• Title/Summary/Keyword: 고분자 복합재료

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Directed Assembly of Block Copolymers for Defect-Free Nanofabrication (블록공중합체 자기조립제어를 통한 무결함 나노구조제작)

  • Shin, Dong-Ok;Jeong, Seong-Jun;Kim, Bong-Hoon;Lee, Hyung-Min;Park, Seung-Hak;Xia, Guodong;Nghiem, Quoc Dat;Kim, Sang-Ouk
    • Korean Chemical Engineering Research
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    • v.46 no.1
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    • pp.1-6
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    • 2008
  • Block copolymers spontaneously assemble into various nanoscale structures such as spheres, cylinders, and lamellar structures according to the relative volumn ratio of each macromolecular block and their overall molecular weights. The self-assembled structures of block copolymer have been extensively investigated for the applications such as nanocomposites, photonic crystals, nanowires, magnetic-storage media, flash memory devices. However, the naturally formed nanostructures of block copolymers contain a high density of defects such that the practical applications for nanoscale devices have been limited. For the practical application of block copolymer nanostructures, a robust process to direct the assembly of block copolymers in thin film geometry is required to be established. To exploit self-assembly of block copolymer for the nanotechnology, it is indispensible to fabricate defect-free self-assembled nanostructure over an arbitrarily large area.

A Molecular Dynamics Simulation Study on the Thermoelastic Properties of Poly-lactic Acid Stereocomplex Nanocomposites (분자동역학 전산모사를 이용한 폴리유산 스테레오 콤플렉스 나노복합재의 가수분해에 따른 열탄성 물성 예측 연구)

  • Ki, Yelim;Lee, Man Young;Yang, Seunghwa
    • Composites Research
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    • v.31 no.6
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    • pp.371-378
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    • 2018
  • In this study, the thermoelastic properties of poly lactic acid (PLA) based nanocomposites are predicted by molecular dynamics (MD) simulation and a micromechanics model. The stereocomplex mixed with L-lactic acid (PLLA) and D-lactic acid (PDLA) is modeled as matrix phase and a single walled carbon nanotube is embedded as reinforcement. The glass transition temperature, elastic moduli and thermal expansion coefficients of pure matrix and nanocomposites unit cells are predicted though ensemble simulations according to the hydrolysis. In micromechanics model, the double inclusion (D-I) model with a perfect interface condition is adopted to predict the properties of nanocomposites at the same composition. It is found that the stereocomplex nanocomposites show prominent improvement in thermal stability and interfacial adsorption regardless of the hydrolysis. Moreover, it is confirmed from the comparison of MD simulation results with those from the D-I model that the interface between CNT and the stereocomplex matrix is slightly weak in nature.

A Review on Zeolite-based Ceramic Membrane for Oil/Water Separation (기름/물 분리를 위한 제올라이트 기반의 세라믹 분리막에 대한 총설)

  • Lee, Joo Yeop;Rajkumar, Patel;Kim, Jong Hak
    • Membrane Journal
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    • v.32 no.2
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    • pp.83-90
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    • 2022
  • Wastewater from refineries and petroleum plant lead to severe environmental pollution. There are various existing processes applied for oily water treatment, but membrane-based technology is one of the most efficient methods. Polymeric membranes prepared from organic materials for the separation of oil in water often face chronic problem of membrane fouling. Inorganic membranes are considered to be more efficient due to longer lifetime than organic membranes. Zeolite membranes have better chemical stability and long-term recyclability. The presence of hydrophilicity enhances the water flux of membrane. Ceramic membranes prepared from zeolites are another efficient class of inorganic membranes applied for oil water separation. This review is focused on oily wastewater separation based on zeolite membrane which classified into two categories, i) neat zeolite and ii) zeolite composites with other materials.

Analysis of Material Properties According to Compounding Conditions of Polymer Composites to Reduce Thermal Deformation (열변형 저감을 위한 고분자 복합소재 배합 조건에 따른 재료특성 분석)

