• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
• /
• v.9 no.2
• /
• pp.93-98
• /
• 2011

Saline corrosion is one of the major degradation mechanisms for stainless steel type 304 (SS304) dry storage cask during the spent fuel interim storage period. Slow strain rate test (SSRT) and neutral salt spray test (NSS) were performed at $85^{\circ}C$ and $200^{\circ}C$ with 0.5 wt% sodium chloride mist sprayed on the cold-rolled SS304 specimens of different degrees of reduction in this study. The weight changes of the NSS specimens tested at $85^{\circ}C$ for 2000 hours differed greatly from those at $200^{\circ}C$. The weight loss of NSS specimens was not significant at $85^{\circ}C$ but the weight gain decreased gradually with increasing the cold-rolled reduction. The yield strength (YS) and ultimate tensile stress (UTS) values obtained from the SSRT tests for lightly cold-rolled specimens in the salt spray environment at $85^{\circ}C$ and $200^{\circ}C$ are slightly lower than in air. But for those with 20% reductions, the specimen strengths were no longer changed by the saline corrosion. The preliminary results demonstrated that the quality and performance of cold-rolled SS304 is acceptable for fabrication of dry storage casks. However, more work on the corrosion behavior of cold-rolled stainless steel in the saline atmosphere is needed to better understand its long-term performance.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2003.03a
• /
• pp.222-222
• /
• 2003

나노크기 금속입자가 분산된 세라믹 나노복합재료는 향상된 기계적 특성과 함께 독특한 전기적, 자기적 특성을 보여주어 새로운 기능성 재료로의 응용가능성을 갖고 있다. 그러나 소결 중의 반응이나 입자성장 등으로 형성된 반응상 또는 조대한 입자상이 세라믹 기지의 입계 등에 존재한다면, 나노크기 금속상 분산에 의한 기계적 특성의 향상과 독특한 기능성 부여라는 장점들이 없어지게 된다. 따라서 요구되는 특성을 구현할 수 있는 금속분산 나노복합재료의 제조를 위해서는 미세조직 제어를 위한 최적의 제조공정 확립과 미세조직과 특성 등의 관계에 대한 연구가 요구된다. 본 연구에서는 기지상으로 A1$_2$O$_3$를, 분산상으로는 저융점 금속이며 일반적인 A1$_2$O$_3$의 가압소결시에 (약 140$0^{\circ}C$) 액상으로 존재하는 금속 Cu를 선택하여 조성이 5 vol% Cu가 되도록 복합재료를 제조하였다. $Al_2$O$_3$와 CuO 원료분말들은 습식 및 건식 볼 밀링을 통하여 균일한 분말혼합체로 제조되었다. 혼합분말은 열간가압소결기 내에 장입한 후 35$0^{\circ}C$에서 30분 동안 H$_2$가스를 흘려주며 CuO를 Cu로 환원 처리하였다. 계속해서 H$_2$분위기를 유지하며 승온한 후, 각각 1000-145$0^{\circ}C$에서 분위기를 Ar 으로 치환하였다. 소결은 145$0^{\circ}C$에서 30 ㎫의 압력으로 1시간동안 행하였다 소결한 시편들은 직사각형 형태로 가공하였으며 표면은 0.5$\mu\textrm{m}$의 다이아몬드 입자로 연마하였다. XRD, SEM 및 TEM을 이용하여 상분석 및 미세조직관찰을 행하였다. 파괴강도는 3중점 굽힘 법으로 (3-point bending test) 측정하였다. 이때 시편 하부의 지지 점간의 거리는 30mm, cross-head 속도는 0.5 mm/min으로 하였고 5개의 시편을 측정하여 평균값을 구하였다.

• Journal of the Korean Society of Food Science and Nutrition
• /
• v.42 no.6
• /
• pp.964-968
• /
• 2013

This study investigated the formation of rice dumpling skins with various food additives to improve their texture. Rice (Millyang260 and Hanarum) was obtained from the Rural Development Administration. Rice was milled through an air classifying mill (ACM), and hydroxypropyl methylcellulose (HPMC), xanthan gum, guar gum, carrageenan, or propylene glycol alginate (PGA) was used as food additives. The effects of hydrocolloids on textural were evaluated and rice dumpling skin prepared with additives showed significantly higher values than the control for cooking properties and texture. The presence of hydrocolloids in rice dumpling skin appeared to decrease its weight and volume after cooking. Textural properties of rice dumpling skin with hydrocolloids were similar to the control regardless of cooking condition.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2011.02a
• /
• pp.376-377
• /
• 2011

