• Title/Summary/Keyword: 경화 상수

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Air detector using the change of dielectric constant for medical applications (의료분야 응용을 위한 유전상수 변화를 이용한 공기감지 장치)

  • Kim, Kyung-Hwa;Shim, Joon-Hwan
    • Journal of Advanced Marine Engineering and Technology
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    • v.34 no.6
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    • pp.864-870
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    • 2010
  • Air embolism can be a lethal complication of surgical procedures during which venous pressure at the site of surgery is sub-atmospheric or air is forced under pressure into a body cavity. To solve the problem, we developed the air detector using relative dielectric constant change, which is expected to be used broadly in industrial circles. We designed air detection system with air control equipment, detection circuit and LabVIEW system for air sensing. In experiments with a mock system, the proposed system showed a signal difference depending on the amount of air in the Tygon tube of the mock system.

Study on Characteristics of Controlled Low Strength Material Using Time Domain Reflectometry (시간영역반사법을 이용한 유동성 채움재의 특성 연구)

  • Han, Woojin;Lee, Jong-Sub;Byun, Yong-Hoon;Cho, Samdeok;Kim, Juhyong
    • Journal of the Korean GEO-environmental Society
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    • v.17 no.4
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    • pp.33-37
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    • 2016
  • The hydration process of Controlled Low Strength Material (CLSM) used for backfill is the primary factor to determine the construction period. The objective of this study is to monitor the hydration process of CLSM using the Time Domain Reflectometry (TDR) and to establish the relationship between dielectric constant and compressive strength. The CLSM specimen is composed of cement, flyash, silt, sand, accelerator, and water. The material characteristics of the CLSM including flow, unit weight, compressive strength are investigated. To measure the dielectric constant of the CLSM during the curing time, TDR probe incorporated with a mold and a reflectometer are used. Experimental results show that the dielectric constant remains constant at early stage, and then decreases as the curing time increases. In addition, the dielectric constant is related to the compressive strength in inverse power function. This paper suggests that the TDR technique may be used as a non-destructive testing method in order to estimate the compressive strength of the CLSM mixture under construction.

Thermal, Mechanical, and Electrical Properties of Fluorine-Containing Epoxy Resins (불소함유 에폭시 수지의 열적, 기계적 및 전기적 특성)

  • 박수진;김범용;이재락;신재섭
    • Polymer(Korea)
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    • v.27 no.3
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    • pp.183-188
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    • 2003
  • The dielectric constants of fluorine-containing epoxy resins, 2-diglycidylether of benzotrifluoride(FER)/4,4'-diamino-diphenyl methane (DDM) and diglycidylether of bisphenol-A (DGEBA)/DDM systems were evaluated by dielectric spectrometer. Glass transition temperature and thermal stability factors, including initial decomposed temperature, temperatures of maximum rate of degradation, and decomposition activation energy of the cured specimens were investigated by dynamic mechanical analysis and thermogravimetric analysis. For the mechanical properties of the casting specimens, the fracture toughness, flexural, and impact tests were performed, and their fractured surfaces were examined by scanning electron microscope. The dielectric constant of FER/DDM system was lower than that of commercial DGEBA/DDM system, and the mechanical properties of the cured specimens showed higher values than those of DGEBA/DDM system. This was probably due to the introduction of trifluoromethyl (CF$_3$) group into the side chain of the epoxy resins, resulting in improving the electric and mechanical properties of the epoxy cure system studied.

Study of Organic-inorganic Hybrid Dielectric for the use of Redistribution Layers in Fan-out Wafer Level Packaging (팬 아웃 웨이퍼 레벨 패키징 재배선 적용을 위한 유무기 하이브리드 유전체 연구)

