• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.12
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• pp.1529-1534
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• 2012

In this study, tensile tests for 12-${\mu}m$-thick copper thin foils were performed by using the DIC method. The DIC method provided precise stress-strain curves for thin film materials, and a commercial inkjet printer can be simply and effectively used for printing speckle patterns on the specimen of Cu thin films whose surface contrast is too low to apply the DIC method. The mechanical properties of Cu thin foils obtained in this study are as follows: elastic modulus E = 89.2 GPa, 0.2% offset yield stress $S_{0.2%}$= 232.8 MPa, tensile strength $S_u$= 319.2 MPa, elongation at fracture ${\varepsilon}_f$=16.8 %, and Poisson's ratio ${\nu}$= 0.34.

• Journal of the Korean Electrochemical Society
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• v.2 no.4
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• pp.237-241
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• 1999

The characteristics of copper thin films and via hole filling capability were investigated by pulsed electrodeposition method. Especially, the effects of additives on the properties of copper thin films were studied. Copper films, which were deposited by pulsed electrodeposition using commercial additives, had low tensile stress value under 83.4 MPa and high preferred Cu (111) texture. Via holes with $0.25{\mu}m$ in diameter and 6 : 1 aspect ratio were successfully filled without any defects by superfilling. It was observed that copper microstructure deformed by twining. After heat treatment at $500^{\circ}C$ for 1 k in vacuum furnace, grain size was 1 or 2 times as large as film thickness and the bamboo structure was formed. Heat treated copper films showed good resistivities of $1.8\~2.0{\mu}{\Omega}{\cdot}cm$.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.41 no.8
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• pp.745-750
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• 2017

Tension tests for copper thin films with thickness of $12{\mu}m$ were performed by using a digital image correlation method based on consecutive digital images. When calculating deformation using digital image correlation, a large deformation causes errors in the calculated result. In this study, the calculation procedure was improved to reduce the error, so that the full field deformation and the strain of the specimen could be accurately and directly measured on its surface. From the calculated result, it can be seen that the strain distribution is not uniform and its variation is severe, unlike the distribution in a common bulk specimen. This might result from the surface roughness introduced in the films during the fabrication process by electro-deposition.

• Journal of the Korean Vacuum Society
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• v.20 no.5
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• pp.356-360
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• 2011

Indium oxide ($In_2O_3$) single layer and $In_2O_3$/copper (Cu) bi-layer films were prepared on glass substrates by RF and DC magnetron sputtering without intentional substrate heating. In order to determine the effect of the Cu bottom layer on the optical, electrical and structural properties of $In_2O_3$ films, 3-nm-thick Cu film was deposited on the glass substrate prior to deposition of the $In_2O_3$ films. As-deposited $In_2O_3$ films had an optical transmittance of 79% in the visible wavelength region and a sheet resistance of 2,300 ${\Omega}/{\square}$, while the $In_2O_3$/Cu film had optical and electrical properties that were influenced by the Cu bottom layer. $In_2O_3$/Cu films had a lower sheet resistance of 110 ${\Omega}/{\square}$ and an optical transmittance of 71%. Based on the figure of merit, it can be concluded that the Cu bottom layer effectively increases the performance of $In_2O_3$ films for use as transparent conducting oxides in flexible display applications.

• Korean Journal of Materials Research
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• v.9 no.11
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• pp.1148-1152
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• 1999

An organometallic precursor, hfac(hexafluoroacetylacetonate) Cu(I) DMB (3,3-dimethyl- 1-butene) was synthesized, evaluated and compared with other precursors for metal organic chemical vapor deposition of copper thin films. It was found that at $40^{\circ}C$, the vapor pressure was an order of magnitude higher (about 3 torr) than (hfac) Cu vinyltrimethylsilane (VTMS) and films could be deposited at the substrate temperature of 100-$280^{\circ}C$ with deposition rate substantially higher. The copper films contained no detectable impurities as measured by Auger electron spectroscopy and had a resistivity of about 2.0$\mu\Omega$-cm in the deposition temperature range of 150 to $250^{\circ}C$. From the thermal analysis, (hfac)Cu(I)(DMB) is believed to be quite stable and no appreciable amount of precipitation was observed at $65^{\circ}C$ heating for more than a month.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.21-25
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• 2015

Bending fatigue characteristics of Cu films and $8{\mu}m$ width Cu interconnects on flexible substrates were investigated, and fatigue reliability improvement was achieved through Mo-Ti alloy adhesion layer. Tensile bending fatigue reliability of Cu interconnects is 3 times lower than that of Cu films, and even compressive bending fatigue reliability of Cu interconnects is 6 times lower than that of Cu films. From these results, mechanical crack formation could be fatal in Cu interconnects. With Mo-Ti adhesion layer, fatigue reliability of Cu films and interconnects were enhanced due to the increase of adhesion strength and the suppression of slip induced crack initiation.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2013.10a
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• pp.383-385
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• 2013

