• Composites Research
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• v.37 no.5
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• pp.381-385
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• 2024

Spent coffee grounds (SCG) are one of the most common waste products contributing to environmental problems, with their volume continuously increasing. The most efficient way to utilize SCG is by leveraging their large amounts of organic matter and oils for energy production. This study investigates the recycling potential of cellulosic structures after the removal of organic matter and oils. Surface changes in the organic matter of SCG were examined as a function of washing time using FE-SEM, FT-IR, and XRD. As washing time increased, significant changes in particle size were observed, and the tensile properties were evaluated at varying concentrations to assess their suitability as a reinforcing material in epoxy composites. The study found that the reinforcement effect of SCG was minimal under conditions of high polymer crystallinity, indicating that a minimal organic layer is necessary to promote interfacial adhesion between SCG and epoxy. Ultimately, it was determined that SCG is best used in epoxy composites at concentrations of 1 wt% or less. This research provides a potential method for recycling various types of coffee grounds.

• Applied Chemistry for Engineering
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• v.35 no.4
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• pp.303-308
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• 2024

Currently, lithium secondary batteries have been used as medium- or large-sized energy sources such as electric vehicles and energy storage system (ESS) due to their high energy and eco-friendly characteristics. Currently commercialized lithium secondary batteries do not fully meet the demands for high energy density and safety. Many studies on solid electrolytes are being conducted to satisfy these requirements. In order to commercialize a solid electrolyte, it is important to supplement the low ion conductivity and high interface resistance with an electrode compared to the organic liquid electrolyte. Therefore, in this study, oligo(3,4-ethylenedioxythiophene (EDOT)) is added to poly(vinyl alcohol) (PVA), which is a polymer matrix with ion conductivity and sticky characteristics, to decrease the interfacial resistance with the same type of polythiophene (PTh)-based electrode. In addition, the addition of porous silicon dioxide (SiO₂) filler improves lithium salt dissociation ability and increases ionic conductivity. And the electrochemical stability of the solid electrolyte, which has been lowered due to additives, is improved by introducing a cross-linked structure using boric acid (BA).

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.405-405
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• 2016

CIGS 박막 태양전지에서 완충층으로 사용되는 ZnS는 단파장 영역에서 높은 투과도와 CIGS 계면과의 좋은 접착을 가지고 친환경적이며 3.74eV의 에너지 밴드갭을 가지고 있기 때문에 CdS를 사용했을 때 보다 더 넓은 에너지 영역의 광자를 p-n 접합 경계 영역으로 통과 시킬 수 있고 Cd-free 물질이라는 점에서 기존의 CdS 완충층의 대체 물질로 각광 받고 있다. 본 연구에서는 CIGS 박막에 화학습식공정 방법을 이용하여 최적화된 ZnS 박막의 증착 조건을 찾기 위해 실험 변수인 시약의 농도, 실험온도, 열처리 조건 등의 다양한 변화를 통해 실험을 진행하였고, 박막의 갈라짐과 pin-hole 현상을 개선하고 균일한 막을 제조하기 위해 구연산 나트륨 농도에 따른 ZnS 박막의 특성을 연구하였다. 본 실험 결과로서 실험변수인 황산아연의 농도 0.15M, 암모니아는 0.3M, 티오요소 1M, 공정 온도 $80^{\circ}C$의 최적화 된 조건에서 가장 좋은 품질의 ZnS 박막을 제조하였지만, ZnS 박막의 열처리 후 산소의 양이 줄어감에 따라 박막의 표면이 갈라지고 pin-hole 현상이 발생하는 것을 확인할 수 있었다. 박막의 품질을 개선하기 위해 구연산 나트륨을 첨가하여 실험한 결과 구연산 나트륨의 0.05M의 농도에서는 박막 표면에 90nm의 갈라짐의 크기와 pin-hole 현상이 남아있는 것을 확인하였고, 농도가 높아질수록 점차 크기가 줄어들면서 0.4M에서는 갈라짐이 거의 없는 표면과 pin-hole 현상도 없어지는 것을 확인하였고, 약 144nm의 박막 두께와 3.8eV의 에너지 밴드갭을 가지고, 약 81%의 높은 광투과율을 갖는 고품질의 ZnS 박막을 제작할 수 있었다.

