• Journal of the Microelectronics and Packaging Society
• /
• v.22 no.1
• /
• pp.43-49
• /
• 2015

By the trends of electronic package to be smaller, thinner and more integrative, organic printed circuit board is required to be finer Cu trace pitch. This paper reports on a study of failure mechanism for PCB with fine Cu trace pitch using biased HAST. In weibull analysis of the biased HAST lifetime, it is found that the acceleration factor (AF) of between $135^{\circ}C/90%RH/3.3V$ and $130^{\circ}C/85%RH/3.3V$ is 2.079. A focused ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the failure mode. It is found that $Cu_xO/Cu(OH)_2$ colloids and Cu dendrites were formed at anode (+) and at cathode (-), respectively. Thus, this gives the evidence that Cu dendrites formed at cathode by $Cu^{2+}$ ion migration lead to a short failure between a pair of Cu nets.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2014.02a
• /
• pp.456.2-456.2
• /
• 2014

Cu(In,Ga)Se2 (CIGS) 화합물은 태양광을 흡수하기에 가장 이상적인 약 1.04 eV의 에너지 금지대 폭과 높은 광흡수계수를 가지고 있으며, $450{\sim}590^{\circ}C$의 고온 공정에도 매우 안정하여 열 경화현상을 거의 보이지 않으므로 박막 태양전지로서 커다란 응용 잠재력을 갖고 있는 광흡수층 재료이다. CIGS 화합물 박막 태양전지의 효율은 연구실에서는 ~20%의 높은 효율을 보고하고 있으며, 모듈급에서도 ~13%의 효율을 보이고 있다. 그러나 CIGS 박막 태양전지를 대면적 또는 양산화에 적용하기 위해서는 20년 이상의 장기적인 수명을 보장할 수 있는 내구성을 갖추어야 한다. 본 연구에서는 CIGS 모듈의 장기적인 신뢰성을 평가하기 위해 CIGS PV 모듈을 대상으로 IEC-61646 규격을 이용하여 고온고습 시험 ($85^{\circ}C$/85% RH, 1000 h) 과 열충격 시험 ($-40^{\circ}C/140^{\circ}C$, 1000 cycles) 이 수행되었고, 두 종류의 가속 스트레스 시험 후에 모듈의 성능 저하에 영향을 미치는 요인들이 연구되었다. 또한, 모듈의 효율 저하의 원인을 규명하기 위해 투명전극 Al-doped ZnO (AZO)와 광흡수층 CIGS를 대상으로 고장분석을 수행하였다. AZO층과 CIGS층의 전기적 특성 분석, 결장상 분석 및 XPS 분석들을 종합하여 CIGS PV 모듈의 성능저하의 원인을 규명하였다.

• Korean Journal of Materials Research
• /
• v.8 no.5
• /
• pp.399-407
• /
• 1998

본 연구에서는 LCD패키지용 이방성 전도 필름의 전기적, 기계적 특성 및 신뢰성에 미치는 접속 변수의 영향을 연구하였다. 이방성 전도 필름을 통한 전기적 전도 현상을 각각의 도전 입자와 기판 사이의 기계적 접촉에 의해 접촉 방향으로만 전류가 흐르게 되는 것이 주되는 전도 기구이다. 따라서 접속 압력에 따라 각각의 도전 입자의 변형으로 기판 사이의 접촉 면적이 변하는데 이방성 전도필름의 접촉 저항은 이런 접촉 변화에 의해 결정된다. 접속 압력에 따라 초기에 접촉 저항은 감소하다가 점차 접촉 저항기가 안정화되는 거동을 보였다. 그러나 높은 접속 압력에서는 오히려 저항치가 약간 증가함을 보였다. 이방성 전도 필름 접속의 접착력을 평가하기 위해 필 테스트(peel test)를 시행하였는데, 접속 압력과 접속 온도를 증가 시킬수록 이방성 전도 필름 접속의 접착력을 평가하기 위해 고온 시효 시험, 온도 사이클링 시험, 고온 고습 시험의 신뢰성 시험을 시행하였으며, 이중 고온 고습 시험이 ACF접속의 전기적, 기계적 특성에 가장 악영향을 주었다. 또 큰 압력으로 접속된 것보다 작은 압력으로 접속되었을 때, 그리고 도전입자로는 금속 코팅 된 폴리머 입자가 사용될 때 신뢰성이 상대적으로 좋은 것을 발견했다.

