• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.2
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• pp.660-665
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• 2014

Optimization of process parameters in polymer extrusion is an important task to reduce manufacturing cost. To determine the optimum values of the process parameters, it is essential to find their influence on the elongation of polymer breathable thin film. The significance of six important process parameters namely, extruder cylinder temperature, extruder speed, extruder dies temperature, cooling roll temperature, stretching ratio, stretching roll temperature on breathable film elongation of polymer extrusion was determined. Moreover, this paper presents the application of Taguchi method and analysis of variance(ANOVA) for maximization of the breathable film elongation influenced by extrusion parameters. The optimum parameter combination of extrusion process was obtained by using the analysis of signal-to-noise ratio. The conclusion revealed that stretching ratio were the most influential factor on the film elongation. The best results of film elongation were obtained at lower stretching ratio.

• Proceedings of the Korean Institute of Navigation and Port Research Conference
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• 2006.06b
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• pp.325-330
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• 2006

Integrating processes are frequently encountered in process industries. Generally they are most commonly associated with level control problems. In this paper, tuning formulae of PID controllers for set-point tracking and load disturbance rejection are presented on integrating processes with time delay. In particular, the controller parameters are determined such that performance criteria(IAE, ISE and ITSE) are minimized. Optimal PID parameter sets are obtained by means of a real-coded genetic algorithm(RCGA) and then tuning rules are addressed using obtained PID parameter sets and another RCGA. The performances of the proposed tuning rules are tested on two processes.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.37 no.4
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• pp.382-393
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• 2024

The Microplotter system with a fluid dispensing method, sprays fluid based on ultrasonic pumping through piezoelectric devices. This technique can possible for various materials with a wide range of viscosities to be printed in microscale. In this paper, we introduces dispenser printing technology as well as aim to understand and apply various processes using the equipment. In addition, we will explain how to optimize the equipment by adjusting parameters such as spray intensity, tip height during printing, and patterning speed. By utilizing Microplotter's advantage of being compatible with a wide range of fluids, including metal nanoparticles, carbon nanotubes, DNA, and proteins, it is expected to be used in various fields such as printed electronics, biotechnology, and chemical engineering.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2008.05a
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• pp.105-110
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• 2008

We have proposed a new structure of poly-silicon thin film transistor(TFT) which was fabricated the LDD region using doping oxide with graded spacer by etching shape retio. The devices of n-channel poly-si TFT's hydrogenated by $H_2$ and $HT_2$/plasma processes are fabricated for the devices reliability. We have biased the devices under the gate voltage stress conditions of maximum leakage current. The parametric characteristics caused by gate voltage stress conditions in hydrogenated devices are investigated by measuring /analyzing the drain current, leakage current, threshold voltage($V_{th}$), sub-threshold slope(S) and transconductance($G_m$) values. As a analyzed results of characteristics parameters, the degradation characteristics in hydrogenated n-channel polysilicon TFT's are mainly caused by the enhancement of dangling bonds at the poly-Si/$SiO_2$ interface and the poly-Si Brain boundary due to dissolution of Si-H bonds. The structure of novel proposed poly-Si TFT's are the simplity of the fabrication process steps and the decrease of leakage current by reduced lateral electric field near the drain region.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.3
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• pp.53-58
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• 2008

In this study, we fabricated embedded IC (Double Pole Double throw switch chip) polymer substrate and evaluate it for 2.4 GHz WiFi application. The switch chips were laminated using FR4 and ABF(Ajinomoto build up film) as dielectric layer. The embedded DPDT chip substrate were interconnected by laser via and Cu pattern plating process. DSC(Differenntial Scanning Calorimetry) analysis and SEM image was employed to calculate the amount of curing and examine surface roughness for optimization of chip embedding process. ABF showed maximum peel strength with Cu layer when the procuring was $80\sim90%$ completed and DPDT chip was laminated in a polymer substrate without void. An embedded chip substrate and wire-bonded chip on substrate were designed and fabricated. The characteristics of two modules were measured by s-parameters (S11; return loss and S21; insertion loss). Insertion loss is less than 0.55 dB in two presented embedded chip board and wire-bonded chip board. Return loss of an embedded chip board is better than 25 dB up to 6 GHz frequency range, whereas return loss of wire-bonding chip board is worse than 20 dB above 2.4 GHz frequency.