• Restorative Dentistry and Endodontics
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• v.29 no.1
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• pp.13-22
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• 2004

본 연구는 치수강 상아질 부위 및 상아질 접착제 종류에 따른 결합 강도를 측정하고 이들 사이의 상관관계를 구명하고자 시행되었다 45개의 대구치를 포매 후, 대조군에서는 교합면 법랑질 제거 후 ＃600 SiC paper까지 순차연마하여 상아질을 노출시켰고, 실험군에서는 치수강 개방 후 1시간동안 NaOCl에 보관 후 axial wall과 pulpal floor를 노출시켰다. 노출된 상아질 면에 상아질 접착제를 적용한 후 Z-100을 충전한 다음 40초간 광중합하였다. 사용된 상아질 접착제는 Scotchbond Multi-Purpose와 Single Bond, Clearfil SE Bond였다. $37^{\circ}C$ 증류수에 24시간 보관 후, 저속 diamond saw를 이용하여 0.7mm 두께로 수직절단하고 고속 diamond point(#104)로 단면적 $1{mm}^2$가 되도록 시편을 제작하고, Universal testing machine에서 미세인장 결합강도를 측정하였다. 1. 모든 상아질 접착제의 미세인장강도는 대조군, axial wall군, pulpal floor군 순으로 감소하는 경향을 보였다. 2. 대조군에서 SM과 BB는 SE에 비해 유의성 있게 높은 결합강도를 나타내었다(p<0.05). 3. SM과 SB는 대조군에 비해 axial wall군과 pulpal floor군에서 유의성있게 낮은 결합강도를 보였으나, SE에서는 pulpal floor군만이 유의성 있게 낮은 결합강도를 보였다(p<0.05). 4. Axial wall군과 pulpal floor군에서는 상아질 접착제의 종류에 따른 유의차를 보이지 않았다. 5. 전자현미경 소견에서는 대조군에 비해 axial wall군과 pulpal floor군이 더 부드러운 접착 계면을 나타내었다. 혼성층의 두께는 결합강도의 감소와는 관련이 없었다.

• Korean Journal of Materials Research
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• v.20 no.6
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• pp.319-325
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• 2010

3-D IC integration enables the smallest form factor and highest performance due to the shortest and most plentiful interconnects between chips. Direct metal bonding has several advantages over the solder-based bonding, including lower electrical resistivity, better electromigration resistance and more reduced interconnect RC delay, while high process temperature is one of the major bottlenecks of metal direct bonding because it can negatively influence device reliability and manufacturing yield. We performed quantitative analyses of the interfacial properties of Al-Al bonds with varying process parameters, bonding temperature, bonding time, and bonding environment. A 4-point bending method was used to measure the interfacial adhesion energy. The quantitative interfacial adhesion energy measured by a 4-point bending test shows 1.33, 2.25, and $6.44\;J/m^2$ for 400, 450, and $500^{\circ}C$, respectively, in a $N_2$ atmosphere. Increasing the bonding time from 1 to 4 hrs enhanced the interfacial fracture toughness while the effects of forming gas were negligible, which were correlated to the bonding interface analysis results. XPS depth analysis results on the delaminated interfaces showed that the relative area fraction of aluminum oxide to the pure aluminum phase near the bonding surfaces match well the variations of interfacial adhesion energies with bonding process conditions.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.57-57
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• 2009

반도체 device가 고집적화 및 다층화 되어짐에 따라 현재 사용되고 있는 구리 interconnect의 확산방지막인 Ta/TaN은 많은 문제가 발생하고 있다. 고집적화 된 반도체 소자에 적용시키기에는 Ta/TaN 확산 방지막의 고유 저항값이 매우 크고, 구리의 증착에 필요한 seed layer의 크기도 문제화 된다고 보고되어지고 있다. 이러한 이유로 인해 점차 고집적화 되어지는 반도체 기술에 맞추어 새로운 확산 방지막에 대한 연구가 현재 활발히 이루어지고 있다. 이에 새로운 확산 방지막으로써 대두되고 연구되고 있는 재료가 Ruthenium (Ru)이다. Ru은 공기 중에서 매우 안정하고 고유저항 값 또한 $13\;{\mu}{\Omega}\;cm$의 Ta에 비해 $7.1\;{\mu}{\Omega}\;cm$의 매우 작은 고유저항 특성을 가지고 있다. 또한, Ru은 구리와의 우수한 접착성으로 인해 구리의 interconnect의 형성에 있어 seed layer가 필요하지 않을 뿐만 아니라 높은 annealing 온도에서도 무시할 만큼 작은 solid solubility를 가지며 구리와의 계면에서 새로운 화합물을 형성하지 않으며 annealing시 구리의 delamination을 유발시키지도 않는다. 이에 따라, 평탄화와 소자 분리를 위하여 chemical mechanical planarization (CMP) 공정이 필요하게 되었다. 하지만, Ru의 noble한 성질과 Ru 확산방지막 CMP공정 시 노출되는 다른 이종 물질 사이의 최적화 된 selectivity를 구현하는데 많은 어려움이 있다. 이로인해 Ru 확산 방지막을 위한 CMP slurry에 대한 연구는 아직 미흡한 수준이다. 본 연구에서는 Ru이 확산방지막으로 사용되었을 때 이를 위한 CMP slurry에 대한 평가와 연구가 이루어졌다. Slurry 조성과 농도 및 pH에 따른 전기 화학적 분석을 통하여 slurry 내에서 각각의 막질들이 어떠한 상태로 존재하는지 분석해 보았다. 또한, Ru을 비롯한 이종막질들의 etch rate, removal rate와 selectivity에 대한 연구가 진행되었다. 최종적으로 Ru 확산방지막 CMP를 위한 최적화된 slurry를 제안하였다.

