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http://dx.doi.org/10.6117/kmeps.2011.18.4.055

Thermoelectric Properties of the Hot-pressed Bi2(Te0.9Se0.1)3 with Dispersion of Tungsten Powders  

Roh, M.R. (Department of Materials Science and Engineering, Hongik University)
Choi, J.Y. (Department of Materials Science and Engineering, Hongik University)
Oh, T.S. (Department of Materials Science and Engineering, Hongik University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.18, no.4, 2011 , pp. 55-61 More about this Journal
Abstract
The n-type $Bi_2(Te_{0.9}Se_{0.1})_3$ powers were fabricated by mechanical alloying, mixed with tungsten(W) powders, and hot-pressed at $550^{\circ}C$ for 30 minutes. Thermoelectric properties of the hot-pressed $Bi_2(Te_{0.9}Se_{0.1})_3$ were characterized as a function of the volume percent of tungsten-powder addition. The power factor of the hot-pressed $Bi_2(Te_{0.9}Se_{0.1})_3$ was $21.9{\times}10^{-4}$ $W/m-K^2$, and was improved to $30.5{\times}10^{-4}$ $W/m-K^2$ by dispersion of 1 vol% W powders. While the dimensionless figure-of-merit of the $Bi_2(Te_{0.9}Se_{0.1})_3$ hot-pressed without dispersion of W powders was measured as 0.52 at room temperature, it became substantially enhanced to 0.95 with addition of 1 vol% W powders.
Keywords
Thermoelectric materials; $Bi_2(Te,Se)_3$; Power factor; Dimensionless figure-of-merit; Tungsten dispersion;
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