• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.7
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• pp.270-276
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• 2020

3D printing is an additive manufacturing technology that can produce complex shapes in a single process for a range of materials, such as polymers, ceramics, and metals. Recent 3D printing technology has developed to a level that enables the mass-production through an improvement of the printing speed and the continuous development of applicable materials. In this study, 3D printing technology using a laser was applied to manufacture a heat exchanger for an air compressor in a railway vehicle. First, the optimal design of the heat exchanger was carried out by focusing on weight reduction and compactness as a shape suitable for 3D printing. Based on the design derived, heat exchanger prototypes were made of AlSi10Mg alloy material by applying the SLM technique. Moreover, the manufactured prototypes were attached to an existing air compressor, and the heat exchange performance of the compressed air was tested. The test results of the 3D printed prototypes showed a heat exchange performance of approximately 80% and 85% at low and high-pressure, respectively, compared to the existing heat exchanger. From the 𝓔-NTU method results with an external cooling air condition similar to that of the existing heat exchanger, the calculated heat transfer amount of 3D printed parts showed similar performance compared to the existing heat exchanger. As a result, the 3D printed heat exchanger is lightweight with good performance.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.1
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• pp.666-671
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• 2018

A honeycomb panel is a plate made by attaching two surface plateson eitherside of a honeycomb core. The honeycomb plate hasexcellent specific strength and energy absorption and is suitable for use in regions where good impact resistance is required. Recently, with the increasing the need for a lightweight design to facilitate transportation, numerous studies have been conducted using aluminum honeycomb plates as body materials for vehicles such as automobiles and high-speed trains. In addition, honeycomb plates have excellent sound deadening properties, as well as excellent heat insulation and durability. Savings in weight using lightweight materials such as aluminum alloy for honeycomb panel's skin can lead to increase fuel economy and reduction in air pollution. In this study, in order to improve the design technology of the honeycomb plate material, the manufacturing technology of the aluminum honeycomb core and honeycomb plate material and various mechanical properties of the honeycomb plate were evaluated. From the results, it was found that the design of the manufacturing process of the aluminum honeycomb plate, as well as itsproduction and characteristics, were improved. The resulting excellent energy absorption capability of the honeycomb plate was due to the repetitive core buckling, indicating that the higher the compressive strength, the higher the strength per bonded area.

• Progress in Superconductivity
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• v.10 no.2
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• pp.79-86
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• 2009

We successfully fabricated C-doped ex-situ $MgB_2$ wires using two different methods such as mechanical alloying(MA) and combined process(CP) of in-situ and ex-situ. In the MA, the precursor powder was prepared with a mixture of $MgB_2$ and 1 at% C powders by planetary ball milling for 0-100 h. In the CP, on the other hand, C-doped $MgB_2$ powder was prepared with Mg, B, and C powders by in-situ process via compaction, sintering, and crushing. The powders prepared by two methods were loaded into Fe tube and then the assemblages were drawn by a conventional powder-in-tube technique. The MA treatment of C-added $MgB_2$ decreased the particles/grains size and resulted in C-doping into $MgB_2$ after sintering, improving the critical current density($J_c$) in high external magnetic field. For the C-doped $MgB_2$ wire by MA for 25 h, the $J_c$ was $4.1{\times}10^3A/cm^2$ at 5 K and 6.4 T, which was 5.9 times higher than that of pure and untreated $MgB_2$ wire. The CP also provided C-doping into $MgB_2$ and improved the $J_c$ in high magnetic field; the C-doped $MgB_2$ wire fabricated by CP exhibited a $J_c$ being 2.3 times higher than that of the ex-situ wire used commercial $MgB_2$ powder at 5 K and 6.0 T($2.7{\times}10^3A/cm^2\;vs.\;1.2{\times}10^3A/cm^2$).

