• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.7
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• pp.652-657
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• 2009

Strength characteristics of $Si_3N_4$ composite ceramics has been studied as functions of heat-treatment temperature and additive $SiO_2$. $SiO_2$ colloidal could significantly increase the bending strength. Crack healing temperature decreased 300 K by additive $TiO_2$. Bending strength of specimen added $SiO_2$ is higher than that of non-added $SiO_2$. Moreover, bending strength of specimen with $SiO_2$ colloidal coating is much higher that of non-coated specimen. In in-situ observation, crack-healed specimen at 1,573 K shows phenomenon like a fog on the surface. By SPM, both crack-healed specimen, non-coating and coating of $SiO_2$ colloidal, at 1,273 K were healed completely but both of 1,573 K exist crack. This was made by evaporation of $SiO_2$ at high temperature. Crack-healing materials of $Si_3N_4$ composite ceramics is crystallized $Y_2Si_2O_7$, $Y_2Ti_2O_7$ and $SiO_2$. A large amount of Si and O, and little C were detected by EPMA. Si and O increase but C decreases according to heat treatment temperature. Specimens with additive $SiO_2$ were more detected Si and O than that of non-additive $SiO_2$. Specimen with $SiO_2$ colloidal coatings were much more detected O.

• Journal of the Korean Society for Heat Treatment
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• v.3 no.1
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• pp.1-7
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• 1990

To investigate the influence of r.f. power and electrode distance on the TiN deposition, TiN films were deposited onto STC3, STD11 steel and Si-wafer from gas mixtures of $TiC_4/N_2/H_2$ using the radio frequency plasma assisted chemical vapor deposition. The crystallinity of TiN film could be improved by the increase of r.f. power and the decrease of electrode distance. The TiN coated layer contains chlorine, its content were decreased with increasing r.f. power as well as decreasing electrode distance. And the thickness of deposited TiN was largely affected by r.f. power and electrode distance. The hardness of deposited TiN reached a maximum value of about Hv 2,000.

• Journal of the Korean Ceramic Society
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• v.29 no.4
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• pp.328-334
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• 1992

TiO2 sols were prepared by hydrolysis and polymerization of titanium tetra-isopropoxide (TTIP) in the presence of diethanolamine (DEA). The optimal mole ratio of water to TTIP is 2 and the concentration of the TiO2 sol 0.7 M. Golden TiN films without cracks were obtained by dipping Si(110) wafers into the TiO2 sol and followed by nitridation in NH3 at 1100$^{\circ}C$ for 5 h. The TiN films were studied by an optical microscope, DTA, TGA and X-ray analysis.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.9 no.6
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• pp.170-177
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• 2000

Dense $Al_2$O$_3$-30%TiC and Si$_3$N$_4$ ceramic tool materials with various grain size were produced by sintering-HIP treatment and by gas-pressure sintering. The fracture toughness was measured by indentation fracture and indentation strength method for both ceramics with various grain size. The effect of the grain size on the fracture toughness was evaluated, and the correlation between fracture toughness and mechanical properties such as hardness, Young\`s modulus and flexural strength of these ceramic were also investigated. The highest fracture toughness of around 6.7 MPa.m(sup)1/2 was obtained in Si$_3$N$_4$ ceramics with grain size of 1.58${\mu}{\textrm}{m}$. With a larger grain size of $Al_2$O$_3$-30%TiC and Si$_3$N$_4$ ceramics, the fracture toughness was generally increased. The increased fracture toughness of these ceramic also improved the flexural strength although the hardness decreased considerably. Similar results were obtained in grain size and mechanical properties on both $Al_2$O$_3$-30%TiC and Si$_3$N$_4$ ceramic tool materials.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.240-245
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• 2004

Tensile properties of hard coating material, TiN, were evaluated using micro-tensile testing system. TiN has been known as a hard coating material commonly used today. Micro-tensile testing system consisted of a micro tensile loading system and a micro-ESPI(Electronic Speckle Pattern Interferometry) system. Micro-tensile loading system had a maximum load capacity of 500mN and a resolution of 4.5 nm in stroke. TiN thin film $1{\mu}m$ thick was deposited on the Si wafer pre-deposited of $Si_3N_4$ film substrate by the closed field unbalanced magnetron sputtering (CFUBMS) process. Three kinds of micro-tensile specimen with the respective width of $50{\mu}m$, $100{\mu}m$ and $500{\mu}m$ were fabricated by MEMS process. The mechanical properties including tensile strength and elastic modulus were determined using the micro-tensile testing system and compared by those obtained by nano-indentation

• Proceedings of the IEEK Conference
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• 1998.10a
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• pp.581-584
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• 1998

TiN thin films were grown on (100) Si substrate by atomic layer epitaxy at 130 - $240^{\circ}C$ using TEMAT and NH3 as precursors. Reactants were injected into the reactor in sequence of TEMAT precursor vapor pulse, N2 purging gas pulse, NH3 gas pulse and N2 purging gas pulse so that gas-phase reactions could be removed. The films were characterized by means of x-ray diffraction(XRD), 4-point probe, atomic force microscopy(AFM) and auger electron spectroscopy(AES).

