• Journal of Biomedical Engineering Research
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• v.24 no.2
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• pp.113-119
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• 2003

In this paper we introduced optimized deformed shape to prevent the blood vessel disease caused by the discord of deformed shape in the end-to-end anastomosis. This study considered the preliminary deformed shape induced by suture in the anastomosis of artery and PTFE, artificial blood vessel, with different diameters. Then we analyzed the final deformed shape of the anastomotic part under the systolic blood pressure. 120mmHg(16.0kPa). The final deformed shape of the anstomotic part was analyzed with respect to the change of initial diameter ratio(R$_{I}$) and the PTFE thickness. Equivalent and circumferential stresses induced by the systolic blood pressure in the anastomosis were also analyzed with respect to the initial diameter ratio(R$_{I}$). The results obtained were as follows : 1. Considering the preliminary deformed shape induced by suture and the systolic pressure in the anastomosis, not intimal hyperplasia, the optimal initial diameter ratio(R$_{I}$) was 1.073. 2. As the initial diameter ratio(R$_{I}$) became larger, higher equivalent and circumferential stresses were induced. And all the maximum stresses occurred on the side of PTFE 0.4mm apart from the anastomosis.

• Korean Journal of Materials Research
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• v.8 no.9
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• pp.807-812
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• 1998

Interfacial reaction and mechanical properties between Sn-Bi-X ternary alloys(X : 2Cu. 2Sb 5In) and Cu-substrate were studied. Cu/solder joints were subjected to aging treatments for up to 60days to see interfacial reaction at $100^{\circ}C$ and then were examined changes of microstructure and interfacial compound by optical microscopy, SEM and EDS. Cu/solder joints were aged to 30days and then loaded to failure at cross head speed of 0.3mm $\textrm{min}^{-1}$ to measure strength and elongation. According to the result of EDS, it is supposed that the soldered interfacial zone was composed of $\textrm{Cu}_{3}\textrm{Sn}$ and $\textrm{Cu}_{6}\textrm{Sn}_{5}$. According to the tensile test of Cu/solder joint, joint strength was decreased by aging treatment. Fractographs of Cu/Sn-Bi solder detailed the effect of aging on fracture behavior. When intermetallic was thin, the fracture occurred through the solder. But as the interfacial intermetallic is thickened, the fracture propagated along the intermetallic/solder interface.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.79-84
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• 2016

A flexible electronic device deformed by external force causes the failure of a semiconductor die. Even without failure, the repeated elastic deformation changes carrier mobility in the channel and increases resistivity in the interconnection, which causes malfunction of the integrated circuits. Therefore it is desirable that a semiconductor die be placed on a neutral line where the mechanical stress is zero. In the present study, we investigated the effects of design factors on the position of neutral line by finite element analysis (FEA), and expected the possible failure behavior in a flexible face-down packaging system assuming flip-chip bonding of a silicon die. The thickness and material of the flexible substrate and the thickness of a silicon die were considered as design factors. The thickness of a flexible substrate was the most important factor for controlling the position of the neutral line. A three-dimensional FEA result showed that the von Mises stress higher than yield stress would be applied to copper bumps between a silicon die and a flexible substrate. Finally, we suggested a designing strategy for reducing the stress of a silicon die and copper bumps of a flexible face-down packaging system.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.83-90
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• 2017

In this paper, we evaluated the solderability of thin electroless nickel-electroless palladium-immersion gold (ENEPIG) plating layer for fine-pitch package applications. Firstly, the wetting behavior, interfacial reactions, and mechanical reliability of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy on a thin ENEPIG coated substrate were evaluated. In the wetting test, maximum wetting force increased with increasing immersion time, and the wetting force remained a constant value after 5 s immersion time. In the initial soldering reaction, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) and P-rich Ni layer formed at the SAC305/ENEPIG interface. After a prolonged reaction, the P-rich Ni layer was destroyed, and $(Cu,Ni)_3Sn$ IMC formed underneath the destroyed P-rich Ni layer. In the high-speed shear test, the percentage of brittle fracture increased with increasing shear speed.

• Journal of Powder Materials
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• v.11 no.1
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• pp.8-15
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• 2004

The basic concept of functionally gradient materials (FGM) is to fabricate materials type having possibilities of applications in various fields by changing their intrinsic properties with continuous gradient. The present communication has reviewed the developments and applications of various FGMs designed for improved thermo-mechanical properties, in which the thermal protective and wear resistant materials are especially focused. Effects of thermo-mechanical properties and limits of FGMs designed for high temperature applications were mainly understood in terms of residual stress evolved from the design and fabrication. In addition, FGMs applied in structural parts were also introduced and discussed in terms of typical fabrication method for FGMs.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.53-57
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• 2013