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.43 no.1 s.343
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• pp.7-12
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• 2006

In this study, we developed irreversible and stable micro-size ferromagnetic structures utilizing hydrogenation and electron-beam lithography processes. The compositionally modulated (CM) Fe-Zr thin films that had average compositions $Fe_XZr_{100-x}$ with $x=65-85\%$ modulation periods of similar to 1 nm, and total thicknesses of similar to 100 m were prepared. The magnetic properties of CM Fe-Zr thin films were measured using a SQUID magnetometer, VSM and B-H loop tracer. After hydrogenation, the CM films exhibited larger magnetic moment increases than similar homogeneous alloy films for all compositions and かey showed largest increase in $Fe_{80}Zr_{20}$ composition. After aging in air at $300^{\circ}K$ the hydrogenated $Fe_{80}Zr_{20}$ CM films showed much larger magnetic moment increases, indicating that they relax to a stable, irreversible, soft magnetic state. The selective hydrogenation through electron-beam lithographed windows were performed after the circle shaped windows were prepared on $Fe_{80}Zr_{20}$ CM films by electron beam lithography. The hydrogenation through electron-beam resist and W lithographic techniques give a $49\%$ magnetic moment increase. This method can be applied to nano scale structures.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.55-61
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• 2011

The n-type $Bi_2(Te_{0.9}Se_{0.1})_3$ powers were fabricated by mechanical alloying, mixed with tungsten(W) powders, and hot-pressed at $550^{\circ}C$ for 30 minutes. Thermoelectric properties of the hot-pressed $Bi_2(Te_{0.9}Se_{0.1})_3$ were characterized as a function of the volume percent of tungsten-powder addition. The power factor of the hot-pressed $Bi_2(Te_{0.9}Se_{0.1})_3$ was $21.9{\times}10^{-4}$ $W/m-K^2$, and was improved to $30.5{\times}10^{-4}$ $W/m-K^2$ by dispersion of 1 vol% W powders. While the dimensionless figure-of-merit of the $Bi_2(Te_{0.9}Se_{0.1})_3$ hot-pressed without dispersion of W powders was measured as 0.52 at room temperature, it became substantially enhanced to 0.95 with addition of 1 vol% W powders.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.4
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• pp.33-38
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• 2011

The p-type $(Bi_{0.2}Sb_{0.8})_2Te_3$ powers were fabricated by mechanical alloying and hot-pressed at temperatures of $350{\sim}550^{\circ}C$. Themoelectric properties of the hot-pressed $(Bi_{0.2}Sb_{0.8})_2Te_3$ were characterized as a function of the hot-pressing temperature. With increasing the hot-pressing temperature from $350^{\circ}C$ to $550^{\circ}C$, the Seebeck coefficient and the electrical resistivity decreased from 237 ${\mu}V/K$ to 210 ${\mu}V/K$ and 2.25 $m{\Omega}-cm$ to 1.34 $m{\Omega}-cm$, respectively. The power factor of the hot-pressed $(Bi_{0.2}Sb_{0.8})_2Te_3$ became larger from $24.95{\times}10^{-4}W/m-K^2$ to $32.85{\times}10^{-4}W/m-K^2$ with increasing the hot-pressing temperature from $350^{\circ}C$ to $550^{\circ}C$. Among the specimens hot-pressed at $350{\sim}550^{\circ}C$, the $(Bi_{0.2}Sb_{0.8})_2Te_3$ hot-pressed at $500^{\circ}C$ exhibited the maximum dimensionless figure-of-merit of 1.09 at $25^{\circ}C$ and 1.2 at $75^{\circ}C$.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.29-35
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• 2003

