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S. H. Kim, B. W. Lee, Y. Choi, and D. Kwon, "Quantitative determination of contact depth during spherical indentation of metallic materials - a FEM study", Materials Science and Engineering, 415, 59 (2006).
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S.-K. Kang, Y.-C. Kim, J.-W. Lee, D. Kwon, and J.-Y. Kim, "Effect of contact angle on contact morphology and Vickers hardness measurement in instrumented indentation testing", International Journal of Mechanical Sciences, 85, 104 (2014).
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J.-H. Kim, H.-J. Ahn, S.-W. Jeon, J. S. Lee, M.-J. Choi, K.-H. Kim, D. Ro, and D. Kwon, "Estimation of Stress-Free State From Hardness Ratio for Evaluation of Residual Stress Using Instrumented Indentation Testing (IIT)", ASME Pressure Vessels and Piping Conference, 5 (2015).
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4 |
S.-H. Lee, and J.-H. Lee, "Electroplating of High Wear Resistant Rhodium using Pulse Current Plating Method", J. Microelectron. Packag. Soc., 26(2), 51 (2019).
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5 |
S.-Y. Cheon, Y.-M. Rhym, and J.-H. Lee, "The Effects of Additives and Residual Stresses on the Electroless Nickel Plating on Carbon Substrate", J. Microelectron. Packag. Soc., 18(4), 43 (2011).
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6 |
C. Kim, H. Choi, M. Kim, and T.-S. Kim, "Packaging Substrate Bending Prediction due to Residual Stress", J. Microelectron. Packag. Soc., 20(1), 21 (2013).
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7 |
J.-Y. Choi, D.-W. Park, and T. S. Oh, "Variation of Elastic Stiffness of Polydimethylsiloxane (PDMS) Stretchable Substrates for Wearable Packaging Applications", J. Microelectron. Packag. Soc., 21(4), 125 (2014).
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8 |
N. E. Yeo, W. K. Cho, D.-I. Kim, and M. Y. Jeong, "A Study on Enhanced of Anti-scratch performance of Nanostructured Polymer Surface", J. Microelectron. Packag. Soc., 24(3), 41 (2017).
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9 |
J.-G. Seol, and B.-J. Kim, "Electrical Reliability of ITO Film on Flexible Substrate During bending Deformations and Bending Fatigue", J. Microelectron. Packag. Soc., 24(4), 47 (2017).
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10 |
Y. Y. Kwon, and B.-J. Kim, "Mechanical and Electrical Failure of ITO Film with Different Shape during Twisting Deformation", J. Microelectron. Packag. Soc., 24(4), 53 (2017).
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11 |
G. G. Stoney, "The Tension of Metallic Films Deposited by Electrolysis", Proceedings of the Royal Society of London. Series A, Containing Papers of a Mathematical and Physical Character, 172 (1909).
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I. C. Noyan, and J. B. Cohen, "Residual stress measurement by diffraction and interpretation", Materials Research and Engineering, Springer-Verlag New York Inc. (1987).
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S. Y. Baek, and D. H. Bae, "Fracture Mechanics Approach to X-Ray Diffraction Method for Spot Welded Lap Joint Structure of Rolled Steel Considered Residual Stress", The Korans Society of Mechanical Engineers, 35(11), 7 (2011).
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K.-H. Kim, "Evaluation of Multi-scale Indentation Tensile Properties of Metallic Materials Considering Strain Hardening Characteristics and Stress Field Analysis", in Ph.D. Thesis, Seoul National University, Seoul (2015).
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Y.-H. Lee, and D. Kwon, "Estimation of biaxial surface stress by instrumented indentation with sharp indenters", Acta Mater, 52, 1555 (2004).
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16 |
Y.-C. Kim, H.-J. Ahn, D. Kwon, and J.-Y. Kim, "Modeling and experimental verification for non-equibiaxial residual stress evaluated by Knoop indentations", Metals and Materials International, 22(1), 12 (2016).
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17 |
M.-J. Choi, S.-K. Kang, I. Kang, and D. Kwon, "Evaluation of nonequibiaxial residual stress using Knoop indenter", J. Mater. Res, 1, 121 (2012).
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