• Applied Chemistry for Engineering
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• v.9 no.4
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• pp.574-578
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• 1998

Electrochemical Ion Exchang(EIX) electrode containing Amberlite IRP-64 as a cation ion exchange resin and Stylene-Buthylene-Rubber(SBR) as a binder was fabricated by the compressed diecasting method. The adsorption and elution characteristics in copper sulfate solution were investigated at the various electrode potentials and electrolyte pHs. In the adsorption process, it was found that the maximum adsorption rate of copper was obtained at -1800 mV and the ratio of adsorption was 92% during 90 min. In the elution process, the elution rate of copper was increased in proportion to anodic potential in the present experimental range and the ratio of elution was 88% during 50 mins at 3600 mV. The adsorption and elution processes were significantly affected by the variation of local pH in the vicinity of electrochemical ion exchange electrode. The higher performances of adsorption and elution were elution were obtained at basic and acidic eletrolytes.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.548-549
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• 2007

과거 PCB 제조의 주된 화제는 다양한 산업분야의 발전을 위해 한정된 시간 안에 좀 더 많은 PCB를 양산하는 기술 개발에 집중되어 있었지만, 현재는 비정상적인 공정 상태를 파악함으로써 제조 공정 환경에서의 오류를 줄여 전체 수률을 높이는 방법에 시선을 돌리고 있다. PCB 에칭의 경우 에칭 용액의 상태를 실시간으로 모니터링 하는 것이 중요하다. 본 논문에서는 기존 애칭용액의 상태를 판단할 때 사용되는 ORP 센서 대신, RGB 센서를 이용하여 실시간으로 용액의 상태를 모니터링 할 수 있는 시스템을 개발 하였다. 개발된 시스템을 이용하여 기존 ORP 시스템과의 비교 분석을 및 RGB 센서률 이용한 모니터링 방법이 ORP 센서를 이용한 방법 보다 좀 더 쉽고 정확하게 에칭 액의 상태를 모니터링할 수 있다는 것을 확인 하였다.

• Applied Microscopy
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• v.29 no.3
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• pp.265-274
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• 1999

The microstructure of Cu thin films in various deposition conditions was characterized. Cr films (50 nm thick) and Cu films (500 or 1000 nm thick) were deposited on polyimide films by DC magnetron sputtering. The Ar pressure during Cu deposition was controlled to 5, 50 and 100 mtorr. The microstructure was characterized using conventional and high resolution SEM and TEM. As sputtering pressure increases, open boundaries are observed more frequently. The Cu film deposited at 5 mtorr has a dense and uniform structure, while low-density regions or open boundaries between columns exist in the film deposited at higher pressure. As the film grows thicker, open boundaries are wider and the density of open boundaries are higher. The comparison between SEM and TEM show that the small features shown in high resolution SEM are grains. High resolution SEM is very effective to characterize the microstructure of the thin films. One column in the films deposited at 50 and 100 mtorr consists of several grains, which are smaller than those deposited at 5 mtorr.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.41 no.8
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• pp.745-750
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• 2017

Tension tests for copper thin films with thickness of $12{\mu}m$ were performed by using a digital image correlation method based on consecutive digital images. When calculating deformation using digital image correlation, a large deformation causes errors in the calculated result. In this study, the calculation procedure was improved to reduce the error, so that the full field deformation and the strain of the specimen could be accurately and directly measured on its surface. From the calculated result, it can be seen that the strain distribution is not uniform and its variation is severe, unlike the distribution in a common bulk specimen. This might result from the surface roughness introduced in the films during the fabrication process by electro-deposition.

• Resources Recycling
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• v.29 no.5
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• pp.73-80
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• 2020

In order to develop a process for the recovery of valuable metals from spent LiBs, solvent extraction experiments were performed to separate Cu(II) and/or Co(II) from synthetic hydrochloric acid solutions containing Li(I), Mn(II), and Ni(II). Commercial amines (Alamine 336 and Aliquat 336) were employed and the extraction behavior of the metals was investigated as a function of the concentration of HCl and extractants. The results indicate that HCl concentration affected remarkably the extraction efficiency of the metals. Only Cu(II) was selectively at 1 M HCl concentration, while both Co(II) and Cu(II) was extracted by the amines when HCl concentration was higher than 5 M, leaving the other metal ions in the raffinate. Therefore, it was possible to selectively extract either Cu(II) or Co(II)/Cu(II) by adjusting the HCl concentration.

• Journal of The Korean Society of Grassland and Forage Science
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• v.29 no.1
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• pp.51-62
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• 2009

