• Clean Technology
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• v.12 no.4
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• pp.205-210
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• 2006

In this study, polystyrene hollow microspheres were prepared via optimized purifying steps for the reuse of waste polystyrene. PS/PVA double layered hollow microspheres were prepared using the multiple emulsion ($W_1/O/W_2$) method with recycled polystyrene. The sonication treatment at the first stage of $W_1/O$ emulsion formation was very important factor of control of particle size and its distribution. When sonication was treated for 20 seconds, the average particle size and distribution were $1.35{\mu}m$ and $0.8{\mu}m{\sim}2.8{\mu}m$, respectively. The double layered hollow microspheres that have smaller and uniformed particle size distribution were manufactured when gelatin or Tween 80 was used as surfactants in the $W_2$ phase.

• Korean Journal of Materials Research
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• v.5 no.5
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• pp.560-567
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• 1995

Interfacial reactions, phase equilibria and elecrrical properties of Co films on (001) oreinted GaAs substrate, in the temperature range 300-$700^{\circ}C$ for 30min. have been investigated using x-ray diffraction and Augger electron spectropcopy. Cobalt started to react with GaAs at 38$0^{\circ}C$ by formation of Co$_{2}$GaAs phase. At 42$0^{\circ}C$, CoGa and CpAs nucleated at the Co and Co$_{2}$GaAs interface and grew with Co$_{2}$GaAs upto 46$0^{\circ}C$. contacts produced in this annealing regime were rectifying and Schottky varrier heights increased from 0.688eV(as-deposite state) up to 0.72eV(42$0^{\circ}C$). In the subsequent reation, the ternary phase started to decompose and lost stoichiometry at 50$0^{\circ}C$. At higher temperature, Co$_{2}$GaAs disappered and CoGa/CoAs/GaAs layer structures were formed. Contacts produced at higher temperature regime(>50$0^{\circ}C$) showed very low effective barriers. The results of interfacial reactions can be understood from the Co-Ga-As ternary phase diagram.

• Journal of the Korean Magnetics Society
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• v.11 no.5
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• pp.217-221
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• 2001

We made magnetite which was prepared with mixed liquids of Fe$\^$2+/and Fe$\^$3+/ added to the 3N-NaOH by coprecipitation reaction. Ahead of making magnetite, we investigated variation of physical properties for changing Fe$\^$2+/ : Fe$\^$3+/. Through the variation of the process temperature, we examined physical properties of magnetite. Also, to examine possibility of magnetic fluids, from magnetite manufactured in this way, we examined the crystal structure by X-ray diffraction pattern. The saturated magnetization $\sigma$$\_$s/, value has 60.8 emu/g, when Fe$\^$2+/ to Fe$\^$3+/ ratio is 0.46 : 0.54 in the synthetic magnetite. Keeping the condition, when the synthetic temperature is kept at 80$\^{C}$ for 30 minutes, we get $\sigma$$\_$s/, value 63.51 emu/g. It shows that $\sigma$$\_$s/, value is bigger as the synthetic temperature is higher.

• Journal of Welding and Joining
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• v.14 no.4
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• pp.99-108
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• 1996

The microstructure and bond strength are examined on the SiC/SiC and SiC/mild steel joints brazed by the Ag-Ti based alloys with different Ti contents. In the SiC/SiC brazed joints, the thickness of the reaction layers at the bond interface and the Ti particles in the brazing alloy matrices increase with Ti contents. When Ti is added up to 9 at% in the brazing alloy. $Ti_3SiC_2$ phase in addition to TiC and $Ti_5Si_3$ phase is newly created at the bond interface and TiAg phase is produced from peritectic reaction in the brazing alloy matrix. In the SiC/mild steel joints brazed with different Ti contents, the microstructure at the bond interface and in the brazing alloy matrix near SiC varies similarly to the case of SiC/SiC brazed joints. But, in the brazing alloy matrix near the mild steel, Fe-Ti intermetallic compounds are produced and increased with Ti contents. The bond strengths of the SiC/SiC and SiC/mild steel brazed joints are independent on Ti contents in the brazing alloy. There are no large differences of the bond strength between SiC/SiC and SiC/mild steel brazed joints. In the SiC/mild steel brazed joints, Fe dissolved from the mild steel does not affect on the bond strength of the joints. Thermal contraction of the mild steel has nearly no effects on the bond strength due to the wide brazing gap of specimens used in the four-point bend test. The brazed joints has the average bond strength of about 200 MPa independently on Ti contents, Fe dissolution and joint type. Fracture in four-point bend test initiates at the interface between SiC and TiC reaction layer and propagates through SiC bulk. The adhesive strength between SiC and TiC reaction layer seems to mainly control the bond strength of the brazed joints.

• Polymer(Korea)
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• v.37 no.4
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• pp.547-552
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• 2013

Polyimide (PI) containing carboxyl functional group was prepared and reacted with diaminosiloxane during high temperature film casting. The morphology of resulting film was observed by using transmission electron microscopy (TEM) and energy dispersive X-ray spectroscopy (EDX), which revealed that globular 100 nm-sized PI domains and continuous polysiloxane phase were formed. X-ray photoelectron spectroscopy (XPS) study indicated that air-film interface mainly consisted of polysiloxane blocks. Poly(imidesiloxane) thin layer was thermostable until $400^{\circ}C$ and its pressure- sensitive adhesive property was retained up to $300^{\circ}C$. The comparative experiments revealed that grafting between carboxyl groups of polyimide and aminosiloxane was crucial for formation of microdomain structure and pressure-sensitive adhesive property.

