• The Journal of Korean Academy of Prosthodontics
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• v.50 no.3
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• pp.169-175
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• 2012

Purpose: In this study, brazing characteristics of $ZrO_2$ and Ti-6Al-4V brazed joints with increasing temperature were investigated. Materials and methods: The sample size of the $ZrO_2$ was $3mm{\times}3mm{\times}3mm$ (thickness), and Ti-6Al-4V was $10mm(diameter){\times}5mm(thickness)$. The filler metal consisted of Ag-Cu-Sn-Ti was prepared in powder form. The brazing sample was heated in a vacuum furnace under $5{\times}10^{-6}$ torr atmosphere, while the brazing temperature was changed from 700 to $800^{\circ}C$ for 30 min. Results: The experimental results shows that brazed joint of $ZrO_2$ and Ti-6Al-4V occurred at $700-800^{\circ}C$. Brazed joint consisted of Ag-rich matrix and Cu-rich phase. A Cu-Ti intermetallic compounds and a Ti-Sn-Cu-Ag alloy were produced along the Ti-6Al-4V bonded interface. Thickness of the reacted layer along the Ti-6Al-4V bonded interface was increased with brazing temperature. Defect ratios of $ZrO_2$ and Ti-6Al-4V bonded interfaces decreased with brazing temperature. Conclusion: Thickness and defect ratio of brazed joints were decreased with increasing temperature. Zirconia was not wetting with filler metal, because the reaction between $ZrO_2$ and Ti did not occur enough.

• Journal of the Korean Chemical Society
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• v.51 no.3
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• pp.265-269
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• 2007

A comparative study on crystal structures and UV-visible diffuse reflectance spectra for Nb-containing oxyfluorides was performed to probe the relationship between energy band gap and local structure. The oxyfluorides, RbSrNb2O6F, RbCaNb2O6F and RbNb2O5F are commonly composed of the corner-sharing NbO5F octahedra as structural building units. The average Nb-O(F)-Nb bond angles, which can be a measure of the structural distortion, are 158.6° for RbSrNb2O6F, 149.6° for RbCaNb2O6F and 139.5° for RbNb2O5F. As the bond angle decreases, the band gap increases: 3.48eV for RbSrNb2O6F, 3.75eV for RbCaNb2O6F and 4.03 eV for RbNb2O5F. This experimental result implies that the band gap can be controlled with a range of 0.6 eV through a variation of local structure for the Nb-containing oxyfluorides.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.3
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• pp.27-33
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• 2008

With increasing use of portable appliances such as PDA and cellular phone, changing environment of applications requires higher solder joint reliability. The ENIG (Electroless Nickel Immersion Gold) process has been widely used for fine pitch SMT (Surface Mount Technology) and BGA (Ball Grid Array) packaged devices due to its benefits including excellent solderability, high uniformity and substantial legibility throughout the packaging process. Its brittle fracture of solder, however, has received increasingly attentions. It was Down that fracture brittleness is mainly related with black pad resulting from galvanic nickel corrosion and P-enriched layer formation between the IMC (Intermetallic Compounds) and electroless nickel layer. Theoretically, smooth electroless Ni layer was blown to have a advantages in minimizing the black pad phenomenon by uniform solution exchange during immersion gold plating. Nevertheless, how to control the surface morphology of electroless Ni layer has been hardly blown. This study investigates an effect of surface morphology of Cu underlayer on surface morphology of electroless Ni layer. To obtain various kinds of surface morphology of Cu layer, two types of Cu etching chemical and a number of Cu etching treatment were applied.

• Journal of Soil and Groundwater Environment
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• v.9 no.2
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• pp.20-27
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• 2004

Kinetic characteristics dependent on several factors such as iron mineral and organic solvents were investigated. When F $e^{0}$ , FeS and Fe $S_2$ were used as mediators, minerals affecting reaction rate were in the following order : $Fe_{0}$ 0/ ＞ FeS ＞ $FeS_2$ when in contact $C_2$C $l_{6}$ . The more chloride substituted, the higher reaction rate were observed. The reaction rates were dependent on pH, shaking rate, temperature and specific surface area. 1, 10-phenanthroline and EDTA degradation rates were fast, indicating that they adsorbed on the surface of the iron which makes the electron transfer reaction easy. Nitrate which has $\pi$＊ orbital of molecular can increase electron transfer rate because it is delocalized in its entity. The reaction rates were not affected by hydroquinone. Degradation rates were much enhanced with naturally occurring kaolinite because of the surface corrosion of Fe mineral. However, The reaction rate was not affected by F $e^{2+}$ or S $O_4$$^{2-}$ presented in solution.n.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.49-55
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• 2011

The failure of electronic instruments is mostly caused by heat and shock. This shock causes the crack initiation at the solder joint interface of PCB component which is closely related with the formation of intermetallic compound(IMC). The Ag content in Pb-free Sn-xAg-0.5Cu solder alloy used in this study was 1.0, 1.2 and 3.0 wt.%, respectively. After soldering with PCB component, isothermal aging was performed to 1000 hrs. The growth of IMC layer was observed during isothermal aging. The drop impact property of solder joint was evaluated by impact bending test method. The solder joint made with the solder containing lower Ag content showed better impact bending property compared with that with higher Ag content. On the contrary to this result, the solder joint made with solder containing higher Ag content showed better impact bending property after aging. It should be caused by the formation of fine $Ag_3Sn$, which relieved the impact. It showed consequently the different effect of fine $Ag_3Sn$ and coarse $Cu_6Sn_5$ particles formed in the IMC layer on the impact bending property.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.4
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• pp.57-64
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• 2012

