• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.23.2-23.2
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• 2009

기존에 사용되었던 알루미늄 배선 공정은 공정의 배선 크기가 줄어들면서 한계에 다다르고 있다. 따라서 이를 대체하기 위해 여러 가지 새로운 방법들이 고안되고 있으며, 그중 알루미늄을 비저항이 낮고 EM(electro-migration) 저항성이 뛰어난 구리로 대체하려는 연구가 진행되고 있다. 구리 배선은 이미 electroplating 공정을 이용해 산업에 적용되고 있으며, seed layer로는 sputtering 법을 이용하고 있다. 하지만 sputtering 을 포함한 PVD 법은 대부분 종횡비나 단차 피복도가 좋지 않기 때문에 이를 CVD로 교체한다면 많은 장점을 가질 수 있다. 하지만 CVD 공정을 진행하기 위해서는 많은 문제점들이 있는데, 이중 전구체에 대한 문제도 빼놓을 수 없는 이슈이다. Cu(dmamb)2 는 기존에 사용하던 $\beta$-diketonate 계열의 전구체보다 화학적으로 많은 장점을 가지고 있어, CVD 공정에 적합하다. 이에 따라 구리 박막 증착의 공정 조건을 설계하고, 고품질의 박막을 증착하기 위한 다양한 처리법을 고안하여 증착 실험을 진행하였다. 기본적으로 구리는 확산력이 좋아 실리콘계열의 기판에서 확산력이 매우 좋아 기판 내로 확산되기 때문에 이를 방지하기 위하여 Ta, Ti 계열의 박막을 사용하여 확산을 방지하고 있다. 따라서 전이 금속 박막의 표면과 증착 분위기 등을 고려하여 구리를 증착하였으며, 표면의 미세구조 및 성분을 FESEM 등을 통해 분석하였다.

• Polymer(Korea)
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• v.35 no.1
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• pp.47-51
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• 2011

In this study, illite, an environmental friendly, low cost, and high aspect ratio additive, was used to improve flame retardant property of epoxy and it was fluorinated to enhance dispersion of hydrophilic illite in hydrophobic epoxy by introducing hydrophobic functional groups. Fluorination of illite enhanced illite dispersion ill epoxy solution before curing and that in the complex after curing. These enhanced dispersions were attributed to the increased affinity of illite to hydrophobic epoxy solution induced by fluorination of illite and the increased intercalation of epoxy polymer or exfoliation of illite by epoxy curing. Hence, limited oxygen index(LOI) of fluorinated illite/epoxy complex increased by 24%, compared to that of epoxy, suggesting that the preparation of fluorinated illite/epoxy complex increased their flame retardant properties.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.41 no.6
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• pp.423-427
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• 2017

In this paper, an anchor design that improves bonding strength uniformity in the silicon-on-glass (SOG) process is presented. The SOG process is widely used in conjunction with electrode-patterned glass substrates as a standard fabrication process for forming high-aspect-ratio movable silicon microstructures in various types of sensors, including inertial and resonant sensors. In the proposed anchor design, a trench separates the silicon-bonded area and the electrode contact area to prevent irregular bonding caused by the protrusion of the electrode layer beyond the glass surface. This technique can be conveniently adopted to almost all devices fabricated by the SOG process without the necessity of additional processes.

• Journal of Sensor Science and Technology
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• v.9 no.5
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• pp.380-388
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• 2000

The finite element analysis of a micro turbine was made to investigate safety margin of its operating condition for the high aspect ratio nickel micro turbine blades fabricated by conventional LIGA-like method. From our study, we found that the fabricated turbine could not exceed its yield strength even if the pressure difference between inlet and outlet of turbine blade was about 44kPa, and the correlation of friction coefficient and the maximum stress, caused by contact friction between outer diameter of shaft and inner diameter of turbine blade, was somewhat reciprocal. The maximum stress was decreased with the increasing contact friction, when turbine blade was in its state of rotation. By the results of our study, we conclude that it is possible to fabricate metal micro turbine more easily han surface micromachining technology and to operate with no risk of metal structure's damage, which is caused by yield strength, if the operating condition with the design of micro turbine itself are optimized. It is useful to adopt other applications which have the contact problems between a moving part and the fixed one in micro structures.

• Elastomers and Composites
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• v.45 no.2
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• pp.80-86
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• 2010

Carbon nanotubes (CNTs) exhibit excellent mechanical, electrical, and magnetic properties as well as nanometer scale diameter and high aspect ratio, which make them an ideal reinforcing agent for high strength polymer composites. The functionalized CNTs are believed to be very promising in the fields such as preparation of functional and composite materials. CNT-Polymer composites are expected to have good processability characteristics of the polymer and excellent functional properties of the CNTs. However, since CNTs usually form stabilized bundles due to Van der Waals interactions, are extremely difficult to disperse and align in a polymer matrix. The biggest issues in the preparation of CNT-reinforced composites reside in efficient dispersion of CNTs into a polymer matrix, and the alignment and control of the CNTs in the matrix. There are several methods for the dispersion of nanotubes in the polymer matrix such as solution mixing, bulk mixing, melt mixing, in-situ polymerization and chemical functionalization of the carbon nanotubes, etc. These methods and preparation of high performance CNT-polymer composites are described in this review.