• Polymer(Korea)
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• v.37 no.4
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• pp.500-506
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• 2013

The effect of compatibilizer types on the properties of polyphenylene sulfide (PPS)/polyethylene terephthalate (PET) blends was investigated. The blends were extruded by a single screw extruder attached with a Maddock mixing zone and their molded properties were examined. As a basic blend composition, a linear PPS/PET (40/60) blend was selected based on cost efficiency. Three types of compatibilizer, SEBS, modified SEBS, and modified PS were added to the basic blend to improve the properties. The thermal, rheological, mechanical properties and the morphology of the ternary blends were analyzed. The maximum mechanical properties of blends was found at 1 phr of m-SEBS or m-PS content, whose values were almost the same as the theoretical values of miscible blend system. It seemed to by the case that the partial reaction between compatibilizer and the basic blend caused the enhancement of compatibility between linear PPS and PET phases. These ternary blends would be applicable as economic linear PPS alloys.

• Journal of the Korean Electrochemical Society
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• v.14 no.1
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• pp.50-55
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• 2011

To enhance the performance of a MEA (membrane electrode assembly) in a polymer electrolyte membrane fuel cell (PEMFC), optimum contents of Nafion ionomer as electrolyte in the 20 and 40 wt% Pt/C used in electrodes were examined. Variety characterization techniques were applied to examine optimum Nafion contents: cell performance test, electrochemical impedance spectroscopy (EIS), and cyclic voltammetry (CV). According to Pt wt% supported on carbon support, it has been observed that polarization, ohmic, and mass transfer resistances were changed so that the cell performance was significantly dependent on the content of Nafion ionomer. Optimum Nafion ionomer contents in the 20 wt% Pt/C and 40 wt% Pt/C were showed 35 wt% and 20 wt%, respectively. This is due to different surface area of the Pt/C catalyst, and formation of triple phase boundary seems to be affected by the Nafion contents.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.2
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• pp.69-74
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• 1999

Graphite and carbonaceous materials intercalate and deintercalate Li-ion reversibly into their layered structures. These materials show an excellent capacity for using a negative electrode in Li-ion batteries, because the electrochemical potential of Li-ion intercalated carbon is almost identical with that of lithium metal. Carbon used in this study was obtained by the pyrolysis of petroleum pitch, and heat-treated at the several temperatures between $700^{\circ}C$ and $1300^{\circ}C$. XRD analysis revealed that crystallization of carbon increased with increasing the heat treatment temperature. Charge/discharge properties were studied by a constant-current step at the rate of 0.1C, and the interfacial reaction between the electrolyte and the surface of carbon electrode was studied by cyclic voltammetry. Cell capacities were investigated in terms of the heat treatment temperature and the cycle number. Reversible capacity increased with the heat treatment temperature up to $1000^{\circ}C$, thereafter decreased continuously. Also, charge capacity decreased with the cycle number, while the reversibility improved with it.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.81-88
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• 2010

Thermal annealing and electromigration test were performed at $150^{\circ}C$ and $4{\times}10^3\;A/cm^2$ conditions in order to investigate the effect of PCB surface finishs on the growth kinetics of intermetallic compound (IMC) in Sn-3.0Ag-0.5Cu solder bump. The surface finishes of the electrodes of printed circuit board (PCB) were organic solderability preservation (OSP), immersion Sn, and electroless Ni/immersion gold (ENIG). During thermal annealing, the OSP and immersion Sn show similar IMC growth velocity, while ENIG surface finish had much slower IMC growth velocity. Applying electric current accelerated IMC growth velocity and showed polarity effect due to directional electron flow.

• Journal of Korea Foundry Society
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• v.22 no.2
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• pp.89-96
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• 2002

This study examined the effects of adding Zn to Sn-3.5Ag solder on the microstructure changes and behavior of interface reaction of the solder joint with Cu substrate. The solder/Cu joints were examined with microscope to observe the characteristics of microstructure changes and interfacial reaction layer with aging treatment for up to 120 days at $150^{\circ}C$. Results of the microstructure changes showed that the microstructures were coarsened with aging treatment, while adding 1%Zn suppresses coarsening microstructures. The Sn-3.5Ag/Cu had a fast growth rate of the reaction layer in comparison with the Sn-3.5Ag-1Zn at the aging temperature of $150^{\circ}C$. Through the SEM/EDS analysis of solder joint, it was proved that intermetallic layer was $Cu_6Sn_5$ phase and aged specimens showed that intermetallic layer grew in proportion to $t^{1/2}$, and the precipitate of $Ag_3Sn$ occur to both inner layer and interface of layer and solder. In case of Zn-containing composite solder, $Cu_6Sn_5$ phase formed at the side of substrate and Cu-Zn-Sn phase formed at the other side in double layer. It seems that Cu-Zn-Sn phase formed at solder side did a roll of banrier to suppress the growth of the $Cu_6Sn_5$ layer during the aging treatment.