• Journal of the Korean Society of Clothing and Textiles
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• v.34 no.11
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• pp.1889-1899
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• 2010

This study examines the preparation and characterization of Kenaf/Starch bio-composites used as filler and a matrix. Kenaf was cultivated in Chung-ju in Korea, and the Kenaf/Starch bio-composites were prepared under various conditions of kenaf fiber length (1-5 centimeters); the content of Kenaf fiber was 10%, 20%, 30%, and 40%, and the number of composite layers (one-four). Depending on the formation conditions of Kenaf/Starch composites, the physical properties such as tensile strength, elongation, and the young modulus of the Kenaf/Starch composites were measured. In addition, we measured the SEM cross-section images in order to investigate the interfacial adhesion properties of fractured surfaces. As a result, the tensile strength and elongation of the Kenaf/Starch composites were highest in the molding conditions of a hot press at $120^{\circ}C$, 3000PSI of pressure, and for 30 minute periods. The result of measuring the physical properties of the composites manufactured by varying the content of Kenaf fiber when the content of Kenaf fiber was 30% as well the physical properties of the Kenaf/Starch composite was found desirable. It was found that the physical properties improved with more overlapped layers in the composites manufactured by varying the number of overlapped layers. Through the measuring of the SEM cross-section images, we found that the interfacial adhesion state between the filler and matrix of Kenaf/Starch composite greatly affects the physical properties.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.10 no.2
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• pp.412-417
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• 2009

In order to investigate the effective sericin fixation of raw silk fibers the influence of various additives added to the melamine and formalin mixtures on sericin fixation was studied. When raw silk fibers were treated with wetting agent but without subsequent washing before sericin fixation, the strong sericin fixation was obtained by fixing sericin. Adding hydrogen peroxide to the melamine and formalin mixture made sericin fixation worse, resulting weaken the sericin hardness of fixed raw silk fibers and tight bonding of the fibers. On the other hand, it was confirmed that adding sodium hydrosulfite to the melamine and formalin mixtures gave better sericin hardness of fixed raw silk fibers without the bonding of fibers. Supplying additional melamine with he low concentration of sodium hydroxide to the melamine and formalin mixture(melamine:formalin= 1:6) resulted in very good sericin fixation. But adding hydrochloric acid or methanol to the same mixture had no effect on the sericin fixation, and adding magnesium chloride to it made the hardness of sericin fixation even worse.

• Textile Coloration and Finishing
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• v.30 no.2
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• pp.77-89
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• 2018

In the case of fiber/rubber composites for tire applications, the interfacial adhesion between fiber and rubber significantly affects the physical properties of the finished products. Generally, organic synthetic fibers used for tire cords are treated with resorcinol formaldehyde latex(RFL) primer on the surface of the fiber to improve the adhesion to rubber. Changes of adhesion between rubber and tire cords might weaken as temperature rises due to overheating of car engine and friction with road. In this study, the effects of temperature on the primer treated polyketone cord/rubber composites and the changes in interfacial adhesion were investigated. Polyketone cord/rubber composites were prepared after RFL solution treatment on the surface of polyketone fibers. After that, composites was thermally aged at different temperature conditions(60, 80, 100, $120^{\circ}C$) and times(1, 5, 10, 15days). The adhesion strength of polyketone cord/rubber composite treated with RFL primer was higher than untreated composite by more than 3 times. After heat aging, the adhesion strength of untreated polyketone cord/rubber composites increased while the RFL treated polyketone cord/rubber composites decreased somewhat.

• Journal of the Korean Wood Science and Technology
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• v.42 no.4
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• pp.483-490
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• 2014

The effect of microfibrillated cellulose (MFC) content and coupling agent (polymeric methylene diphenyl diisocyanate, pMDI) on the properties of MFC-reinforced polybutylene succinate (PBS) nanocomposite. With increasing MFC content, tensile strength and elastic modulus were increased. More than 1.5 times in tensile strength of PBS/MFC(70/30) nanocomposite was improved by the addition of pMDI (1 phr), compared to the nanocomposite without pMDI. This trend was being significant in nanocomposite with higher MFC content. Thermal stability of the nanocomposite was increased by the addition of pMDI. These improvements is considered to be due to the improvement of MFC dispersion and interfacial adhesion between MFC and PBS matrix.