• Journal of the Microelectronics and Packaging Society
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• v.18 no.1
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• pp.15-21
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• 2011

In this study, flexural strength and fracture behavior of silicon die from single crystalline silicon wafer were investigated as a function of thickness. Silicon wafers with various thickness of 300, 200, 180, 160, 150, and 100 ${\mu}m$ were prepared by mechanical grinding and polishing of as-saw wafers. Flexural strength of 40 silicon dies (size: 62.5 mm${\times}$4 mm) from each wafer was measured by four point bending test, respectively. For statistical analysis of flexural strength, shape factor(i.e., Weibull modulus) and scale factor were determined from Weibull plot. Flexural strength reflecting both statistical fracture probability and size (thickness) effect of brittle silicon die was obtained as a linear function of die thickness. Fracture appearance was discussed in relation with measured fracture strength.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.3
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• pp.63-67
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• 2016

In this paper, we present an indirect method of elastic modulus measurement for various lamination layers formed on polymer-based compliant substrates. Although the elastic modulus of every component is crucial for mechanically reliable microelectronic devices, it is difficult to accurately measure the film properties because the lamination layers are hardly detached from the substrate. In order to resolve the problem, 3-point bending test is conducted with a film-substrate specimen and area transformation rule is applied to the cross-sectional area of the film region. With known substrate modulus, a modulus ratio between the film and the substrate is calculated using bending stiffness of the multilayered specimen obtained from the 3-point bending test. This method is verified using electroplated copper specimens with two types of film-substrate structure; double-sided film and single sided film. Also, common dielectric layers, prepreg (PPG) and dry film solder resist (DF SR), are measured with the double-sided specimen type. The results of copper (110.3 GPa), PPG (22.3 GPa), DF SR (5.0 GPa) were measured with high precision.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.3
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• pp.21-29
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• 2016

In this paper, we developed a flexible transparent capacitive pressure sensor which can recognize X and Y coordinates and the size of force simultaneously by sensing a change in electrical capacitance. The flexible transparent capacitive pressure sensor was composed of 3 layers which were top electrode, pressure sensing layer, and bottom electrode. Silver nanowire(Ag NW)/poly(3,4-ethylenedioxythiophene): poly(styrenesulfonate) (PEDOT:PSS) hybrid film was used for top and bottom flexible transparent electrode. The fabricated capacitive pressure sensor had a total size of 5 inch, and was composed of 11 driving line and 19 sensing line channels. The electrical, optical properties of the Ag NW/PEDOT:PSS and capacitive pressure sensor were investigated respectively. The mechanical flexibility was also investigated by bending tests. Ag NW/PEDOT:PSS exhibited the sheet resistance of $44.1{\Omega}/square$, transmittance of 91.1%, and haze of 1.35%. Notably, the Ag NW/PEDOT:PSS hybrid electrode had a constant resistance change within a bending radius of 3 mm. The bending fatigue tests showed that the Ag NW/PEDOT:PSS could withstand 200,000 bending cycles which indicated the superior flexibility and durability of the hybrid electrode. The flexible transparent capacitive pressure sensor showed the transmittance of 84.1%, and haze of 3.56%. When the capacitive pressure sensor was pressed with the multiple 2 mm-diameter tips, it can well detect the force depending on the applied pressure. This indicated that the capacitive pressure sensor is a promising scheme for next generation flexible transparent touch screens which can provide multi-tasking capabilities through simultaneous multi-touch and multi-force sensing.

• Transactions of the Korean Society of Mechanical Engineers
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• v.11 no.2
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• pp.191-197
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• 1987

It has been well known that the fracture mechanics can be applied to large through crack growth. But the growth rate of small surface cracks initiated from a small defect under rotary bending fatigue tests can not be treated as a function of stress intensity factor range. In this paper, to investigate the growth behavior of surface small fatigue cracks in the view-point of both fracture mechanics and strength of materials, the fatigue test has been carried out on two kinds of plain carbon steels with a small surface defect. Applying the concept of the cyclic strain intensity factor range .DELTA. $K_{\epsilon}$/$_{t}$ to the analysis of small surface fatigue crack growth, it is found that the relationship between cyclic strain intensity factor range and crack growth rate shows linear relation on logarithmic coordinates regardless of defect sizes and two kinds of carbon steels.s.s.