• Journal of the Microelectronics and Packaging Society
• /
• v.23 no.2
• /
• pp.49-55
• /
• 2016

The effects of post-annealing and temperature/humidity conditions on the interfacial adhesion energies of atomic layer deposited RuAlO diffusion barrier layer for Cu interconnects were systematically investigated. The initial interfacial adhesion energy measured by four-point bending test was $7.60J/m^2$. The interfacial adhesion energy decreased to $5.65J/m^2$ after 500 hrs at $85^{\circ}C$/85% T/H condition, while it increased to $24.05J/m^2$ after annealing at $200^{\circ}C$ for 500 hrs. The X-ray photoemission spectroscopy (XPS) analysis showed that delaminated interface was RuAlO/$SiO_2$ for as-bonded and T/H conditions, while it was Cu/RuAlO for post-annealing condition. XPS O1s peak separation results revealed that the effective generation of strong Al-O-Si bonds between $AlO_x$ and $SiO_2$ interface at optimum post-annealing conditions is responsible for enhanced interfacial adhesion energies between RuAlO/$SiO_2$ interface, which would lead to good electrical and mechanical reliabilities of atomic layer deposited RuAlO diffusion barrier for advanced Cu interconnects.

• Journal of the Microelectronics and Packaging Society
• /
• v.24 no.1
• /
• pp.75-81
• /
• 2017

The effects of KOH pretreatment and annealing conditions on the interfacial adhesion and the reliability between epoxy resin and polyimide substrate in the flexible printed circuit board were quantitatively evaluated using $180^{\circ}$ peel test. The initial peel strength of the polyimide without the KOH treatment was 29.4 g/mm and decreased to 10.5 g/mm after 100hrs at $85^{\circ}C/85%$ R.H. temperature/humidity treatment. In case of the polyimide with annealing after KOH treatment, initial peel strength was 29.6 g/mm and then maintained around 27.5 g/mm after $85^{\circ}C/85%$ R.H. temperature/humidity treatment. Systematic X-ray photoelectron spectroscopy analysis results showed that the peel strength after optimum annealing after KOH treatment was maintained high not only due to effective recovery of the polyimide damage by the polyimide surface treatment process, but also effective removal of metallic ions and impurities during various wet process.

• Journal of the Microelectronics and Packaging Society
• /
• v.30 no.2
• /
• pp.52-59
• /
• 2023

The effects of dielectric curing temperature and temperature/humidity treatment conditions on the interfacial adhesion energies between Ti diffusion barrier/polybenzoxazole (PBO) dielectric layers were systematically investigated for Cu redistribution layer applications of fan-out wafer level package. The initial interfacial adhesion energies were 16.63, 25.95, 16.58 J/m² for PBO curing temperatures at 175, 200, and 225 ℃, respectively. X-ray photoelectron spectroscopy analysis showed that there exists a good correlation between the interfacial adhesion energy and the C-O peak area fractions at PBO delaminated surfaces. And the interfacial adhesion energies of samples cured at 200 ℃ decreased to 3.99 J/m² after 500 h at 85 ℃/85 % relative humidity, possibly due to the weak boundary layer formation inside PBO near Ti/PBO interface.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2012.05a
• /
• pp.1223-1224
• /
• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2010.05a
• /
• pp.1331-1332
• /
• 2010

• Journal of Bio-Environment Control
• /
• v.18 no.2
• /
• pp.160-165
• /
• 2009

This study was undertaken the effect of high temperature and high humidity on protein expression and especially plasma membrane (PM) $H^{+}ATPase$ of umbel with flowers of early cultivar 'Shinsunhwang' and intermediate cultivar 'Maebsihwang' of onion (Allium cepa L.). There were no visible any difference on the protein pattern from before flowering stage to full flowering stage of two onion cultivars, however, seed set stages were revealed induced/deduced protein patterns. At day 18, protein expression pattern of the high temperature and high humidity treatments of two cultivars was significantly reduced compared to controls. Furthermore, various protein expression of the high temperature treatment was more reduced compared to high humidity treatment. PM $H^{+}ATPase$ expression of the control plants of two onion cultivars was clearly shown, but was not detectable under high temperature treatment of the two onion cultivars using western blot analysis. PM $H^{+}ATPase$ expression of the high humidity treatment was faintly detected intermediate cultivar 'Maebsihwang', not early cultivar 'Shinsunhwang'. These results indicate that protein expression pattern and PM $H^{+}ATPase$ under high temperature treatment was considered to be more damaged compared to high humidity.

• Transactions of the Korean Society of Automotive Engineers
• /
• v.8 no.6
• /
• pp.247-258
• /
• 2000

It is thought that impact damages and hygrothermals can affect to CFRP (Carbon-fiber reinforced plastic) composite laminated due to the sensitivity on the composite laminated Therefore, this paper focuses on the fracture mechanisms experimentally based on a scanning acoustic microscope (SAM) when subjected to impact damages, i.e., foreign object damages(FOD), and also the influence of impact damages and hygrothermals on residual fatigue bending strength of CFRP laminates. Composite laminates used in the experiment are CF/EPOXY orthotropy laminated plates, which constist of two-interfaces [04/904]s. A steel ball launched by an air gun collides against CFRP laminates to generate impact damages. Bending fatigue tests are periodically interrupted for a nondestructive evaluation (NDE) measurement of the progrossive damages to built the fracture mechanism by impact damages, and three-point fatigue bending tests are carried out to investigate the influence of hygrothermals on the effect on the residual bending fatigue strength of CFRP laminates.