The Sn-based lead-free solders with varying microstructure were prepared by changing the cooling rate from the melt. Bulky as-cast SnAg, SnAgCu, and SnCu, alloys were cold rolled and thermally stabilized before the creep tests so that there would be very small amount of microstructural change during creep (TS), and thin specimens were water quenched from the melt (WQ) to simulate microstructures of the as-reflowed solders in flip chips. Cooling rates of the WQ specimens were 140∼150 K/sec, and the resultant $\beta-Sn$ globule size was 5∼10 times smaller than that of the TS specimens. Subsequent creep tests showed that the minimum strain rate of TS specimens was about $10_2$ times higher than that of the WQ specimens. Fractographic analyses showed that creep rupture of the TS-SnAgCu specimens occurred by the nucleation of voids on the $Ag_3Sn$ Sn or $Cu_6Sn_5$ particles in the matrix, their subsequent growth by the power-law creep, and inter-linkage of microcracks to form macrocracks which led to the fast failure. On the other hand, no creep voids were found in the WQ specimens due to the mode III shear rupture coming from the thin specimens geometry.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.54-54
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• 1999

다이아몬드 합성시 질소 첨가는 Cn 화합물의 합성가능성을 비롯하여 다이아몬드의 질소 도핑, 성장 속도 및 결정성 변화 등 다양한 관점에서 중요한 의미를 가지고 있다. 본 연구에서는 다이아몬드의 일반적인 합성조건에서 질소를 첨가하여 합성된 막의 형상 및 상 변화에 대해 고찰하였다. 막은 다이아몬드 전처리시킨 Si 기판위에 microwave plasma CVD 장치를 이용하여 합성하였다. 유입되는 혼합가스(CH4+H2+N2)에서 N2 첨가량을 0-95%까지 변화시켰다. 이때 CH4 농도는 5%로 고정하였고, 합성온도는 90$0^{\circ}C$-115$0^{\circ}C$까지 변화시켰다. 이와 같이 합성된 막의 표면조직 및 성장 두께를 측정하기 위해 주사전자현미경을 이용하였다. 상의 분석은 Raman, XRD 및 TEM 분석을 이용하였으며, 조성분석을 위해 XPS 및 AES를 사용하였다. 질소 첨가량에 따라 합성된 막은 첨가하지 않은 경우에 다이아몬드 결정에서 시작하여 질소첨가에 따라 결정면이 깨지는 것으로 나타났다. 그러나 30%, 45%의 경우는 다시 결정면이 나타났다. 다량의 질소가 첨가되었을 때, 다시 결정면을 보이는 다이아몬드가 합성된 것은 매우 흥미로운 결과이다. 한편 질소와 메탄만의 기체하에서는 다시 결정면이 관찰되지 않았다. 이들 상의 구조는 XRD 및 TED 분석을 통해 모두 다이아몬드로 확인되었다. 기체내의 질소의 첨가에 관계없이 고상내에 질소는 확인되지 않았다. 따라서 이방법에 의한 CN 화합물의 합성은 힘든 것으로 보여진다. 이들 실험 결과를 근거로 온도 및 조성에 따른 기체의 열역학적 계산을 통하여 합성거동과의 연관성을 검토하였다. anode는 매우 높은 충전용량을 갖는데 첫 번째 방전시에 Li2O를 생성하여 비가역적 반응을 나타내고 계속되는 충방전 동안 Li-Sn 합금이 생성되어 2차전지의 가역적 반응을 가능하게 한다. SnO2 는 대기중에서 Li 금속보다 안정하기 때문에 전지의 제작 공정 및 사용 면에서 매우 우수한 물질이지만 아직까지 SnO2 구조적 특성과 전지의 충, 방전 특성에 대한 관계의 규명을 위한 정확한 정설은 제시되고 있지 못하다. 본 연구에서는 TFSB anode 물질로써 SnOx박막을 상온에서 여러 전도성 콜렉터 위에 증착하여 그 충, 방전 특성을 보고하였다. 증착된 SnOx박막의 표면은 SEM, AFM으로 분석하였으며 구조의 분석은 XR와 Auger electron spectroscope로 하였다. 충, 방전 특성을 분석하기 위하여 리늄 foil을 대극과 참조 전극으로 하여 EC:DMC=1:1, 1M LiPF6 액체 전해질을 사용한 Half-Cell를 구성하여 100회 이상의 정전류 충, 방전 시험을 행하였다. Half-Cell test 결과 박막의 구조, 콜렉터의 종류 및 Sn/O비에 따라 서로 다른 충, 방전 거동을 나타내었다.다. 거의 없었다. 5mTorr 일 때가 가장 좋았다.수 있음을 알 수 있었다. 그러므로, RNA바이러스의 하나인 BVDV의 viral replicon을 이용하여 다양한 종류의 포유동물 세포에 유전자 발현벡터로써 사용할 수 있음으로 post-genomics시대에 다양한 종류의 단백질 기능연구에 맡은 도움이 되리라 기대한다.다양한 기능을 가진 신소재 제조에 있다. 또한 경제적인 측면에서도 고부가 가치의 제품 개발에 따른 새로운 수요 창출과 수익률 향상, 기존의 기능성 안료를 나노(na