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.16 no.3
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• pp.101-105
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• 2006

We fabricated the nano $TiN_x$ by making of reaction between titanium powder and $Si_3N_4$ during planetary milling. The $TiN_x$ powder was sintered by spark plasma sintering machine after mixing with 50 wt% of titanium powder, and the sintered body was heat-treated at $850^{\circ}C$ in order to investigate its hardness property at the elevated temperature. We analyzed crystal structure by XRD. We observed the peaks of $TiN_{0.26}$ and TiN after 10 hours milling, and we observed TiN peak mainly after 20 hours milling. The reacted particle size distribution was investigated by FE-SEM. Increase of milling time, the size of reacted particles was decreased and the $10{\sim}20nm$ size of $TiN_x$ on the surface of titanium and $TiN_x$ was observed after 20 hours milling. The micro-Vickers hardness of mixed sintered body was about $1050kgf/mm^2$.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.9
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• pp.121-127
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• 1994

The capability for application of rf magnetron sputterred and post annealed BaTiO$_{3}$ thin films in dielectrics AC drived TFELD(thin film electroluminescent device) was investigated. The dielectric constant of the thin films slightly increased up to about 25 with increase fothe post annealing temperature in the range of 210$^{\circ}C$-480$^{\circ}C$. The dielectric loss was about 0.005-0.01 except for the high frequency range above 100kHz and nearly independent on post annealing temperature. The BaTiO$_{3}$ thin film used for TFELD was annealed at 480.deg. C and Si$_{3}$N$_{4}$ thin film was inserted between BaTiO$_{3}$, lower dielecrics and ZnS:Mn, phosphor layer for stable driving of the device and for fear of interdiffusion. Regardless of the frequency of the applied sine wave voltage, the threshold voltage of the prepared TFELD was 65volt and saturated brightness was about 3000cd/m$^{2}$ at 130volt(2kHz sine wave), 65volt above V$_{TH}$.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.3
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• pp.428-435
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• 2002

Pyroelectric $Pb(Zr_{0.3}Ti_{0.7})O_3$ (PZT30/70) thin film IR detectors has been fabricated and characterised. The PZT30/70 thin film was deposited onto $Pt/Ti/Si_3N_4/SiO_2/Si$ substrate by the sol-gel process. Four different substrate conditions were studied for their effects on the pyroelectric responses of the IR detectors. The substrate conditions were the combinations of the Si etching and the Pt/Ti patterning. In the Si etched substrate, the $Si_3N_4/SiO_2$ composite layer was used as silicon etch-stop, and was used as the membrane to support the PZT pyroelectric film element as well. The measured pyroelectric current and voltage responses of detectors fabricated on the micro-machined thin $Si_3N_4/SiO_2$ membrane were two orders higher than those of the detectors on the bulk-silicon. For detectors on the membrane substrate, the Pt/Ti patterned detectors showed a 2-times higher pyroelectric response than that of not-patterned detectors. On the other hand, the pyroelectric response of the detectors on the not-etched Si substrate was almost the same, regardless of the Pt/Ti patterning. It was also found that the rise time strongly depended on the substrate thickness: the thicker the substrate was, the longer the rise-time.

• Transactions on Electrical and Electronic Materials
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• v.12 no.4
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• pp.144-147
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• 2011

In this work, we present a study regarding the etching characteristics on titanium nitride (TiN) thin films using an inductively coupled plasma system. The TiN thin film was etched using a $N_2/BCl_3$/Ar plasma. The studied etching parameters were the gas mixing ratio, the radio frequency (RF) power, the direct current (DC)-bias voltages, and the process pressures. The baseline conditions were as follows: RF power = 500 W, DC-bias voltage = -150 V, substrate temperature = $40^{\circ}C$, and process pressure = 15 mTorr. The maximum etch rate and the selectivity of the TiN to the $SiO_2$ thin film were 62.38 nm/min and 5.7, respectively. The X-ray photoelectron spectroscopy results showed no accumulation of etching byproducts from the etched surface of the TiN thin film. Based on the experimental results, the etched TiN thin film was obtained by the chemical etching found in the reactive ion etching mechanism.