates, as the effects of soft substrate is not considered theoretically. In this study, the elastic modulus of the thin film was evaluated with references to other reported models which include the substrate effect, and with calibration of the indentation depth for the pile-ups between the indenter and test surface. We fabricated test samples by deposition of amorphous metal film on polyimide and silicon wafers for verification of modified models.

• Journal of the Korean Vacuum Society
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• v.19 no.5
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• pp.360-364
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• 2010

Most research groups used two analysis methods (spectroscopy and nanotribology) to measure the mechanical properties of nano-materials: NMR (Nuclear Magnetic Resonance), IR (Infrared Spectroscopy), Raman Spectroscopy as the spectroscopy method and AFM (Atomic Force MicroScope), EFM (Electrostatic Force Microscope), KFM (Kelvin Force Microscope), Nanoindenter as the nanotribological one. Among these, the nano-indentation technique particularly has been recognized as a powerful method to measure the elastic modulus and the hardness. However, this technique are prone to considerable measurement errors with pressure conditions during measurement. In this paper, we measured the change of elastic modulus and hardness of an Al single crystal with the change of load, hold, and unload time, respectively. We found that elastic modulus and hardness significantly depend on load, hold, and unload time, etc. As the indent time was shortened, the elastic modulus value decreased while the hardness value increased. In addition, we found that elastic modulus value was more sensitive to indent load, hold, and unload time than the hardness value. We speculate that measurement errors of the elastic modulus and the hardness originate from the residual stress during indenting test. From our results, the elastic modulus was more susceptible to the residual stress than the hardness. Thus, we find that the residual stress should be controlled for the minimum measurement errors during the indenting test.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.05a
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• pp.273-276
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• 2008

Thermoplastic resin takes place stress relaxation and creep according to temperature and time. In room temperature, time dependent deformation (TDD) of polymer was carried out at previous study. In this study, it evaluates time dependent deformation to relate temperature. Nanoscale indents can be used as cells for molecular electronics and drug delivery, slots for integration into nanodevices, and defects for tailoring the structure and properties. Therefore, it is important to control pattern depth for change of indent depth by creep when using Nanoindenter. For evaluating TDD at high temperature, it is occurred thermal-nanoindentation test by changing hold time at maximum load. Temperature is putted at $90^{\circ}C$, hold time at maximum loads are putted at 1, 10, 50, 100, 200, 300 and 500s.

• Journal of the Korean Vacuum Society
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• v.22 no.5
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• pp.245-249
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• 2013

The $HfO_X$ thin film was deposited what it has been paid attention to the next generation oxide thin layer of MOSFET (metal-Oxide semiconductor field-effect-transistor) by rf magnetron sputter on Si (100) substrate. The $HfO_X$ thin film was deposited using a various oxygen gas flows (5, 10, 15 sccm). After deposition, $HfO_X$ thin films were annealed from 400 to $800^{\circ}C$ for 20 min in nitrogen ambient. The electrical characteristics of the $HfO_X$ thin film was improved by leakage current properties, depending on the increase of oxygen gas flow and annealing temperature. In particular, the properties of nano-mechanics of $HfO_X$ thin films were measured by AFM and Nano-indenter. From the results, the maximum indentation depth at the basis of maximum indentation force was increased from 24.9 to 38.8 nm according to increase the annealing temperature. Especially, the indentation depth was increased rapidly at $800^{\circ}C$. The rapid increasement of indentation depth was expected to be due to the change of residual stress in the $HfO_X$ thin film, and this result was caused by relative flux of oxygen outgasing during the annealing process.