• Journal of the Korean Magnetics Society
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• v.16 no.1
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• pp.75-78
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• 2006

In case of contacts between semiconductor and metal in semiconductor circuits, they become unstable because of thermal budget. To prevent these problems, we use diffusion barrier that has a good thermal stability between metal and semiconductor. So we consider the diffusion barrier to prevent the increase of contact resistance between the interfaces of metals and semiconductors, and the increase of resistance and the reaction between the interfaces. In this paper we deposited tungsten boron carbon nitride (W-B-C-N) thin film on silicon substrate. The impurities of the $1000\;{\AA}-thick$ W-B-C-N thin films provide stuffing effect for preventing the inter-diffusion between metal thin films $(Cu-2000\;{\AA})$ and silicon during the high temperature $(700\~1000^{\circ}C)$ annealing process.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.819-820
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• 2008

• 한국초전도학회:학술대회논문집
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• 2009.07a
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• pp.34-34
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• 2009

• 한국초전도학회:학술대회논문집
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• 2008.08a
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• pp.23-23
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• 2008

• Journal of the Korean Ceramic Society
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• v.39 no.3
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• pp.278-285
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• 2002

For planar optical devices, silica film deposited by FHD was fabricated at low temperature. To prepare silica film at low temperature, we have changed B, P amounts and investigated consolidation effect with varying consolidation temperature and atmosphere on microstructural change, and also observed optical property. The optimum consolidation temperature in He was lower than that of other atmosphere, its temperature could be lowered to 1050$^{\circ}C$. As a result, the roughness of flat silica film prepared at 1050$^{\circ}C$ showed 5, 6nm.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.27 no.2
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• pp.188-196
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• 2003

Liquid-assisted cleaning technology utilizing a nanosecond laser pulse is effective for removing submicron particulates from a variety of solid substrates. In the technique, saturated vapor is condensed on a solid surface to form a thin liquid film and the film is evaporated explosively by laser heating. The present work studies the role of liquid-film evaporation in the cleaning process. First, optical interferometry is employed for in-situ monitoring the displacement of the laser-irradiated sample in the cleaning process. The experiments are performed for estimating the recoil force exerted on the target with and without liquid deposition. Secondly, time-resolved visualization and optical reflectance probing are also conducted for monitoring the phase-change kinetics and plume dynamics in vaporization of thin liquid layers. Discussions are made on the effect of liquid-film thickness and dynamics of plume and acoustic wave. The results confirm that cleaning force is generated when the bubble nuclei initially grow in the strongly superheated liquid.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.7 no.2
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• pp.250-254
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• 2003

A film bulk acoustic resonator (FBAR) device for 2 GHz radio frequency (RF) bandpass filter application is presented. This FBAR device consists of an aluminum nitride (AlN) film sandwiched between top(Al) and bottom(Au) electrodes and an acoustic multilayer reflector of a silicon dioxide/tungsten (SiO2/W). The A/N film deposited using a RF sputtering was observed to have small columnar grains with a strongly preferred orientation towards c axis. In addition to a high quality factor (4300), a large return loss of 37.19 dB was obtained.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.27 no.4
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• pp.476-483
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• 2003

A mathematical model is presented to predict the two-phase flow and heat transfer phenomena of the evaporating extended meniscus region in a micro-channel. The pressure difference at the liquid-vapor interface can be obtained by the augmented Laplace-Young equation. The correlative equations for film thickness, pressure, and velocity in the meniscus region are derived by applying the mass, momentum, and energy equations into the control volume. The results show that increasing the heat flux and the liquid inlet velocity cause the length and liquid film thickness of the extended meniscus region to decrease. The variation, however, of the heat flux and liquid inlet velocity has no effect on the profile of film thickness. The majority of heat is transferred through the thin film region that is a very small region in the extended meniscus region. It is also found that the vapor velocity increases gradually in the meniscus region. However, it increases sharply at the junction of the meniscus and thin film regions.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.20 no.10
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• pp.3293-3303
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• 1996

Numerical analyses have been performed to estimate the absorption heat and mass transfer coefficients in absorption process of the LiBr aqueous solution and the total heat and mass transfer rates in a vertical tube absorber which is coolING ed by air. Axisymmetric cylindrical coordinate system was adopted to model the circular tube and the transport equations were solved by the finite volume method. Absorption behaviors of heat and mass transfer were analyzed through falling film of the LiBr aqueous solution contacted by water vapor in tube. Effects of film Reynolds number on heat and mass transfer coefficients have been also investigated. Especially, effects of tube diameter have been considered to observe the total heat and mass transfer rates through falling film along the tube. Based on the analysis it has been found that the total mass transfer rate increases rapidly in a region with low film Reynolds number(10 ~ 40) as the film Reynolds number increases, while decreases beyond that region. The total heat and mass transfer rates increase with increasing the tube diameter.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.1498-1501
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• 1996

To evaluate insulating properties of polyimide thin film on high temperature over $100\;^{\circ}C$, polyimide film were prepared by electrophoretic deposition onto metal surface from nonaqueous emulsion. The emulsion is made by adding a solution of the resin to a precipitant, which is an organic liquid compeltely miscible with the solvent of the organic resin solution, but which does not dissolve the resin. The polyimide film obtained by annealing shows good insulation properties of 5.8 MV/cm at elevated temperature and breakdown strength of the film reveals thickness dependence.