  • Song, Changmin;Kim, Sarah Eunkyung
    • Journal of the Microelectronics and Packaging Society
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    • v.25 no.4
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    • pp.53-58
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    • 2018
  • Since the scaling-down of IC devices has been reached to their physical limitations, several innovative packaging technologies such as 3D packaging, embedded packaging, and fan-out wafer level packaging (FOWLP) are actively studied. In this study the fabrication of organic-inorganic dielectric material was evaluated for the use of multi-structured redistribution layers (RDL) in FOWLP. Compared to current organic dielectrics such as PI or PBO an organic-inorganic hybrid dielectric called polysilsesquioxane (PSSQ) can improve mechanical, thermal, and electrical stabilities. polysilsesquioxane has also an excellent advantage of simultaneous curing and patterning through UV exposure. The polysilsesquioxane samples were fabricated by spin-coating on 6-inch Si wafer followed by pre-baking and UV exposure. With the 10 minutes of UV exposure polysilsesquioxane was fully cured and showed $2{\mu}m$ line-pattern formation. And the dielectric constant of cured polysilsesquioxane dielectrics was ranged from 2.0 to 2.4. It has been demonstrated that polysilsesquioxane dielectric can be patterned and cured by UV exposure alone without a high temperature curing process.

Solventless UV Curable Material for Low Cost System (저에너지 UV 경화형 무용제 소재 개발)

  • KIM, KWANGIN;LEE, JUHEON;LEE, HYUNJU;HAN, HAKSOO
    • Journal of Hydrogen and New Energy
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    • v.28 no.1
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    • pp.77-84
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    • 2017
  • In this study, Poly-urethane acrylate (PUA) was synthesized by the reaction between Polycaprolactonetriol (PCLT) and Isophorone dissocyanate (IPDI) and hybridized with inorganic materials. Tetraethylortho silicate (TEOS) and nano clay (Closite 20A) were used as inorganic particles. For the hybridization of TEOS with PUA, sol-gel method is used, in which TEOS is made into spherical particle in the firsthand. In the case of Nano clay, hybridization is carried out through the dispersion as Nano clay has a layered structure. The solution of PUA hybrid was made into a film after UV curing and its thermo and electrical properties were measured. The experimental analysis and result demonstrate that the PUA hybrid shows an improved thermal properties and lower dielectric constant than that of the non-hybrid PUA. The trend of improved properties was different depending on structure of inorganic materials.

Study of the Curing Reaction Rate of a Glass Fiber Reinforced Bisphenol-A (BPA) Epoxy Prepreg by Differential Scanning Calorimetry (DSC) (Differential Scanning Calorimetry (DSC)를 이용한 유리섬유 Bisphenol-A(BPA)계 에폭시 프리프레그의 경화 반응 속도 연구)

  • Kwon, Hyeon-Jin;Park, Hee-Jung;Lee, Eun-Ju;Ku, Sang-Min;Kim, Seon-Hong;Lee, Kee-Yoon
    • Composites Research
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    • v.31 no.1
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    • pp.30-36
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    • 2018
  • The curing behavior of glass fiber reinforced epoxy prepregs based on Bisphenol-A (BPA) was studied by differential scanning calorimetry (DSC). The total heat of reaction(${\Delta}H_{total}=280.3J/g$) was determined based on the results of the dynamic heating scanning experiments. Isothermal experiments were carried out at $110{\sim}130^{\circ}C$, and it was observed that the maximum conversion and the maximum reaction rate were increased as temperature increased. Also Kamal equation was applied to analyze autocatalytic reaction of epoxy prepregs. The higher temperatures, the greater reaction rate constants ($k_1$, $k_2$). Theoretical values were calculated by these reaction rate constants and compared with experimental values. And it was confirmed that they were in reasonable agreement. At the beginning of the reaction, the experimental data and theoretical prediction were shown the same tendency, but at the end of reaction, the experimental data were smaller than theoretical predicted values due to reaction rates controlled by diffusion.

Study on the Material Parameter Extraction of the Overlay Model for the Low Cycle Fatigue(LCF) Analysis (저주기 피로해석을 위한 다층모델의 재료상수 추출에 관한 연구)

  • Kim, Sang-Ho;Kabir, S.M. Humayun;Yeo, Tae-In
    • Transactions of the Korean Society of Automotive Engineers
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    • v.18 no.1
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    • pp.66-73
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    • 2010
  • This work was focused on the material parameter extraction for the isothermal cyclic deformation analysis for which Chaboche(Combined Nonlinear Isotropic and Kinematic Hardening) and Overlay(Multi Linear Hardening) models are normally used. In this study all the parameters were driven especially based on Overlay theories. A simple method is suggested to find out best material parameters for the cyclic deformation analysis prior to the isothermal LCF(Low Cycle Fatigue) analysis. The parameter extraction was done using 400 series stainless steel data which were published in the reference papers. For simple and quick review of the parameters extracted by suggested method, 1D FORTRAN program was developed, and this program could reduce the time for checking the material data tremendously. For the application to FE code ABAQUS user subroutine for the material models was developed by means of UMAT(User Material Subroutine), and the stabilized hysteresis loops obtained by the numerical analysis were in good harmony with test results.