  • Byun, Sangwon;Kim, Youngshin;Jeon, Euy sik
    • Journal of the Semiconductor & Display Technology
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    • v.21 no.1
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    • pp.148-154
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    • 2022
  • As the 4th industrial age approaches, the demand for semiconductors is increasing enough to be used in all electronic devices. At the same time, semiconductor technology is also developing day by day, leading to ultraprecision and low power consumption. Semiconductors that keep getting smaller generate heat because the energy density increases, and the generated heat changes the shape of the semiconductor package, so it is important to manage. The temperature change is not only self-heating of the semiconductor package, but also heat generated by external damage. If the package is deformed, it is necessary to manage it because functional problems and performance degradation such as damage occur. The package burn in test in the post-process of semiconductor production is a process that tests the durability and function of the package in a high-temperature environment, and heat dissipation performance can be evaluated. In this paper, we intend to review a new material formulation that can improve the performance of the adapter, which is one of the parts of the test socket used in the burn-in test. It was confirmed what characteristics the basic base showed when polyamide, a high-molecular material, and alumina, which had high thermal conductivity, were mixed for each magnification. In this study, functional evaluation was also carried out by injecting an adapter, a part of the test socket, at the same time as the specimen was manufactured. Verification of stiffness such as tensile strength and flexural strength by mixing ratio, performance evaluation such as thermal conductivity, and manufacturing of a dummy device also confirmed warpage. As a result, it was confirmed that the thermal stability was excellent. Through this study, it is thought that it can be used as basic data for the development of materials for burn-in sockets in the future.

Poly(ethylene terephthalate) Nanocomposite Fibers with Thermally Stable Organoclays (내열성 유기화 점토를 이용한 폴리(에틸렌 테레프탈레이트) 나노복합체 섬유)

  • Jung, Min-Hye;Chang, Jin-Hae
    • Polymer(Korea)
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    • v.31 no.6
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    • pp.518-525
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    • 2007
  • The thermomechanical properties and morphologies of nanocomposite fibers of poly(ethylene terephthalate)(PET) incorporating thermally stable organoclays are compared. Dodecyltriphenyl-phosphonium-mica($C_{12}PPh-Mica$) and 1-hexadecane benzimidazole-mica ($C_{16}BIMD-Mica$) were used as reinforcing fillers in the fabrication of PET hybrid fibers. Dispersions of organoclays with PET were studied by using the in-situ polymerization method at various organoclay contents to produce nano-scale composites. The thermo-mechanical properties and morphologies of the PET hybrid fibers were determined using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), wide angle X-ray diffraction (XRD), electron microscopy (SEM and TEM), and a universal tensile machine (UTM). Transmission electron microscopy (TEM) micrographs show that some of the clay layers are dispersed homogeneously within the polymer matrix on the nano-scale, although some clay particles are agglomerated. We also found that the addition of only a small amount of organoclay is enough to improve the thermal stabilities and mechanical properties of the PET nanocomposite fibers. Even polymers with low organoclay content (<5 wt%) were found to exhibit much higher thermo-mechanical values than pure PET fibers.

Effect of ,Shear Stress on the Viscosity and Electrical Conductivity for the Metal-Filled Composite Materials (금속입자 충전 복합재료의 전단응력에 따른 점도 및 전기 전도도 변화)

  • Lee, Geon-Woong;Choi, Dong-uk;Lee, Sang-Soo;Kim, Jun-Kyung;Park, Min
    • Polymer(Korea)
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    • v.26 no.5
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    • pp.644-652
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    • 2002
  • This study aims at developing the conductive pastes consisting of room temperature vulcanizing (RTV) silicone and metal powder as matrix and filler, respectively. Electrical and rheological properties of metal - filled polymer composites are in general strongly affected by particle shape, side and dispersion state of the filler. In highly filled systems, particles tend to form very complex agglomerated structure which is easily changed when subjected to shear deformation. And the breakdown of agglomerated particles due to shear usually leads to the change of electrical conductivity of the composite. In this study, the effect of particle size and dispersion state of filler on the electrical conductivity of the composites are investigated to offer the selection criteria of conductive filler by measuring the rheological properties of uncured composites and the electrical conductivity of the cured composites. It was found that the type of metal filler systematically affected the rheological property, the susceptibility to shear and the degree of change of electrical conductivity of the composite. The effect of shear on the properties is more conspicuous in the composites containing large particle, indicating that both rheological and electrical properties can be improved by controlling the dispersion state at a given filler content.

Functionalized Graphene/Polyimide Nanocomposites under Different Thermal Imidization Temperatures (열 이미드화 온도에 따른 작용기화 그래핀/폴리이미드 나노복합재료)

