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Fabrication and Characteristics of Shielding Effects for the Complex Conductive Filler  

Park, Ju-Tae (Dept. of Electronic & Information Engineering, YNC)
Park, Jae-Sung (Dept. of Electronic & Information Engineering, YNC)
Do, Young-Soo (Dept. of Electronic Engineering, YNU)
Publication Information
전자공학회논문지 IE / v.43, no.4, 2006 , pp. 122-127 More about this Journal
Abstract
A series of conductive filler were prepared with electroless plating method. Base conductive materials of the filler were nickel and copper. The cores were prepared with Nylon 6 and rayon in different aspect ratio. Also, various complexes were made with ABS resin and conductive filler with different filler feed ratio. The conductivity of the filler was measured with conductivity analyzer and the size distributions of fillers was measured with laser particle size analyzer. Electromagnetic wave shielding efficiency of each complex film was measured with flange circular coaxial transmission line sample holder within the 1MHz$\sim$1GHz bandwidth range. From this study, the conductivity of filers surpass that of other carbon films. It is available that the filler made of fibrous materials can be applied in plastic molding industry of electric appliances as a EMI filler.
Keywords
EMI filler; electroless plating method; conductive filler; fibrous materials;
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