• Journal of Life Science
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• v.26 no.11
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• pp.1308-1312
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• 2016

Heavy metals such as gallium (Ga) cause serious physiological damage to exposed organisms, mostly of aquatic species. Ga one of the inter-metallic, transition elements increasingly being used in making high-speed semiconductors, such as Ga arsenide. The purposes of this study were to investigate the effects of Ga on acute toxicity, serum biochemical changes, and erythrocyte morphological changes in the blood stream of goldfish (Carassius auratus). Median lethal concentrations were determined in acute tests. The 96 hr $LC_{50}$ value was 9.15 mg/ml. Goldfish were exposed to different Ga concentrations (2.0, 4.0, and 8.0 mg/ml) for 30 days to assess its toxic effects. The results indicate that the measured serum biochemistry parameters (including glucose, blood urea nitrogen, creatinine, cholesterol, and triglyceride) of the Ga-exposed fish groups differed significantly from the untreated fish group. In addition, a change in the erythrocytes' morphology at a high concentration (8.0 mg/ml) of Ga exposure shows respiratory problems. Our results suggest that 2.0 mg/ml is proposed as a biologically safe concentration that can be used for establishing tentative water quality criteria concerning the same-size goldfish.

• Korean Journal of Materials Research
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• v.4 no.6
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• pp.669-680
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• 1994

Oxidation behaviour of TiAl intermetallic compounds with the addition of Cr, V, Si, Mo, or Nb was investigated at 900~$1100^{\circ}C$ under the atmospheric environment. The reaction products were examined by XRD, SEM equipped with WDX. The weight gain by continuous oxidation increased with the addition of Cr or V, but there was less weight gain when Mo, Si or Nb was added individually. he oxidation rate of Cr- or V-added TiAl was always larger than that of TiAI. However, oxidation rate of Si-, Mo- or Nb-added TiAl was almost same or smaller than that of TiAI. Thus, it is concluded that the addition of Cr or V did not improve the oxidation resistance, whereas the addition of Si, Mo or Nb improved the oxidation resistance. Oxides formed on TiAl with Mo, Si, and Nb were found to be more protective, resulting from the decrease in diffusion rate of the alloying elements and oxygen. Nb strengthened the tendency to form $AI_{2}O_{3}$ in the early stage of oxidation, due to the continuous $AI_{2}O_{3}$ layer formation and dense $Tio_{2}+AI_{2}O_{3}$ layer. According to the Pt-marker test of TiAI- 5wt%Nb, oxygen diffused mainly inward while oxides were formed on the substrate surface. Upon thermal cyclic oxidation at $900^{\circ}C$, it is shown that the addition of Cr or Nb improved the adherence of oxide scale to the substrate.

• Korean Journal of Materials Research
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• v.10 no.6
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• pp.403-408
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• 2000

The Al-Cr-Zr composite metal powders were prepared by mechanical alloying and consolidated by vacuum hot pressing. The microstructural characteristics and the thermal stability of the MA Al-Cr-Zr alloys were evaluated by means of microhardness measurement, XRD and TEM in order to develop high temperature, high strength aluminum alloys. The mechanical alloying was conducted in attritor with 300rpm for 20 hours. The density of the vacuum hot pressed Al-Cr-Zr alloy reached at 97% of theoretical one. After exposing at $300^{\circ}C$ for 100 hours, there is almost no variation in hardness change of the MA alloys. Even after exposing at $ 500^{\circ}C$ for 100 hours, the hardness of the alloy was decreased within 6% of the initial value. The fine stable $Al_3Zr\;and\; Al_{13}Cr_2$ intermetallics were formed at the stage of consolidation and heat treatment in aluminum matrix. The good thermal stability of the MA Al-Cr-Zr alloy can ab attributed to the role of the dispersoids, inhibiting grain growth of nanocrystalline, and the final grain size after heat treatment was less than 150nm.