Ball shear test was performed by test variables such as loading speed and annealing time in order to investigate the effect of surface finishes on the bonding strength of Sn-1.2Ag-0.7Cu-0.4In Pb-free solder. The shear strength increased and the ductility decreased with increasing shear speed. With increasing shear speed, the electroless nickel immersion gold (ENIG) finish showed dominant brittle fracture mode, while organic solderability preservative (OSP) finish showed pad open fracture mode. The shear strength and toughness for both surface finishes decreased with increasing annealing time under the high-speed shear test of 500 mm/s. Typically, the thickness of intermetallic compound increased with increasing annealing time, which means that exposure of brittle fracture became much easier. With increasing annealing time, the both ENIG and OSP finishes exhibited the pad open fracture mode. Overall, ENIG finish showed higher shear strength rather than OSP finish due to its superior barrier stability.

• Korean Chemical Engineering Research
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• v.49 no.2
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• pp.161-167
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• 2011

Recent popularity in mobile electronics requires higher standard on the mechanical strength of electronic packaging. Thus, the method of soldering between chip and substrate in electronic packaging process is changing from conventional method using intermetallic compound to a new method using organic solderability preservatives (OSP) in order to improve the stability and the reliability of final product. Since current OSPs have several serious problems like thermo-stability during packaging process, however, it is necessary to develop new OSPs having thermo-stability. The main purpose of this study is to develop various thermo-stable OSPs based upon poly(vinyl pyridine-co- methylmethacrylate) and to evaluate their anti-oxidation property protecting Cu pad, thermo-stability and solubility to acid- or alcohol-containing aqueous solution during pos-fluxing. All OSPs showed not only good anti-oxidation property, thermo-stability and solubility but also more advantages like low cost, less odor, and less hygroscopic.

• Journal of Hydrogen and New Energy
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• v.8 no.3
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• pp.121-129
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• 1997

$ZrV_{0.1}Mn_{0.7}Ni_{1.2}$ alloy ingot (bulk alloy) made by the arc melting was found to be consisting of mostly of $ZrV_{0.2}Mn_{0.98}Ni_{1.04}$ matrix alloy and $ZrV_{0.01}Mn_{0.13}Ni_{1.2}$ 2nd phase alloy. The former alloy had the form of the C15 type Laves alloy structure and the latter one had the intermetallic compound structure of $Zr_9Ni_{11}$. In order to investigate the effect of these two phases on the electrochemical charge-discharge characteristics of bulk $ZrV_[0.1}Mn_0.7}Ni_{1.2}$ alloy, the matrix and the 2nd phase alloys were fabricated separately by arc melting method and their electrochemical characteristics were studied and compared with the bulk alloy. It was found that the discharge capacity was the lowest of 160 mAh/g in the 2nd phase alloy. The matrix alloy exhibited 200 mAh/g. Both were lower than that of the bulk alloy of 250 mAh/g. The matrix and the bulk alloys showed a similar properties in the activation stage, the high rate dischargeability and the self discharge characteristics. Also a signigicant capacity decrease was observed after activation in both alloys. Whereas the 2nd phase alloy showed the very different characteristics. This alloy was found to be difficult to activate. However the capacity was remained constant after the activation. Also the self discharge rate was seen to be better than those of the matrix and the bulk alloys.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.1 s.38
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• pp.23-29
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• 2006

Ultrasonic soldering of Si-wafer to FR-4 PCB at ambient temperature was investigated. The UBM of Si-substrate was Cu/ Ni/ Al from top to bottom with thickness of $0.4{\mu}m,\;0.4{\mu}m$, and $0.3{\mu}m$ respectively. The pad on FR-4 PCB comprised of Au/ Ni/ Cu from top to bottom with thickness of $0.05{\mu}m,\;5{\mu}m$, and $18{\mu}m$ respectively. Sn-3.5wt%Ag foil rolled to $100{\mu}m$ was used for solder. The ultrasonic soldering time was varied from 0.5 s to 3.0 s and the ultrasonic power was 1,400 W. The experimental results show that a reliable bond by ultrasonic soldering at ambient temperature was obtained. The shear strength increased with soldering time up to a maximum of 65 N at 2.5 s. The strength decreased to 34 N at 3.0 s because cracks were generated along the intermetallic compound between Si-wafer and Sn-3.5wt%Ag solder. The Intermetallic compound produced by ultrasonic soldering between the Si-wafer and the solder was $(Cu,Ni)_{6}Sn_{5}$.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.289-299
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• 2005

The ball shear force was investigated in terms of test parameters, i.e. displacement rate and probe height, with an experimental and non-linear finite element analysis for evaluation of the solder joint integrity in area array packages. The increase in the displacement rate and the decrease in the probe height led to the increase in the shear force. Excessive probe height could cause some detrimental effects on the test results such as unexpected high standard deviation and probe sliding from the solder ball surface. The low shear height conditions were favorable for assessing the mechanical integrity of the solder joints. The mechanical and electrical properties of the Sn-37Pb/Cu and Sn-3.5Ag/Cu BGA solder joints were also investigated with the number of reflows. The total thickness of the intermetallic compound (IMC) layers, consisting of Cu6Sn5 and Cu3Sn, was increased as a function of cubic root of reflow time. The shear force was increased up to 3 or 4 reflows, and then was decreased with the number of reflows. The fracture occurred along the bulk solder, in irrespective of the number of reflows. The electrical resistivity was increased with increasing the number of reflows.