Bending Fatigue Reliability Improvements of Cu Interconnects on Flexible Substrates through Mo-Ti Alloy Adhesion Layer |
Lee, Young-Joo
(Department of Materials Science & Engineering, Seoul National University)
Shin, Hae-A-Seul (Department of Materials Science & Engineering, Seoul National University) Nam, Dae-Hyun (Department of Materials Science & Engineering, Seoul National University) Yeon, Han-Wool (Department of Materials Science & Engineering, Seoul National University) Nam, Boae (LG Display Research and Development Center, LG Display Co. Ltd.) Woo, Kyoohee (Advanced Manufacturing Systems Research Division, Korea Institute of Machinery and Materials) Joo, Young-Chang (Department of Materials Science & Engineering, Seoul National University) |
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