결정질 실리콘 태양전지 연구에 있어서 가장 중요한 부분은 재료의 저가화와 공정의 단순화에 의한 저가의 태양전지 셀 제작 부분과 고효율의 태양전지 셀 제작 부분이다. 본 논문에서는 마이크로 블라스터를 이용하여 폐 실리콘 웨이퍼를 태양전지용 재생웨이퍼를 제작함으로써 고효율을 가지는 단결정 실리콘 웨이퍼를 저 가격에 생산하기 위한 것이다. 특히 마이크로 블라스터를 이용하여 폐 실리콘 웨이퍼를 가공 할 때 표면에 생성되는 요철은 기존 태양전지 셀 제작에서 텍스쳐링 공정과 같은 표면 구조를 가지게 됨으로써 태양전지 셀에 제작 공정을 줄일 수 있는 효과도 가지게 된다. 마이크로 블라스터는 챔버 내에 압축된 공기나 가스에 의해 가속 된 미세 파우더들이 재료와 충돌하면서 재료에 충격을 주고 그 충격에 의해 물질이 식각되는 기계적 건식 식각 공정 기술이다. 이러한 물리적 충격을 이용하는 마이크로 블라스터 공정은 기존 재생웨이퍼 제작 공정 보다 낮은 재처리 비용으로 간단하게 태양전지용 재생웨이퍼를 제작 할 수 있다. 하지만 마이크로 블라스터를 이용하면 표면에 식각된 미세 파티클의 재흡착이 일어나게 되므로 이를 제거하기 위하여 DRE(damage remove etching) 공정이 필요하게 된다. 본 연구에서는 이방성, 등방성 식각 공정으로 태양전지용 재생웨이퍼를 제작하기 위해 가장 적합한 DRE 공정을 찾기 위해 등방성 식각은 RIE 식각으로, 그리고 이방성 식각은 TMAH 식각을 이용하였다. 마이크로 블라스터 공정 후 표면 반사율과 SEM 사진을 이용한 표면 요철 구조를 확인 하였고, DRE 공정 후 표면 반사율과 SEM 사진을 이용하여 표면 요철 구조를 확인 하였다. 각각의 lifetime을 측정하여 표면 식각으로 생성된 결함들을 분석하여 태양전지용 재생웨이퍼 제작에 가장 적합한 공정을 확인 하였다.

• Journal of the Microelectronics and Packaging Society
• /
• v.13 no.4
• /
• pp.45-50
• /
• 2006

Copper via filling is the important factor in 3-D stacking interconnection of SiP (system in package). As the packaging density is getting higher, the size of via is getting smaller. When DC electroplating is applied, a defect-free hole cannot be obtained in a small size via hole. To prevent the defects in holes, pulse and pulse reverse current was applied in copper via filling. The holes, $20\and\;50{\mu}m$ in diameter and $100{\sim}190\;{\mu}m$ in height. The holes were prepared by DRIE method. Ta was sputtered for copper diffusion barrier followed by copper seed layer IMP sputtering. Via specimen were filled by DC, pulse and pulse-reverse current electroplating methods. The effects of additives and current types on copper deposits were investigated. Vertical and horizontal cross section of via were observed by SEM to find the defects in via. When pulse-reverse electroplating method was used, defect free via were successfully obtained.

• Journal of the Korean Vacuum Society
• /
• v.17 no.1
• /
• pp.16-22
• /
• 2008

We studied plasma etching of polycarbonate in $O_2/SF_6$, $O_2/N_2$ and $O_2/CH_4$. A capacitively coupled plasma system was employed for the research. For patterning, we used a photolithography method with UV exposure after coating a photoresist on the polycarbonate. Main variables in the experiment were the mixing ratio of $O_2$ and other gases, and RF chuck power. Especially, we used only a mechanical pump for in order to operate the system. The chamber pressure was fixed at 100 mTorr. All of surface profilometry, atomic force microscopy and scanning electron microscopy were used for characterization of the etched polycarbonate samples. According to the results, $O_2/SF_6$ plasmas gave the higher etch rate of the polycarbonate than pure $O_2$ and $SF_6$ plasmas. For example, with maintaining 100W RF chuck power and 100 mTorr chamber pressure, 20 sccm $O_2$ plasma provided about $0.4{\mu}m$/min of polycarbonate etch rate and 20 sccm $SF_6$ produced only $0.2{\mu}m$/min. However, the mixed plasma of 60 % $O_2$ and 40 % $SF_6$ gas flow rate generated about $0.56{\mu}m$ with even low -DC bias induced compared to that of $O_2$. More addition of $SF_6$ to the mixture reduced etch of polycarbonate. The surface roughness of etched polycarbonate was roughed about 3 times worse measured by atomic force microscopy. However examination with scanning electron microscopy indicated that the surface was comparable to that of photoresist. Increase of RF chuck power raised -DC bias on the chuck and etch rate of polycarbonate almost linearly. The etch selectivity of polycarbonate to photoresist was about 1:1. The meaning of these results was that the simple capacitively coupled plasma system can be used to make a microstructure on polymer with $O_2/SF_6$ plasmas. This result can be applied to plasma processing of other polymers.