• Korean Journal of Materials Research
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• v.23 no.4
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• pp.227-232
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• 2013

Al-based alloys have recently attracted considerable interest as structural materials and light weight materials due to their excellent physical and mechanical properties. For the investigation of the potential of Al-based alloys, a surface porous $Al_{88}Cu_6Si_6$ eutectic alloy has been fabricated through a chemical leaching process. The formation and microstructure of the surface porous $Al_{88}Cu_6Si_6$ eutectic alloy have been investigated using X-ray diffraction and scanning electron microscopy. The $Al_{88}Cu_6Si_6$ eutectic alloy is composed of an ${\alpha}$-Al dendrite phase and a single eutectic phase of $Al_2Cu$ and ${\alpha}$-Al. We intended to remove only the ${\alpha}$-Al phase and then the $Al_2Cu$ phase would form a porous structure on the surface with open pores. Both acidic and alkaline aqueous chemical solutions were used with various concentrations to modify the influence on the microstructure and the overall chemical reaction was carried out for 24 hr. A homogeneous open porous structure on the surface was revealed via selective chemical leaching with a $H_2SO_4$ solution. Only the ${\alpha}$-Al phase was successfully leached while the morphology of the $Al_2Cu$ phase was maintained. The pore size was in a range of $1{\sim}5{\mu}m$ and the dealloying depth was nearly $3{\mu}m$. However, under an alkaline NaOH, aqueous solution, an inhomogeneous porous structure on the surface was formed with a 5 wt% NaOH solution and the morphology of the $Al_2Cu$ phase was not preserved. In addition, the sample that was leached by using a 7 wt% NaOH solution crumbled. Al extracted from the Al2Cu phase as ${\alpha}$-Al phase was dealloyed, and increasing concentration of NaOH strongly influenced the morphology of the $Al_2Cu$ phase and sample statement.

• Korean Journal of Materials Research
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• v.27 no.10
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• pp.557-562
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• 2017

The microstructural evolution and modulation of mechanical properties were investigated for a $Ti_{65}Fe_{35}$ hypereutectic alloy by addition of $Bi_{53}In_{47}$ eutectic alloys. The microstructure of these alloys changed with the additional BiIn elements from a typical dendrite-eutectic composite to a bimodal eutectic structure with primary dendrite phases. In particular, the primary dendrite phase changed from a TiFe intermetallic compound into a ${\beta}$-Ti solid solution despite their higher Fe content. Compressive tests at room temperature demonstrated that the yield strength slightly decreased but the plasticity evidently increased with an increasing Bi-In content, which led to the formation of a bimodal eutectic structure (${\beta}$-Ti/TiFe + ${\beta}$-Ti/BiIn containing phase). Furthermore, the (Ti65Fe35)95(Bi53In47)5 alloy exhibited optimized mechanical properties with high strength (1319MPa) and reasonable plasticity (14.2 %). The results of this study indicate that the transition of the eutectic structure, the type of primary phases and the supersaturation in the ${\beta}$-Ti phase are crucial factors for controlling the mechanical properties of the ultrafine dendrite-eutectic composites.