Although the lowering of Ag content in Sn-3.0Ag-0.5Cu is known to improve the mechanical shock reliability of the solder joint, it is also known to be detrimental to the solderbility. In this study, the quaternary alloying effect of In and the minor alloying effects of Mn and Pd on the solderability, thermal cycling and mechanical shock reliabilities of the low Ag content Sn-1.2Ag-0.7Cu solder were investigated using board-level BGA packages. The solderability of Sn-1.2Ag-0.7Cu-0.4In was proved to be comparable to that of Sn-3.0Ag-0.5Cu but its thermal cycling reliability was inferior to that of Sn-3.0Ag-0.5Cu. While the 0.03 wt% Pd addition to the Sn-1.2Ag-0.7Cu-0.4In decreased the solderability and reliabilities of solder joint, the 0.1 wt% Mn addition was proved to be beneficial especially for the mechanical shock reliability compared to those of Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.5Cu compositions. It was considered to be due that the Mn addition decreased the Young's modulus of low Ag content Pb-free solders.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.4
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• pp.57-64
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• 2012

Ball shear test was performed by test variables such as loading speed and annealing time in order to investigate the effect of surface finishes on the bonding strength of Sn-1.2Ag-0.7Cu-0.4In Pb-free solder. The shear strength increased and the ductility decreased with increasing shear speed. With increasing shear speed, the electroless nickel immersion gold (ENIG) finish showed dominant brittle fracture mode, while organic solderability preservative (OSP) finish showed pad open fracture mode. The shear strength and toughness for both surface finishes decreased with increasing annealing time under the high-speed shear test of 500 mm/s. Typically, the thickness of intermetallic compound increased with increasing annealing time, which means that exposure of brittle fracture became much easier. With increasing annealing time, the both ENIG and OSP finishes exhibited the pad open fracture mode. Overall, ENIG finish showed higher shear strength rather than OSP finish due to its superior barrier stability.

• Journal of Welding and Joining
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• v.9 no.4
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• pp.60-68
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• 1991

The weld quality of end cap welds in Pressurized Heavy Water Reactor (PHWR) Fuel is extremely important for the fuel performance in the nuclear reactor. The quality of resistance upset welds is currently evaluated mainly by the metallographic examination although it reveals only two weld cross-sections in a circumference welds. This investigation was, firstly, carried out to determine whether the ultrasonic examination would be applied to detect weld defects in the end cap welds and, secondly, to measure the mechanical strength of upset butt welds as a function of phase shift percentage. The major results obtained in this study are as follows: 1. The weld current and amount of upset shrinkage linearly increased with increasing the phase shift percentage. 2. Above the phase shift 55%, the defects in the welds were completely eliminated with increasing the phase of sound weld was over the thickness of cladding tube. 3. The ultrasonic testing well detected such defects in the end cap welds as upset external crack, upset split, corner crack and irregular weld flash comparing with the results of metallography. 4. The micro-fissure in the corner of the end cap welds was reliably detected by ultrasonic testing. 5. The mechanical strength in the welds increased with increasing phase shift percentage but the fracture did't occur in the welds above 55%.

• Magazine of the Korea Concrete Institute
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• v.7 no.2
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• pp.165-174
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• 1995

It is well known that the behavior of R /C members under static cyclic loading is somewhat different from that under dynamic cyclic loading, such as earthquake loading, because static loading rate is substantially lower than that corresponding to the Frequencies of seismic excitation. The purpose of this research is to estabilish the reliance for modeling techniques of small-scale specirr~ens subjected to dynamic cyclic loading. This research focused on the similitude requirements for reinforced concrete frame structures subjeced to dynamic cyclic loading. Length scale ratio of specimens were 1 : 2 : 4, and eleven specimens were tested at the frequencies of 0.0025Hz-2.OHz. It was confirmed that rnode1ir.g techniques based on the similitude requirements were useful methods to evaluate the behavior of full-size R /C structures subjected to earthquake type loading.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.3
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• pp.324-328
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• 2019

There are several dedicated individual chambers for sports that are supplied and used, but none of them are multi-pressured all-in-one chambers that can provide a sport-multi environment simultaneously. In this study, we design a multi-pressure (positive / atmospheric / negative pressure) integrated chamber that can be used for the sport-multi-artificial environment system. We presented new chamber designs with enlarged space for the tall users and then carried out structural analysis with maximum stress and structural safety. Under the targeted allowable pressure conditions, maximum stresses occurred at the joint of the shell and the entrance, the structural safety of the chamber was evaluated with the allowable stress of its material. As a result of the structural analysis of the multi-pressure integrated chamber, the maximum stress for the positive pressure and negative pressure conditions was much smaller than the allowable stress of its material. And as a result of the structural safety evaluation, it was confirmed that the design of the final prototype for the chamber was structurally safe by satisfying the safety factor of 2 or more.