• Korean journal of food and cookery science
• /
• v.22 no.2 s.92
• /
• pp.147-157
• /
• 2006

To improve the properties of non-waxy rice flours for baking, soaked-wet milled rice flour (SWRF) was adjusted moisture content (MC) to 30 and 50 % and heated at 50 and $70^{\circ}C$ in a shaking water bath for 6 and 18 hrs, respectively. Moisture-heat treated rice flours were investigated with regard to particle size distribution, and morphological, physicochemical and pasting properties for comparing dry and wet milled flours. The particle size of rice flour treated with 30% MC was distributed between $4-20{\mu}m\;and\;100-200{\mu}m$, like SWRF. The particles above $200{\mu}m$ in the flour were produced at higher heating temperature. By SEM, starch granules were found in the rice flours treated with 30% MC, who whereas aggregated starch granules were shown in the flours treated with 50% MC. Moisture-heat treatment using higher MC and heating temperature decreased the lightness and increased the yellowness of non-waxy rice flours. Water binding capacity of 30% moisture treated rice flour was similar to that of SWRF. In the same moisture treated rice flour, swelling power was higher, but solubility was lower at $50^{\circ}C$ than at $70^{\circ}C$. The initial pasting temperature by RVA increased after moisture-heat treatment. The peak viscosity of moisture-heat treated rice flour was higher for 30% moisture than that of the others. The rice flour treated with 30% MC and heated at $50^{\circ}C$ showed low setback and increased stability for retrogradation.

• KOREAN JOURNAL OF CROP SCIENCE
• /
• v.58 no.3
• /
• pp.283-291
• /
• 2013

Rice varieties with suitable flour-making quality are required to promote rice processed-food industry and boost rice consumption in Korea. 'Namil (SA)-flo1' is an advanced mutant line with floury endosperm which shows good flour-making quality under dry-milling process. Genetic analysis was carried out to localize the chromosomal region responsible for the floury endosperm of 'Namil (SA)- flo1'. By using 94 F2 progenies, which were derived from 'Namil (SA)-flo1' ${\times}$ 'Milyang 23', floury grains percentage was investigated as phenotypic data, and genotyping was conducted with 54 SSR markers. Association analysis showed that the target genetic region for floury endosperm is on middle-low region of chromosome 5. Through further association analysis with increased number of SSR markers on chromosome 5, we found that genotypic variation in RM164 explains 79.7% of the variation in floury grains percentage of F2:3 seeds. The floury endosperm locus was localized on 17.7-20.7 Mbp region of chromosome 5 and will be further analyzed for fine mapping and gene identification.

• Korean Journal of Food Science and Technology
• /
• v.51 no.2
• /
• pp.109-113
• /
• 2019

The soft rice varieties, Hangaru and Singil, were developed via mutation breeding using N-methyl-N-nitrosourea treatment to obtain dry-milled rice flours. The physicochemical, morphological, and pasting properties of these starches were compared with those of Seolgaeng and Chuchung starches. Singil starch was found to exhibit the highest amylose content and initial pasting temperature, whereas Hangaru starch exhibited the highest water binding capacity and swelling power. Hangaru starch's granule size at $d_{50}$ was the largest among the four different starch types. Some Seolgaeng, Hangaru, and Singil granules were observed to have a round-faced polygon shape. Furthermore, the crystallinity of all four starch types was type A. The peak, trough, and final viscosities of the soft rice starches were also lower than those of normal starches. Notably, Hangaru starch showed the highest breakdown viscosity, but the lowest total setback viscosity among the four starches. From these results, the starch characteristics of the soft rice flours were discovered to be different based on the rice variety.

• Journal of the Microelectronics and Packaging Society
• /
• v.25 no.2
• /
• pp.35-39
• /
• 2018

In order to improve the coupling efficiency, a collimator lens that collects the light emitted from the laser diode at a wide angle to the core of the optical fiber is essential. Glass mold method using a mold is widely used as a collimator lens currently used. Although this method is inexpensive to produce, it is difficult to form precisely and quality problems such as spherical aberration. In this study, the precision of surface processing was improved by replacing the existing glass mold method with the semiconductor process, and the material of the lens was changed to silicon suitable for the semiconductor process. The semiconductor process consists of a photolithography process using PR and a dry etching process using plasma. The optical coupling efficiency was measured using an ultra-precision alignment system for the evaluation of the optical characteristics of the silicon lens. As a result, the optical coupling efficiency was 50% when the lens diameter was $220{\mu}m$, and the optical coupling property was 5% or less with respect to the maximum optical coupling efficiency in the lens diameter range of $210-240{\mu}m$.