• Journal of Hydrogen and New Energy
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• v.9 no.4
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• pp.161-167
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• 1998

It has been investigated the effects of alloying elements and binders on the corrosion behavior of metal hydride electrodes for anode of Ni/MH secondary battery. The $AB_5$-type alloys, $(LM)Ni_{4.49}Co_{0.1}Mn_{0.205}Al_{0.205}$ and $(LM)Ni_{3.6}Co_{0.7}Mn_{0.3}Al_{0.4}$, were used for the experiments. The electrodes were prepared by mixing and cold-pressing of alloy powders with Si sealent or PTFE powders, or cold-pressing the electroless copper coated alloy powders. The amount of copper coating was 20wt%. In order to examine corrosion behavior of the electrodes, the corrosion current and the current density, in 6M KOH aqueous solution after removal of oxygen in the solution, were measured by potentiodynamic and cyclic voltamo methods. The results showed that Co in the alloy increased corrosion resistance of the electrode whereas Ni decreased the stability of the electrode during the charge-discharge cycles. The electrode used Si sealant as a binder showed a lower corrosion current density than the electrode used PTFE and the electrode used Cu-coated alloy powders showed the best corrosion resistance.

• Resources Recycling
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• v.33 no.4
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• pp.36-46
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• 2024

We investigated a hydrometallurgical process of nickel recovery from Inconel 713C scrap. The process proceeded with a series of i) comminution of pyrometallurgical treated scrap, ii) sulfuric acid leaching, iii) solvent extraction of unreacted acid, molybdenum, aluminum, and precipitation of chromium, iv) crystallization of nickel sulfate by vacuum evaporation, and v) nickel electrowinning. The nickel-aluminum intermetallic compound, Ni₂Al₃, was formed by the pyrometallurgical pretreatment readily grounded under 75 ㎛. Sulfuric acid leaching was done for 2 hours in 2 mol/L, 20 g/L solid/liquid ratio, and 80 ℃. It revealed that over 98 % of nickel and aluminum was dissolved, whereas 28 % of molybdenum was. A nickel sulfate solution with 2.34 g/L for the crystallization of nickel sulfate hydrate was prepared via solvent extraction and precipitation. Over 99 % of molybdenum and aluminum and 93 % of chromium was removed. Nickel metal with 99.9 % purity was obtained by electrowinning with the nickel sulfate monohydrate in the cell equipped with anion exchange membranes for catholyte pH control. The membrane did not work well, resulting in a low current efficiency of 73.3 %.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.8 no.1
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• pp.9-17
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• 2010

The LCC (Liquid Cadmium Cathode) structure to be developed for inhibiting the formation and growth of the uranium dendrite has been known as a key part in the electrowinning process for the simultaneous recovering of uranium and TRU (TRans Uranium) elements from spent fuels. A zinc-gallium (Zn-Ga) experimental system which is able to be functional in aqueous condition and normal temperature has been set up to observe the formation and growth phenomena of the metal dendrites on liquid cathode. The growth of the zinc dendrites on the gallium cathode and the performance of the existing stirrer type and pounder type cathode structure were observed. Although the mechanical strength of the dendrites appeared to be weak in the electrolyte and easily crashed by the various cathode structures, it was difficult to effectively submerge the dendrite into the bottom of the liquid cathode. Based on the results of the aqueous phase experiments, a lab-scale electrowinning experimental apparatus which are applicable to the development of LCC srtucture for the electrowinning process was established and the performance tests of the different types of LCC structure were conducted to prohibit the uranium dendrite growth on LCC surface. The experimental results of the stirrer type LCC structures have shown that they could not effectively remove the uranium dendrites growing at the inner side of the LCC crucible and the performances of the paddle and harrow type LCC structure were similar. Therefore a mesh type LCC structure was developed to push down the uranium dendrites to the bottom of the LCC crucible growing on the LCC surface and at the inner side of the crucible. From the experimental results for the performance test of the mesh type LCC structure, the uranium was recovered over 5 wt% in cadmium without the growth of uranium dendrites. After completion of the experiments, solid precipitates of the bottom of the LCC crucible were identified as an intermetallic compound (UCd11) by the chemical analysis.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.51-56
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• 2015

