• Proceedings of the KIEE Conference
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• 2002.07c
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• pp.2026-2028
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• 2002

본 논문에서는 실리콘 기판상의 전송선로 특성을 개선하기 위하여 표면 마이크로머시닝 기술을 이용하여 $10{\mu}m$ 두께의 다공질 실리콘 산화막으로 제조된 기판 위에 에어브리지를 가진 CPW 전송선로와 phase shifter를 제작하였다. 간격이 $30{\mu}m$, 신호선이 $80{\mu}m$인 CPW 에어브리지 전송선의 삽입손실은 4 GHz에서 -0.25 dB이며, 반사손실은 -28.9 dB를 나타내었다. CPW phase shifter의 크기는 S-W-$S_g$ = 100-30-400 ${\mu}m$로 설계되었다. "ㄷ" 모양을 가진 에어브리지의 폭은 $100{\mu}m$. 길이는 400-460-400 ${\mu}m$이다. 낮은 손실을 얻기 위한 Step된 에어브리지를 가진 phase shifter 구조가 step이 없는 에어브리지를 가진 구조보다 삽입손실이 보다 더 향상되었다. 제작된 CPW phase shifter의 위상특성은 28 GHz의 넓은 주파수 범위에서 $180^{\circ}E 의 천이를 타나내었다. 이상과 같은 결과로부터 두꺼운 다공질 실리콘은 고 저항 실리콘 집적회로 공정에서 고성능 저가의 마이크로파 및 밀리미터파 회로 응용에 충분히 활용 될 수 있으리라 기대된다.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.10
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• pp.17-24
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• 2000

An area efficient and symmetric dual-level spiral inductor structure is proposed and evaluated in comparison with the conventional single-level spiral inductors. Contrary to the dual-level inductor mutual coupling coefficient of the upper-and lower-level inductors of the dual-level inductor increases with the increases in the number of turns. Because of this, for the same silicon area, the inductances of the dual-level incuctors are 2.5-4 times higher than that of the single-level inductor. Furthermore, the dual-level showed better quality factor that the single-level inductors for the same inductance. It is the intention of this paper to demonstrate that the dual-level can be more useful for the RF integrated circuits than the conventional single-level spiral inductors form the aspects of area efficiency and quality factor. The proposed dual-level inductors are designed and confirmed to be perfectly symmetric, and can also be used as a high-frequency choke.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.49 no.6
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• pp.1-8
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• 2012

This paper presents a fully-integrated buck converter equipped with packaging inductors. These inductors include parasitic inductances of the bonding wires and lead frames in the package. They have significantly better Q factors than the best on-chip inductors implemented on silicon. This paper also proposes a low-swing gate driver for efficient regulation of high-frequency switching converters. The low-swing driver uses the voltage drop of a diode-connect transistor. The proposed converter is designed and fabricated using a $0.13-{\mu}m$ CMOS process. The fully-integrated buck converter achieves 68.7% and 86.6% efficiency for 3.3 V/2.0 V and 2.8 V/2.3 V conversions, respectively.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.41 no.8
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• pp.19-26
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• 2004

High performance packages must provide excellent transmission characteristics. In face-up ceramic packages, however, parasitic characteristics of bondwires are not negligible at millimeter-wave frequencies. Consequently, the electrical performance of ceramic packages is degraded. In をis paper, we propose a new millimeter-wave ceramic package feed-through having Embedded Metal Sheets (EMS). The package that contains double-bondwire interconnections is analyzed by the FEM (Finite Element Method) and measured from 20 to 50GHz. As a result, the proposed package having Embedded Metal Sheets (EMS) achieved 0.85dB, 0.4dB insertion loss improvement on the conventional and the double bondwires buried in epoxy ( $\varepsilon_{{\gamma}}$/ = 4) ceramic package respectively to 47GHz. This improved ceramic package will be useful for MMICs modules and small ceramic packages developments.amic packages developments.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.12
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• pp.70-78
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• 2000

A novel capacitance deviation-to-time interval converter based on ramp-integration is presented. It consists of two current mirrors, two schmitt triggers, and control digital circuits by the upper and lower sides, symmetrically. Total circuit has been with discrete components. The results show that the proposed converter has a linearity error of less than 1% at the time interval(pulse width) over a capacitance deviation from 295 pF to 375 pF. A capacitance deviation of 40pF and time interval of 0.2 ms was measured for sensor capacitance of 335 pF. Therefore, the high-resolution can be known by counting the fast and stable clock pulses gated into a counter for time interval. The application of a novel capacitance deviation-to time interval converter to a digital humidity controller is also presented. The presented circuit is insensitive to the capacitance difference in disregard of voltage source or temperature deviation. Besides the accuracy, it features the small MOS device count integrable onto a small chip area. The circuit is thus particularly suitable for the on-chip interface.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.11
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• pp.23-30
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• 1998

The use of microstrip is very common for various passive microwave devices because of the rather simple and planar structure. However, many microstrip devices require fairly large surface areas, which results in real estate problems of finite substrates. In this paper, we proposed a perforated microstrip with longitudinal slow-wave effect and characterized experimentally and theoretically. The impedance matching to the reference impedance(50 $\Omega$) and the quality factor are greatly improved compared to the conventional slow-wave structure with modulated strip. Because of the structural simplicity, it can be easily applied to miniaturize many microstrip devices.