This study was carried out development a new composting system to lower copper and zinc concentration in plg sludge compost and conduct an inquiry into the possibility of crop cultivation. The concentrations of nitrogen, phosphorus and pH averaged 4.4%, 6.3% and 7.57, respectively, which were higher concentrations than in commercial organic fertilizers, and the concentrations of copper and zinc averaged 805 and 1,704 mg/kg, respectively, which were beyond the heavy metal concentration limit in byproduct compost. Hydrated citric acid I lowered the concentrations of copper and zinc by 58% and 97%, respectively and hydrated oxalic acid II lowered the concentrations of copper and zinc by 48% and 56%, respectively in pig sludge compost. Lower concentrations of copper and zinc in pig sludge resulted from the enhanced hydrated-citric acid concentration in organic acid solution mixed with distilled water. The concentrations of copper and zinc were 330, and 41 mg/kg in the pig sludge treated with 100% hydrated citric acid. Agitation composting system stabilized the compost earlier than the stationary composting system, in which the stabilization condition was confirmed by higher temperature by $4^{\circ}C$ at highest temperature and 7 days earlier cooling down after highest temperature. The levels of germination index (G.I) 80 were obtained 15 and 20 days after composting in agitation and stationary composting system, respectively. The concentrations of copper and zinc were 2.4 and 4.26 mg/kg respectively in soils amended with pig sludge compost after removing process of heavy metals by citric acid, but 8.0 and 22.37 mg/kg, respectively in soils amended with Pig Sludge. The concentrations of heavy metals was highest in com cultivated in soils amended with pig sludge. The copper and zinc concentrations In corn leaves were 75.2 and 50.56 mg/kg respectively, which were 4 and 2 fold higher than the com cultivated in soils amended with pig sludge compost after heavy metal removing process by hydrated citric acid.

• Korean Journal of Ecology and Environment
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• v.44 no.3
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• pp.272-279
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• 2011

Copper cyanide is a chemical produced in large quantities with 2,500 tonnes being produced in 2006. It is mainly used for electroplating copper, particularly alkali-Cu plate and brass plating. The purpose of this study is to reassess the physicochemical properties and environmental fate of copper cyanide based on reliable data and and to conduct an ecotoxicity test according to the OECD test guidelines as an initial environmental risk assessment (need to state where this was done). Metal containing inorganic substances are not subject to degradation, biodegradation or hydrolysis. Aquatic toxicity tests of copper cyanide were conducted according to OECD test guideline 201, 202 and 203 for green algae, daphnia, and fish, respectively. The following acute toxicity test results were obtained for aquatic species: 0.089 mg $L^{-1}$ (Algae, 72 Hr-$EC_{50}$); 0.21 mg $L^{-1}$ (flea, 48 Hr-$LC_{50}$); 0.62 mg $L^{-1}$ (Fish, 96 Hr-$ErC_{50}$). The chemical possesses properties indicating a hazard for the aquatic environment (acute toxicity in fish, daphnia and algae below 1.0 mg $L^{-1}$). As a result of this study, copper cyanide has become a candidate for detailed risk assessment. Countries that produce this chemical in significant quantities are recommended to perform specific assessments.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.3
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• pp.1308-1312
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• 2011

CCFL(Cold Cathode Fluorescent Lamp)for BLU of LCD and special lighting has been widely utilized. The removal of oxide film formed on electrode of CCFL in manufacturing process is required. In this pape Plasma treatment was carried out to remove the oxide film. To ensure the optimum process, the analysis of sheet resistance, XRD, AFM and solder test was conducted. A minimum sheet resistance and the maximum percentage of the solder coverage ratio were measured in optimal process conditions such as plasma power consumption 600W and processing time of 70 seconds. As the plasma treatment is confirmed to be due to removal of copper oxide, this process is expected to be used as a treatment of electrode for CCFL.

• Korean Chemical Engineering Research
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• v.49 no.2
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• pp.161-167
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• 2011

Recent popularity in mobile electronics requires higher standard on the mechanical strength of electronic packaging. Thus, the method of soldering between chip and substrate in electronic packaging process is changing from conventional method using intermetallic compound to a new method using organic solderability preservatives (OSP) in order to improve the stability and the reliability of final product. Since current OSPs have several serious problems like thermo-stability during packaging process, however, it is necessary to develop new OSPs having thermo-stability. The main purpose of this study is to develop various thermo-stable OSPs based upon poly(vinyl pyridine-co- methylmethacrylate) and to evaluate their anti-oxidation property protecting Cu pad, thermo-stability and solubility to acid- or alcohol-containing aqueous solution during pos-fluxing. All OSPs showed not only good anti-oxidation property, thermo-stability and solubility but also more advantages like low cost, less odor, and less hygroscopic.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.1
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• pp.55-60
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• 2021

In order to produce wearable displays with high adhesion while maintaining flexible characteristics, the adhesive method using electro plating method was carried out. Laser lift-off (LLO) transcription was also used to remove sapphire substrates from LEDs bonded to fibers. Afterwards, the SEM and EDS data of the sample, which conducted the adhesion method using electro plating, confirmed that copper actually grows through the lattice of the fiber fabric to secure the light source and fiber. The adhesion characteristics of copper were checked using Universal testing machine (UTM). After plating adhesion, the characteristics of the LLO transcription process completed and the LED without the transcription process were compared using probe station. The electroluminescence (EL) according to the enhanced current was measured to check the characteristics of the light source after the process. As the current increases, the temperature rises and the bandgap decreases, so it was confirmed that the spectrum shifted. In addition, the change in the electrical characteristics of the samples according to the radius change is confirmed using probe station. The radius strain also had mechanical strength that copper could withstand bending stress, so the Vf variation was measured below 6%. Based on these results, it is expected that it will be applied to batteries, catalysts, and solar cells that require flexibility as well as wearable displays, contributing to the development of wearable devices.