• Journal of the Korean institute of surface engineering
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• v.47 no.2
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• pp.68-74
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• 2014

The seed step-coverage enhancement process (SSEP) using Pd/Cu/PVP colloids was investigated for the filling of through silicon via (TSV) without void. TEM analysis showed that the Pd/Cu nano-particles were well dispersed in aqueous solution with the average diameter of 6.18 nm. This Pd/Cu nano-particles were uniformly deposited on the substrate of Si/$SiO_2$/Ti wafer using electrophoresis with the high frequency Alternating Current (AC). After electroless Cu deposition on the substrate treated with Pd/Cu/PVP colloids, the adhesive property between deposited Cu layer and substrate was evaluated. The Cu deposit obtained by SSEP with Pd/Cu/PVP colloids showed superior adhesion property to that on Pd ion catalyst-treated substrate. Finally, by implementing the SSEP using Pd/Cu/PVP colloids, we achieved 700% improvement of step coverage of Cu seed layer compared to PVD process, resulting in void-free filling in high aspect ratio TSV.

• Journal of the Semiconductor & Display Technology
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• v.20 no.1
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• pp.70-76
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• 2021

A cylindrical microlens (CML) has been widely used as an optical element for organic light-emitting diodes (OLEDs), light diffusers, image sensors, 3D imaging, etc. To fabricate high-performance optoelectronic devices, the CML with high aspect ratio is demanded. In this work, we report on facile solution-based processes (i.e., slot-die and needle coatings) to fabricate the CML using poly(methyl methacrylate) (PMMA). It is found that compared with needle coating, slot-die coating provides the CML with lower aspect ratio due to the wide spread of solution along the hydrophilic head lip. Although needle coating provides the CML with high aspect ratio, it requires a high precision needle array module. To demonstrate that the aspect ratio of CML can be enhanced using slot-die coating, we have varied the molecular weight of PMMA. We can achieve the CML with higher aspect ratio using PMMA with lower molecular weight at a fixed viscosity because of the higher concentration of PMMA solute in the solution. We have also shown that the aspect ratio of CML can be further boosted by coating it repeatedly. With this scheme, we have fabricated the CML with the width of 252 ㎛ and the thickness of 5.95 ㎛ (aspect ratio=0.024). To visualize its light diffusion property, we have irradiated a laser beam to the CML and observed that the laser beam spreads widely in the vertical direction of the CML.

• Journal of the Korean Electrochemical Society
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• v.2 no.4
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• pp.237-241
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• 1999

The characteristics of copper thin films and via hole filling capability were investigated by pulsed electrodeposition method. Especially, the effects of additives on the properties of copper thin films were studied. Copper films, which were deposited by pulsed electrodeposition using commercial additives, had low tensile stress value under 83.4 MPa and high preferred Cu (111) texture. Via holes with $0.25{\mu}m$ in diameter and 6 : 1 aspect ratio were successfully filled without any defects by superfilling. It was observed that copper microstructure deformed by twining. After heat treatment at $500^{\circ}C$ for 1 k in vacuum furnace, grain size was 1 or 2 times as large as film thickness and the bamboo structure was formed. Heat treated copper films showed good resistivities of $1.8\~2.0{\mu}{\Omega}{\cdot}cm$.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.19-24
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• 2009

Formation of an adhesion/barrier layer and a seed layer by sputtering techniques followed by electroplating has been one of the most widely used methods for the filling of through-Si via (TSV) with high aspect ratio for 3-D packaging. In this research, the adhesion and diffusion-barrier properties of the $TaN_x$ film deposited by reactive sputtering were investigated. The adhesion strength between Cu film and $SiO_2$/Si substrate was quantitatively measured by $180^{\circ}$ peel test and topple test as a function of the composition of the adhesive $TaN_x$ film. As the nitrogen content increased in the adhesive $TaN_x$ film, the adhesion strength between Cu and $SiO_2$/Si substrate increased, which was attributed to the increased formation of interfacial compound layer with the nitrogen flow rate. We also examined the diffusion-barrier properties of the $TaN_x$ films against Cu diffusion and found that it was improved with increasing nitrogen content in the $TaN_x$ film up to N/Ta ratio of 1.4.

• Journal of the Korean Electrochemical Society
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• v.4 no.2
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• pp.47-52
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• 2001

AAO template having nano scale pores of high aspect ratio has been prepared through anodizing of aluminum foil in sulfuric acid electrolyte. The effect of anodizing parameters on the pore size and distribution was also examined to obtain the proper AAO as a template material of nanowire. The surface of AAO template prepared was observed by SEM to examine the mean size and distribution of pores generated by the anodizing and Fe nanowires obtained by AC electroforming using AAO template were also observed with TEM to determine the length and shape of them. From the results of work, it was found that the mean size or distribution of pores was influenced significantly by the anodizing parameters such as voltage and temperature of electrolyte. Mean length and aspect ratio of Fe nanowires prepared in the work were found to be $10{\mu}m\;and\;300\;to\;1,000$, respectively.