It has been used various pad finish materials to enhance the reliability of solder joint and recently Electroless Ni Electroless Pd Immersion Gold (the following : ENEPIG) pad has been used more than others. This study is about reliability according to being used in commercial Electrolytic Ni pad and ENEPIG pad, and was observed behavior of various Cu contents. After reflow, the inter-metallic compound (IMC) between solder and pad is composed of $Cu_6Sn_5$ (Ni substituted) by using EDS, and in case of ENEPIG, between IMC and Ni layer was observed the dark layer ($Ni_3P$ layer). Additional, it could be controlled the thickness of dark layer according to Cu contents. Investigated the different fracture mode between electrolytic Ni and ENEPIG pad after drop shock test, in case of soft Ni, accelerated stress propagated along the interface between $1^{st}$ IMC and $2^{nd}$ IMC, and in case of ENEPIG pad, accelerated stress propagated along the weaken surface such as dark layer. The unstable interface exists through IMC, pad material and solder bulk by the lattice mismatch, so that the thermal and physical stress due to the continuous exterior impact is transferred to the IMC interface. Therefore, it is strongly requested to control solder morphology, IMC shape and thickness to improve the solder reliability.

• Korean Chemical Engineering Research
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• v.46 no.2
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• pp.402-407
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• 2008

Recent popularity in mobile electronics requires higher standard on the mechanical strength of electronic packaging. Thus, the method of soldering between chip and substrate in electronic packaging process is changing from conventional method using intermetallic compound to a new method using organic solderability preservative (OSP) in order to improve the stability and the reliability of final product. Since current organic solder preservatives have several serious problems like thermo-stability during packaging process, however, it is necessary to develop new OSPs having thermo-stability. The main purpose of this study is to investigate the effect of MeOH/IPA (Isopropyl alcohol) ratio on the fluxing of a new OSP, developed in previous research, andto find out an optimum formulation of flux components for the application of the OSP in current packaging process. As a result of this study, it was revealed that higher MeOH/IPA ratio in flux showed better performance of fluxing a new OSP.

• Journal of Conservation Science
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• v.33 no.4
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• pp.297-312
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• 2017

In the ancient iron-making process, a slag former was often added so that iron and other minerals in the ore could be smoothly separated. However, there are insufficient data for judging whether a slag former was added. Thus, in this study, we conducted a smelting experiment to understand the material characteristics of a steel structure that differed depending on the addition of a slag former. It was found that the steel structure produced in the first experiment had a total Fe content of 39.45-52.94 wt%, which decreased to 34.89-38.92 wt% in the second and third experiments. CaO compounds such as calcite, gehlenite, and hercynite appeared, in addition to iron oxides, after the addition of a slag former. As a result of an assessment of whether a slag former was added by comparing the ratio between the components, it was found that the ratio of $CaO/SiO_2$ was 0.42. From a comparative analysis of $Al_2O_3/SiO_2$ and $CaO/SiO_2$, it was judged that the ratio of $Al_2O_3$ and $SiO_2$ can be utilized as an index to judge similar systems of smelting process (ore, furnace wall, and fuel).

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.81-88
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• 2019

In this study, the effects of graphene oxide (GO) addition on electromigration (EM) lifetime of Sn-3.0Ag-0.5Cu Pb-free solder joint between a ball grid array (BGA) package and printed circuit board (PCB) were investigated. After as-bonded, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) was formed at the interface of package side finished with electroplated Ni/Au, while $Cu_6Sn_5$ IMC was formed at the interface of OSP-treated PCB side. Mean time to failure of solder joint without GO solder joint under $130^{\circ}C$ with a current density of $1.0{\times}10^3A/cm^2$ was 189.9 hrs and that with GO was 367.1 hrs. EM open failure was occurred at the interface of PCB side with smaller pad diameter than that of package side due to Cu consumption by electrons flow. Meanwhile, we observed that the added GO was distributed at the interface between $Cu_6Sn_5$ IMC and solder. Therefore, we assumed that EM reliability of solder joint with GO was superior to that of without GO by suppressing the Cu diffusion at current crowding regions.