Browse > Article

Thermal, Mechanical, and Electrical Properties of Fluorine-Containing Epoxy Resins  

박수진 (한국화학연구원 화학소재연구부)
김범용 (한국화학연구원 화학소재연구부)
이재락 (한국화학연구원 화학소재연구부)
신재섭 (충북대학교 화학과)
Publication Information
Polymer(Korea) / v.27, no.3, 2003 , pp. 183-188 More about this Journal
Abstract
The dielectric constants of fluorine-containing epoxy resins, 2-diglycidylether of benzotrifluoride(FER)/4,4'-diamino-diphenyl methane (DDM) and diglycidylether of bisphenol-A (DGEBA)/DDM systems were evaluated by dielectric spectrometer. Glass transition temperature and thermal stability factors, including initial decomposed temperature, temperatures of maximum rate of degradation, and decomposition activation energy of the cured specimens were investigated by dynamic mechanical analysis and thermogravimetric analysis. For the mechanical properties of the casting specimens, the fracture toughness, flexural, and impact tests were performed, and their fractured surfaces were examined by scanning electron microscope. The dielectric constant of FER/DDM system was lower than that of commercial DGEBA/DDM system, and the mechanical properties of the cured specimens showed higher values than those of DGEBA/DDM system. This was probably due to the introduction of trifluoromethyl (CF$_3$) group into the side chain of the epoxy resins, resulting in improving the electric and mechanical properties of the epoxy cure system studied.
Keywords
fluorine-containing epoxy resins; electrical properties; critical stress intensity factor; activation energy; dielectric constant;
Citations & Related Records

Times Cited By Web Of Science : 1  (Related Records In Web of Science)
Times Cited By SCOPUS : 1
연도 인용수 순위
1 /
[ Y.Saegusa;M.Horikiri;D.Sakai;S.Nakamura ] / J. Polym. Sci., Part A: Polym. Chem.   DOI   ScienceOn
2 /
[ C.D.Doyle ] / Anal. Chem.   DOI
3 /
[ S.Rimdusit;H.Ishida ] / J. Polym. Sci., Part B: Polym. Phys.   DOI   ScienceOn
4 /
[ S.J.Park;D.I.Seo;C.W.Nah ] / J. Colloid Interface Sci.   DOI   ScienceOn
5 /
[ S.J.Park;M.K.Seo;J.R.Lee;D.R.Lee ] / J. Polym. Sci., Part A: Polym. Chem.   DOI   ScienceOn
6 /
[ K.Xie;S.Y.Zhang;J.G.Liu;M.H.He;S.Y.Yang ] / J. Polym. Sci., Part A: Polym. Chem.   DOI   ScienceOn
7 /
[ J.G.Liu;M.H.He;Z.X.Li;Z.G.Qian;F.S.Wang;S.Y.Yang ] / J. Polym. Sci., Part A: Polym. Chem.   DOI   ScienceOn
8 /
[ E.S.Wilks ] / Industrial Polymers Handbook: Products, Processes, Applications
9 /
[ D.J.Diaw ] / J. Appl. Polym. Sci.   DOI   ScienceOn
10 /
[ P.E.Cassidy;T.M.Aminabhava;J.M.Farley ] / J. Macromol. Sci., Rev. Macromol. Chem. Phys.
11 /
[ C.H.Lin;Z.R.Jiang;C.S.Wang ] / J. Polym. Sci., Part A: Polym. Chem.   DOI   ScienceOn
12 /
[ P.K.Gutch;S.Banerjee;D.C.Gupta;D.K.Jaiswal ] / J. Polym. Sci., Part A: Polym. Chem.   DOI   ScienceOn
13 /
[ S.J.Park;M.K.Seo;T.J.Ma;D.R.Lee ] / J. Colloid Interface Sci.   DOI   ScienceOn
14 /
[ R.Bongiovanni;G.Malucelli;M.Messori;F.Pilati;A.Priola;C.Tonelli;M.Toselli ] / J. Appl. Polym. Sci.   DOI   ScienceOn
15 /
[ E.Hamciuc;C.Hamciuc;I.Sava;M.Sava;M.Bruma ] / Macromol. Mater. Eng.   DOI
16 /
[ A.Broido ] / J. Polym. Sci. Part A-2   DOI
17 /
[ Y.Saegusa;T.Sakai ] / J. Polym. Sci., Part A: Polym. Chem.   DOI   ScienceOn
18 /
[ S.J.Park;H.C.Kim ] / J. Polym. Sci., Part B: Polym. Phys.   DOI   ScienceOn
19 /
[ R.H.Vora;P.S.G.Krishnan;S.H.Goh;T.S.Chung ] / Adv. Funct. Mater.
20 /
[ R.Bongiovanni;G.Malucelli;A Pollicino;A.Priola ] / J. Appl. Polym. Sci.   DOI   ScienceOn
21 /
[ T.Endo ] / Development and Appications of New Reactive Monomers
22 /
[ J.W.Stansbury;J.M.Antonucci ] / Dent. Mater.   DOI   ScienceOn