• Journal of the Korean Institute of Intelligent Systems
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• v.18 no.2
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• pp.236-242
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• 2008

In this paper, we propose an optimized fuzzy controller based on Hierarchical Fair Competition-based Genetic Algorithms (HFCGA) for rotary inverted pendulum system. We adopt fuzzy controller to control the rotary inverted pendulum and the fuzzy rules of the fuzzy controller are designed based on the design methodology of Linear Quadratic Regulator (LQR) controller. Simple Genetic Algorithms (SGAs) is well known as optimization algorithms supporting search of a global character. There is a long list of successful usages of GAs reported in different application domains. It should be stressed, however, that GAs could still get trapped in a sub-optimal regions of the search space due to premature convergence. Accordingly the parallel genetic algorithm was developed to eliminate an effect of premature convergence. In particular, as one of diverse types of the PGA, HFCGA has emerged as an effective optimization mechanism for dealing with very large search space. We use HFCGA to optimize the parameter of the fuzzy controller. A comparative analysis between the simulation and the practical experiment demonstrates that the proposed HFCGA based fuzzy controller leads to superb performance in comparison with the conventional LQR controller as well as SGAs based fuzzy controller.

• The Journal of the Acoustical Society of Korea
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• v.16 no.6
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• pp.54-60
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• 1997

In the SC filter consist of SC integrator and SC Lossy Integrator, after this paper proposes the method that cancels phase error using LDI clock and the imaginary part in damping term of SC Lossy integrator, LDI fifth order elliptic low-pass SC filter is designed. With the result of SCANAP program simulation applying the designed CMOS OP-Amp using power supply ${\pm}$5V and MOSIS 2--${\mu}$m double-poly double-metal n-well CMOS design rule.

• Journal of the Institute of Convergence Signal Processing
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• v.2 no.4
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• pp.91-96
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• 2001

In this paper we propose a new ENMODL(Enhanced-NORA-MODL) CLA(Carry-Look Ahead Adder) for high speed and low power multiplier. To reduce transistor counts, area and power dissipation we developed new-approaches. The method makes use of a dynamic CMOS logic ENMODL CLA. The advantage of ENMODL is small area and high speed The speed of ENMODL CLA is invreased by 6.27 % as compared with conventional NMOCL CLA. The proposed method was verified by HSPICE simulation and layout througth 0.6${\mu}{\textrm}{m}$ CMOS process.

• Korean Chemical Engineering Research
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• v.58 no.1
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• pp.127-134
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• 2020

The adsorption characteristics of the major tar compound, acenaphthene, derived from Taxus chinensis by the commercial adsorbent Sylopute were investigated using different parameters such as initial acenaphthene concentration, adsorption temperature, and contact time. Out of Langmuir, Freundlich, Temkin and Dubinin-Radushkevich isotherm models, adsorption data were best described by Langmuir isotherm. The adsorption kinetics was evaluated by pseudo-first-order, pseudo-second-order and intraparticle diffusion models. The pseudo-second-order model was found to explain the adsorption kinetics most effectively. Thermodynamic parameters revealed the feasibility, nonspontaneity and exothermic nature of adsorption. In addition, the isosteric heat of adsorption was independent of surface loading indicating the Sylopute used as an energetically homogeneous surface.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.4
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• pp.69-74
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• 2010

A new package substrate for dynamic random access memory(DRAM) devices has been developed using selective aluminum anodization. Unlike the conventional substrate structure commonly made by laminating epoxy-based core and copper clad, this substrate consists of bottom aluminum, middle anodic aluminum oxide and top copper. Anodization process on the aluminum substrate provides thick aluminum oxide used as a dielectric layer in the package substrate. Placing copper traces on the anodic aluminum oxide layer, the resulting two-layer metal structure is completed in the package substrate. Selective anodization process makes it possible to construct a fully filled via structure. Also, putting vias directly in the bonding pads and the ball pads in the substrate design, via in pad structure is applied in this work. These arrangement of via in pad and two-layer metal structure make routing easier and thus provide more design flexibility. In a substrate design, all signal lines are routed based on the transmission line scheme of finite-width coplanar waveguide or microstrip with a characteristic impedance of about $50{\Omega}$ for better signal transmission. The property and performance of anodic alumina based package substrate such as layer structure, design method, fabrication process and measurement characteristics are investigated in detail.