반도체소자의 고속실현을 위해서 알루미늄배선에서 40% 가량 성능을 높이는 반면 제조비용은 30%까지 낮출 수 있는 구리를 선호하고 있으나, 식각이 잘 되지 않아 원하는 패턴으로 만들어 내기가 곤란한 공정기술의 어려움과 구리물질이 지닌 유독성문제를 가지고 있다. 기존의 식각기술로는 구리패턴을 얻을 수 없는 기술적 한계 때문에 화학.기계적 연마(CMP)를 이용한 평탄화와 연마를 통해서 구리배선을 얻는 다마스커스(Damascene)기술이 개발됐고 이를 이용한 구리배선기술이 현실적으로 가능하게 됐다. CMP를 이용한 평탄화 및 연마 공정에서 Wafer에 도포된 구리의 두께를 실시간으로 측정하여 정밀하게 제어할필요가 있는데, 본 논문에서는 와전류를 이용하여 옹고스트롬 단위의 두께를 실시간으로 측정하여 제어 하는 시스템구현에 대해 기술한다.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.145-145
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• 2012

반도체 집적회로의 집적도가 증가함에 따라 RC delay가 증가하며, 금속 배선의 spiking, electromigration 등의 문제로 인해 기존의 알루미늄 금속을 대체하기 위하여 구리를 배선재료로 사용하게 되었다. 하지만 구리는 실리콘 및 산화물 내에서 매우 빠른 확산도를 가지고 있으므로, 구리의 확산을 막아 줄 확산방지막이 필요로 하다. 이러한 확산방지막의 증착은, 소자의 크기가 작아짐에 따라 via/contact과 같은 고단차 구조에도 적용이 가능하도록 기존의 sputtering 증착 방법에서 이를 개선한 collimated sputter, long-throw sputter, ion-metal plasma 등의 방법으로 물리적인 증착법이 지속되어 왔지만, 근본적인 증착방법을 바꾸지 않는 한 한계에 도달하게 될 것이다. 원자층 증착법(ALD)은 CVD 증착법의 하나로, 소스와 반응물질을 주입하는 시간을 분리함으로써 증착하고자 하는 표면에서의 반응을 유도하여 원자층 단위로 원하는 박막을 얻을 수 있는 증착방법이다. 이를 이용하여 물리적 증기 증착법(PVD)보다 우수한 단차피복성과 함께 정교하게 증착두께를 컨트롤을 할 수 있다. 본 연구에서는 이러한 원자층 증착법을 이용하여 구리 배선을 위한 확산방지막으로 텅스텐질화막을 형성하였다. 텅스텐 질화막을 형성하기 위하여 금속-유기물 전구체와 함께 할라이드 계열인 WF6를 텅스텐 소스로 이용하였으며, 이에 대한 원자층 증착방법으로 이루어진 박막의 물성을 비교 평가하여 분석하였다.

• Korean Journal of Materials Research
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• v.9 no.12
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• pp.1196-1204
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• 1999

We have carried out copper MOCVD(metalorganic chemical vapor deposition) onto the reactive sputtered PVD-TiN and rapid thermal converted RTP-TiN substrates using direct liquid injection for effective delivery of the (hfac)Cu(vtmos) [$C_{10}H_{13}O_{5}CuF_{6}$Si: 1,1,1,5,5,5-hexafluoro-2,4- pentadionato (vinyltrimethoxysilane) copper (I)] precursor. Especially, the influences of deposition conditions and the substrate type on growth rate, crystal structure, microstructure, and electrical resistivity of copper deposits have been discussed. It is found that the film growth with 0.2ccm precursor flow rate become mass-transfer controlled up to Ar flow rate of 200sccm and pick-up rate controlled at a vaporizer above 1.0Torr reactor pressure. The surface-reaction controlled region from 155 to 225$^{\circ}C$ at 0.6Torr reactor pressure results in the apparent activation energies of 12.7~14.1kcal/mol, and above 224$^{\circ}C$ the growth rate with $H_2$ addition could be improved compared to the pure Ar carrier. The Cu/RTP-TiN structures which have high copper nucleation density in initial stage of growth show more pronounced (111) preferred orientations and lower electrical resistivities than those on PVD-TiN. The variation of electrical resistivity with substrate temperature reflects the three types of film microstructure changes, showing the lowest value for the deposit at 165$^{\circ}C$ with small grains of good contacts.

• Proceedings of the KAIS Fall Conference
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• 2004.11a
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• pp.195-198
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• 2004

실리콘 산화막 위에 구리 확산 방지막으로서 W-N 박막을 $NH_3$ 펄스 플라즈마를 이용한 원자층 증착방법으로 형성하였다. 플라즈마 원자층 증착방법 (PPALD)은 일반적인 원자층 증착방법(ALD)의 성장 기구를 그대로 따라 간다. 그러나 일반적인 ALD 방법에 의해 증착한 W-N 박막에 비해 PPALD 방법으로 증착한 W-N 박막은 F 함유량과 비저항이 감소하였고 열적 안정성에 대한 특성도 향상되었다. 또한 $WF_6$ 가스는 실리콘 산화막과 반응을 하지 않기 때문에 $WF_6$ 가스와 $NH_3$ 가스를 사용해서 ALD 증착방법으로 실리콘 산화막 위에 W-N 박막을 증착하기 어려운 문제점(8,9)을 $NH_3$ 반응종으로 실리콘 산화막 표면을 먼저 변형시켜 $WF_6$ 가스가 산화막과 반응을 할 수 있게 함으로써 ALD 방법으로 W-N 박막을 실리콘 산화막 위에 증착 할 수 있었다.