  • Ju, Jieun;Chang, Jin-Hae
    • Polymer(Korea)
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    • v.39 no.1
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    • pp.88-98
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    • 2015
  • 4-Amino-N-hexadecylbenzamide-graphene sheets (AHB-GSs), used in the preparation of the polyimide (PI) nanocomposite films, were synthesized by mixing a dispersion of graphite oxide with a solution of the ammonium salt of AHB. The atomic force microscope image of functionalized-GS on mica and a profile plot revealed the average thickness of AHB-GS to be ~3.21 nm. PI films were synthesized by reacting 4,4'-biphthalic anhydride and bis(4-aminophenyl) sulfide. PI nanocomposite films containing various contents of AHB-GS over the range of 0-10 wt% were synthesized using the solution intercalation method. The PI nanocomposite films under different thermal imidization temperatures, 250 and $350^{\circ}C$, were examined. The graphenes, for the most part, were well dispersed in the polymer matrix despite some agglomeration. However, micrometer-scale particles were not detected. The average thickness of the particles was <10 nm, as revealed from the transmission electron microscope images. Only a small amount of AHB-GS was required to improve the gas barrier, and electrical conductivity. In contrast, the glass transition and initial decomposition temperatures of the PI hybrid films continued to decrease with increasing content of AHB-GS up to 10 wt%. In general, the properties of the PI hybrid films heat treated at $350^{\circ}C$ were better than those of films heat treated at $250^{\circ}C$.

Fabrication and Characteristics of Shielding Effects for the Complex Conductive Filler (복합 전도성 필러의 제작과 전자파 차폐 특성)

  • Park, Ju-Tae;Park, Jae-Sung;Do, Young-Soo
    • 전자공학회논문지 IE
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    • v.43 no.4
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    • pp.122-127
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    • 2006
  • A series of conductive filler were prepared with electroless plating method. Base conductive materials of the filler were nickel and copper. The cores were prepared with Nylon 6 and rayon in different aspect ratio. Also, various complexes were made with ABS resin and conductive filler with different filler feed ratio. The conductivity of the filler was measured with conductivity analyzer and the size distributions of fillers was measured with laser particle size analyzer. Electromagnetic wave shielding efficiency of each complex film was measured with flange circular coaxial transmission line sample holder within the 1MHz$\sim$1GHz bandwidth range. From this study, the conductivity of filers surpass that of other carbon films. It is available that the filler made of fibrous materials can be applied in plastic molding industry of electric appliances as a EMI filler.

Adhesion Improvement of Electroless Copper Plated Layer on PET Film - Effect of Pretreatment Conditions - (무전해 동도금 피막의 접착력 향상에 관한 연구 - PET 필름의 전처리 조건의 영향 -)

  • 오경화;김동준;김성훈
    • Polymer(Korea)
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    • v.25 no.2
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    • pp.302-310
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    • 2001
  • Cu/PET film composites were prepared by electroless copper plating method. In order to improve adhesion between electroless Cu plated layer and polyester (PET) film, the effect of pretreatment conditions such as etching method and mixed catalyst composition, and accelerator was investigated. Compared to NaOH etching medium, PET film was more finely etched by HCl solution, resulting in an improvement in adhesion between Cu layer and PET film. However, there were no significant differences in electromagnetic interference shielding effectiveness as a function of etching medium. The surface morphology of Cu plated PET film revealed that Pd/Sn colloidal particles became more evenly distributed in the smaller size by increasing the molar ratio of PdCl$_2$ : SnCl$_2$ from 1 : 4 to 1 : 16. With increasing the molar ratio of mixed catalyst, the adhesion and the shielding effectiveness of Cu plated PET film were increased. Furthermore, HCl was turned out to be a better accelerator than NaOH in order to enhance the activity of the mixed PdCl$_2$/SnCl$_2$ catalyst, which facilitated the formation of more uniform copper deposit on the PET film.

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Effect of SMA on the Interfacial Shear Strength for Single Glass Fiber and PC/SAN Blends (SMA가 PC/SAN 블렌드와 유리섬유간의 계면결합력에 미치는 영향)

  • Lee, Ui-Hwan;Nam, Gi-Jun;Lee, Jae-Uk
    • Polymer(Korea)
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    • v.25 no.4
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    • pp.512-520
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    • 2001
  • One of the most important factors which affect the mechanical properties of fiber-reinforced composite materials is the interfacial shear strength (IFSS). The IFSS of glass fiber and polycarbonate (PC)/styrene-co-acrylonitrile (SAN) blend system has been measured by the single fiber fragmentation test (SFFT). SAN contents were varied up to 30 wt% and the IFSS increased with the SAN contents. Styrene-co-maleic anhydride (SMA) was used as the compatibilizer and the glass fiber was surface treated with organosilane coupling agents. Addition of small amount of SMA in PC/SAN blend improved the IFSS by chemical bonding between maleic anhydride and silanol. The optimum MA content was 0.4 wt% of total matrix contents. Also, IFSS was greatly affected by the miscibility condition of SAN/SMA blends, which depended on the copolymer composition of SAN and SMA. It was found out that, higher IFSS could be obtained when the SAN/SMA blend was in miscible pairs. In case of SAN/SMA miscible pairs, the IFSS depended on the MA content in total matrix, not on the MA content in SMA.

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