• Journal of IKEEE
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• v.21 no.4
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• pp.404-407
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• 2017

We investigated the microstructure, electrical and optical characteristics of ZnO, AZO and ITO films using aerosol deposition process. As gas consumption increased, the electrical and optical characteristics of ZnO, AZO and ITO films were improved, and electrical and optical characteristics of ZnO, AZO and ITO films with a thickness of 400 nm were successfully fabricated on PET substrates at room temperature. The mechanical flexibility durability test shows that the ZnO films can withstand 5,000 cycles and AZO and ITO films occurs to crack in films with degradation of resistance and transmittance. Even though the AZO and ITO films shows slightly lower durability than the ZnO films, this is expected to improve performance of films through optimized processing condition and particle size control.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.77-81
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• 2020

Commercialization of flexible OLED displays, such as rollable and foldable displays, has attracted tremendous interest in next-generation display markets. However, during bending deformation, cracking and delamination of thin films in the flexible display panels are the critical bottleneck for the commercialization. Therefore, measuring mechanical properties of the fragile thin films in the flexible display panels is essential to prevent mechanical failures of the devices. In this study, tensile properties of the metal and ceramic nano-thin films were quantitatively measured by using a direct tensile testing method on the water surface. Elastic modulus, tensile strength, and elongation of the sputtered Mo, MoTi thin films, and PECVD deposited SiN_x thin films were successfully measured. As a result, the tensile properties were varied depending on the deposition conditions and the film thickness. The measured tensile property values can be applied to stress analysis modeling for mechanically robust flexible displays.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.41 no.8
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• pp.721-728
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• 2017

High-grade gray cast iron (HCI350) was prepared by adding Cr, Mo and Cu to the gray cast iron (GC300). Their microstructure, mechanical properties and fatigue strength were studied. Cast iron was made from round bar and plate-type castings, and was cut and polished to measure the percentage of each microstructure. The size of flake graphite decreased due to additives, while the structure of high density pearlite increased in volume percentage improving the tensile strength and fatigue strength. Based on the fatigue life data obtained from the fatigue test results, the probability - stress - life (P-S-N) curve was calculated using the 2-parameter Weibull distribution to which the maximum likelihood method was applied. The P-S-N curve showed that the fatigue strength of HCI350 was significantly improved and the dispersion of life data was lower than that of GC300. However, the fatigue life according to fatigue stress alleviation increased further. Data for reliability life design was presented by quantitatively showing the allowable stress value for the required life cycle number using the calculated P-S-N curve.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.41 no.5
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• pp.337-343
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• 2017

As a shop practice, a strength estimation method for die cast parts is suggested, in which various defects such as pores can be allowed. The equivalent porosity is evaluated by combining the stiffness data from a simple elastic test at the part level during the shop practice and the theoretical stiffness data, which are defect free. A porosity equation is derived from Eshelby's inclusion theory. Then, using the Mori-Tanaka method, the porosity value is used to draw a stress-strain curve for the porous material. In this paper, the Hollomon equation is used to capture the strain hardening effect. This stress-strain curve can be used to estimate the strength of a die cast part with porous defects. An elastoplastic theoretical solution is derived for the three-point bending of a die cast beam by using the plastic hinge method as a reference solution for a part with porous defects.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.40 no.8
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• pp.693-701
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• 2016

In this study, notch defects are evaluated using fracture mechanics. To understand the effects of notch defects, FE analysis is conducted to predict the limit load and J-integral for middle-cracked and single-edge cracked plates with various sizes of notch under tension and bending. As the radius of the notch increases, the energy release rate also increases, although the limit load remains constant. The values of fracture toughness($J_{IC}$) of SM490A are determined for various notch radii through FE simulation instead of conducting an experiment. As the radius of the notch increases, the energy release rate also increases, together with a more significant increase in fracture toughness. To conclude, as the notch radius increases, the resistance to crack propagation also increases.

• Composites Research
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• v.36 no.3
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• pp.154-161
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• 2023

This study explored the feasibility of replacing a metal link with a carbon fiber/epoxy composite link and assessed its capacity to withstand a given load condition using failure criteria. The micromechanics of failure (MMF) criterion was employed to predict the failure mode of the composite material, and mechanical tests were conducted to obtain reference strength parameters for MMF. The findings revealed that the stress distribution was concentrated near the hole, and weaknesses were found around the hole and at the end of the link under bending conditions. Based on the failure index, matrix tensile failure was predicted at the end of the link, and fiber compression failure occurred near the hole. The methods and results obtained from this study can provide valuable guidelines for assessing the safety of composite materials under specific load conditions when replacing metal parts with carbon fiber/epoxy composites to achieve weight reduction.