Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Thermoelectric Properties of the Hot-pressed Bi2(Te0.9Se0.1)3 with Dispersion of Tungsten Powders

텅스텐 분말을 분산시킨 Bi2(Te0.9Se0.1)3 가압소결체의 열전특성

  • Roh, M.R. (Department of Materials Science and Engineering, Hongik University) ;
  • Choi, J.Y. (Department of Materials Science and Engineering, Hongik University) ;
  • Oh, T.S. (Department of Materials Science and Engineering, Hongik University)
  • 노명래 (홍익대학교 공과대학 신소재공학과) ;
  • 최정열 (홍익대학교 공과대학 신소재공학과) ;
  • 오태성 (홍익대학교 공과대학 신소재공학과)
  • Received : 2011.12.19
  • Accepted : 2011.12.26
  • Published : 2011.12.30
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Abstract

The n-type $Bi_2(Te_{0.9}Se_{0.1})_3$ powers were fabricated by mechanical alloying, mixed with tungsten(W) powders, and hot-pressed at $550^{\circ}C$ for 30 minutes. Thermoelectric properties of the hot-pressed $Bi_2(Te_{0.9}Se_{0.1})_3$ were characterized as a function of the volume percent of tungsten-powder addition. The power factor of the hot-pressed $Bi_2(Te_{0.9}Se_{0.1})_3$ was $21.9{\times}10^{-4}$ $W/m-K^2$, and was improved to $30.5{\times}10^{-4}$ $W/m-K^2$ by dispersion of 1 vol% W powders. While the dimensionless figure-of-merit of the $Bi_2(Te_{0.9}Se_{0.1})_3$ hot-pressed without dispersion of W powders was measured as 0.52 at room temperature, it became substantially enhanced to 0.95 with addition of 1 vol% W powders.

n형 $Bi_2(Te_{0.9}Se_{0.1})_3$ 분말을 기계적 합금화 공정으로 제조하고 텅스텐 분말을 분산시켜 $550^{\circ}C$에서 30분간 가압소결 후, 텅스텐 함량에 따른 열전특성을 분석하였다. 텅스텐 분말을 분산시키지 않은 $Bi_2(Te_{0.9}Se_{0.1})_3$ 가압소결체의 상온 출력인자는 $21.9{\times}10^{-4}$ $W/m-K^2$ 이었으며, 1 vol% 텅스텐 분말의 분산에 의해 상온 출력인자가 $30.5{\times}10^{-4}$ $W/m-K^2$로 증가하였다. 텅스텐 분말을 분산시키지 않은 $Bi_2(Te_{0.9}Se_{0.1})_3$ 가압소결체는 상온에서 0.52의 무차원 성능지수를 나타내었으며, 1 vol% 텅스텐 분말의 분산에 의해 무차원 성능지수가 0.95로 크게 향상되었다.

Keywords

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