Prediction of the Reduction in J-R Curve of Stainless Steel Weld with Thermal Embrittlement Using Micro-indentation Test (마이크로 압입 시험을 이용한 용접 스테인리스강의 열취화에 따른 J-R 곡선 저하 예측)

  • Ji Su Kim;Yoo Jin Kim;Seok Min Hong;Gyeong Geun Lee;Jong Min Kim;Min Chul Kim
    • Transactions of the Korean Society of Pressure Vessels and Piping
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    • v.20 no.2
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    • pp.85-96
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    • 2024
  • In this paper, a method to quantitatively predict the reduction in fracture resistance with thermal embrittlement using micro indentation test. The change in hardness of δ-ferrite with thermal embrittlement is characterized using a concept of hardening constant. Then, thermal embrittlement constant to predict the reduction in fracture resistance with thermal embrittlement is derived from the relation between hardening constant and thermal embrittlement constant. Finally, the reduction in fracture resistance with thermal embrittlement is predicted by multiplying thermal embrittlement constant obtained from micro indentation test by J-R curve of unaged material. The validity of the hardening constant concept is confirmed by comparing the prediction and experimental results.

Properties of Polyamide Modified PVC-sol Sealants (II) (폴리아미드가 함유된 PVC졸 실란트의 물성 (II))

  • Lee, Seung-Jin;Kim, Hyun-Kyo;Park, Hwan-Man;Cho, Won-Jei;Ha, Chang-Sik
    • Elastomers and Composites
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    • v.34 no.1
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    • pp.53-64
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    • 1999
  • The mechanical, electrical, and thermal properties of polyamide-modified poly (vinyl chloride) (PVC)-sol was investigated. PVC-sol was plasticized with dioctyl phthalate (DOP). In this work, the effects of the addition of polyamide on the properties of PVC-sol seal-ants were investigated. Two kinds of polyamide resins having different amine value were used. It was found that the properties of the PVC-sol sealants were significantly affected by the contents and types of the added polyamide rosins. The PVC-sol sealants modified with polyamide A (low amino value) showed higher tensile properties than those modified with polyamide B(high amino value) did, and thermal stability of the sealants showed nearly the same trends. The tensile strength of sealants were decreased with increasing the $CaCO_3$ contents. The dielectric constant were not strongly dependent on the polyamide types and contents.

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Curing and Rheological Behavior of Epoxy Resin Compositions for Underfill (언더필용 에폭시 수지 조성물의 경화 및 유변학적 거동)

  • Kim, Yoon-Jin;Park, Min;Kim, Jun-Kyung;Kim, Jin-Mo;Yoon, Ho-Gyu
    • Elastomers and Composites
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    • v.38 no.3
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    • pp.213-226
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    • 2003
  • The cure and rheological behavior of diglycidyl ether of bisphenol F/nadic methyl anhydride resin system with the kinds of imidazole were studied using a differential scanning calorimeter (DSC) and a rotational rheometer. The isothermal traces were employed to analyze cure reaction. The DGEBF/ anhydride conversion profiles showed autocatalyzed reaction characterized by maximum conversion rate at $20{\sim}40 %$ of the reaction. The rate constants ($k_1,\;k_2$) showed temperature dependance, but reaction order did not. The reaction order (m+n) was calculated to be close to 3. There are two reaction mechanisms with the kinds oi catalyst. The gel time was determined by using G'-G" crossover method, and the activation energy was obtained from this results. From measurement of rheological properties it was found that the logarithmic 1:elation time of fused silica filled DBEBF epoxy compounds linearly increased with the content of filler and decreased with temperature. The highly filled epoxy compounds showed typical pseudoplastic behavior, and the viscosity of those decreased with increasing maximum packing ratio.