• Proceedings of the Korea Technology Innovation Society Conference
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• 1998.05a
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• pp.18-18
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• 1998

본 연구는 미 특허청(USPTO) 자료를 이용하여 기술활동이 가장 활발한 OECD국가를 중심으로 세부기술 부문별 기술활동의 유형을 분석하고자 하는 데에 목적을 두고 있다. 특히 OECD 국가들이 정보통신(IT) 기술에 있어 특정 기술분야로의 수렴화 경향을 보이는가 혹은 다양한 기술적인 분화현상을 보이는 가를 분석하는 것이 본 연구의 주요 관심사이다. 기존 연구들이 정보통신기술을 협의로 정의, 분석의 대상으로 삼아 왔으나, 본 고에서는 정보통신 분야를 보다 확대된 개념으로서 정의하고, 미국 특허청 자료(1985-1996)를 이용하여 정보통신 분야의 기술개발 활동의 특화현상을 분석하였다. 연구결과로서 정보통신(IT) 기술 분야에서는 기술적 수렴현상이 점차적으로 나타나고 있음을 확인할 수 있었다. 국가별 결과에 있어서는 서로 다른 유형이 관측되었는데 정보통신 산업에 있어서 유럽의 주요 국가들은 특허통계량이 감소하는 추세를 나타냈으며 기술추격(catch-up) 과정은 나타나지 않았음을 보여 주었다. 이와 반대로, 일본은 유럽의 주요 국가에 비하여 매우 특징적인 기술개발 유형을 나타내었다. 예를 들어, RTA지수는 일본이 정보처리기술, 컴퓨터시스템 및 단말기술, 집적회로 분야에 특화되어 있음을 나타냈다. 또한 캐나다와 한국도 특징적인 기술개발 경향을 나타내었는 바, 캐나다는 방송시스템 및 전송기술에서 기술적 강점을 지닌 것으로 분석되었으며 한국의 기술추격 분야는 방송시스템, 정보처리 및 반도체기술 분야인 것으로 나타났다.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.62 no.8
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• pp.1125-1131
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• 2013

Wireless power transmission technology has been studied variety. Recently, wireless power transmission technology used by resonance and magnetic induction field is applied to various fields. However, magnetic resonance and inductive coupling are have drawbacks - power transmission distance is short. Microwave transmission and accept techniques have been developed to overcome short distance. However, improvement in efficiency is required. This paper, propose a high-efficiency microwave energy acceptor IC(EAIC). Suggested EAIC is consists of RF-DC converter and DC-DC converter. Wide Input power range is -15 dBm ~ 20 dBm. And output voltage is boosted up to 5.5 V by voltage boost-up circuit. EAIC can keep the output voltage constant. Available efficiency of RF-DC converter is 95.5 % at 4 dBm input. And DC-DC efficiency is 94.79 % at 1.1 mA load current. Fully EAIC efficiency is 90.5 %.

• 전자공학회논문지 IE
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• v.45 no.2
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• pp.13-19
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• 2008

The main advantage of the TLM analysis method is the ease with which even the most complicated transmission line structures. In this paper, using symmetrical condensed node(SCN), the TLM numerical technique has been successfully a lied to microstrip meander line. A detailed technique of the symmetrical condensed node(SCN) may be used to model planar microstrip transmission line is presented. Also, the S-parameters $S_{11}$ and $S_{21}$ of two types of microstrip meander line have been computed. From obtained results, TLM analysis is shown to be an efficient method for modeling complicated structure of planar microstrip transmission line. The TLM results presented here are useful in the design of microwave integrated circuits at higher frequencies region.

• Journal of Advanced Marine Engineering and Technology
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• v.32 no.6
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• pp.964-973
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• 2008

In this study, a short-wavelength coplanar-type transmission line employing periodic ground structure (PGS) was developed for application to miniaturized on-chip passive component on Si Radio Frequency Integrated Circuit (RFIC). The transmission line employing PGS showed shorter wavelength and lower characteristic impedance than conventional coplanar-type transmission line. The wavelength of the transmission line employing PGS structure was 57 % of the conventional coplanar-type transmission line on Si substrate. Using the theoretical analysis. basic characteristics of the transmission line employing PGS (e.g., bandwidth. loss, impedance, and resonance characteristics) were also investigated in order to evaluate its suitability for application to a development of miniaturized passive on-chip components on silicon RFIC. According to the results. the bandwidth of the transmission line employing PGS was more than 895 GHz as long as T is less than 20${\mu}m$, and the resonance characteristic was observed in 1239 GHz, which indicates that the PPGM structure is a promising candidate for application to a development of miniaturized on-chip passive components on Si RFIC.