• Journal of the Korean Institute of Telematics and Electronics D
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• v.35D no.8
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• pp.24-30
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• 1998

A blue LED of $In_{x}Ga_{1-x}N$ multiple quantum well structure which had the blue emission spectrum of donor-acceptor pair transition generated form Si-Zn co-doped $In_{x}Ga_{1-x}N$ active layer, was fabricated. The $In_{x}Ga_{1-x}N$ MQW heterojunction LED structure was grown by MOCVD on the sapphire substrate with (0001) surface orientation at 800.deg. C. The fabricated LED exhibited forward cut-in voltage of 4~4.5V and reverse breakdown voltage of -13V. Its optical chracteristics showed that the center wavelength of peak emission occurred at 460nm and the optical intensity was increased linearly with respect to the injected electrical current above 5mA.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.75-75
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• 2009

반도체 및 전자기기 산업에 있어 비활성메모리 (NVM)는 중요한 부운을 차지한다. NVM은 디스플레이 분야에 많은 기여를 하고 있으며, 특히 AMOLED에 적용이 가능하여 온도에 따라 변하는 구동 전류, 휘도, color balance에 따른 문제를 해결하는데 큰 역할을 한다. 본 연구는 NNN 구조에서 터널 층을 $SiN_X$ 박막에서 $SiO_XN_Y$ 박막으로 대체하기위한 $SiO_XN_Y$ 박막을 이용한 NNO구조의 NVM에 관한 연구이다. 이로 인하여 보다 얇으면서 우수한 절연 특성을 가지는 박막을 사용함으로써 실리콘 층으로부터 전하의 터널링 효과를 높여 전하 저장 정도를 높이고, 메모리 retention 특성을 향상시키는 터널 박막을 성장 시킬 수 있다. 최적의 NNO 구조의 메모리 소자를 제작하기 위하여 MIS 상태로 다양한 조건의 실험을 진행하였다. 처음으로 블로킹 박막의 두께를 조절하는 실험을 진행하여 최적 두께의 블로킹 박막을 찾았으며, 다음으로 전하 저장 박막의 band gap을 조절하여 최적의 band gap을 갖는 $SiN_X$ 박막을 찾았다. 마지막으로 최적두께의 $SiO_XN_Y$박막을 찾는 실험을 진행하였다. MIS 상태에서의 최적의 NNO 구조를 이용하여 유리 기판 상에 NNO 구조의 NVM 소자를 제작하였다. 제작된 메모리 소자는 문턱전압이 -1.48 V로 낮은 구동전압을 보였으며, I-V의 slope 값 역시 약 0.3 V/decade로 낮은 값을 보인다. 전류 점멸비($I_{ON}/I_{OFF}$)는 약 $5\times10^6$로 무수하였다. $SiN_X$의 band gap을 다양하게 조절하여 band gap 차이에 의한 밴드 저장 방식을 사용하였다. 또한 $SiN_X$은 전하를 전하 포획(trap) 방식으로 저장하기 때문에 본 연구에서의 메모리 소자는 밴드 저장 방식과 전하 포획 방식을 동시에 사용하여 우수한 메모리 특성을 갖게 될 것으로 기대된다. 우수한 비휘발성 메모리 소자를 제작하기 위해 메모리 특성에 많은 영향을 주는 터널 박막과 전하 저장 층을 다양화하여 소자를 제작하였다. 터널 박막은 터널링이 일어나기 쉽도록 최대한 얇으며, 전하 저장 층으로부터 기판으로 전하가 쉽게 빠져나오지 못하도록 절연 특성이 우수한 박막을 사용하였다. 전하 저장 층은 band gap이 작으며 trap 공간이 많은 박막을 사용하였다.

• Journal of the Korean institute of surface engineering
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• v.52 no.2
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• pp.53-57
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• 2019

Stability and activity of boron doped diamond (BDD) electrode are key factors for water treatment. In this study, BDD electrodes were prepared on various substrates such as Nb, Si, Ti, and $TiN_x/Ti$ by hot filament chemical vapor deposition (HFCVD) method. BDD/Ti film showed the delamination between BDD and Ti substrate due to the formation of TiC layer caused by diffusion of carbon. On the other hand, $BDD/TiN_x/Ti$ showed remarkably improved stability, compared to BDD/Ti. It was confirmed that $TiN_x$ intermediate layer act as barrier layer for diffusion of carbon. High potential window of 2.8 eV was maintained on the $BDD/TiN_x/Ti$ electrode and, better wastewater treatment capability and longer electrode working life than BDD/Nb, BDD/Si and BDD/Ti were obtained.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.8
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• pp.677-681
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• 2009

$In_xGa_{1-x}N$ alloys with 20-nm-thickness were deposited onto Mg:GaN/AlN/SiC substrates by MOCVD at $800\;^{\circ}C$. TMGa, TMIn and $NH_3$ were used as the precursor of gallium, indium and nitrogen, respectively. The mole ratio of indium in $In_xGa_{1-x}N$ films varied between 0 and 0.2. The energy-band-gaps of the films were obtained from the photoluminescence and cathodoluminescence peaks. The mole ratios of $In_xGa_{1-x}N$ films were calculated by applying Vegard's law to XRD results. The energy-band-gap versus indium composition plot for $In_xGa_{1-x}N$ alloys were well fit with a bowing parameter of 2.27.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.75-80
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• 2019

Silicon solar cells have been widely used as a most promising renewable energy source due to eco-friendliness and high efficiency. As modules of silicon solar cells are connected in series for a practical electricity generation, a large voltage of 500-1,500 V is applied to the modules inevitably. Potential-induced degradation (PID), a deterioration of the efficiency and maximum power output by the continuously applied high voltage between the module frames and solar cells, has been regarded as the major cause that reduces the lifetime of silicon solar cells. In particular, the migration of the $Na^+$ ions from the front glass into Si through the anti-reflection coating and the accumulation of $Na^+$ ions at stacking faults inside Si have been reported as the reason of PID. In this research, the thickness effect of $SiO_x$ layer that can block the migration of $Na^+$ ions on the reduction of PID is investigated as it is incorporated between anti-reflection coating and p-n junction in p-type PERC solar cells. From the measurement of shunt resistance, efficiency, and maximum power output after the continuous application of 1,000 V for 96 hours, it is revealed that the thickness of $SiO_x$ layer should be larger than 7-8 nm to reduce PID effectively.

• Proceedings of the Korean Vacuum Society Conference
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• 1998.02a
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• pp.109-109
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• 1998

최근 들어 MOCVD 법으로 성장시킨 GaN, InGaN, AIGaN를 이용한 광소자 ( (LED, LD)와 전자소자(FET, MODFET)에 대한 관심이 고조되면서, MOCVD 법 을 이용한 GaN 중심의 질화물 반도체 성장에 관심이 집중되고 있다. 금번 실험에 사용된 MOCVD 장비는 수직형 MOCVD 장비이다. 특히, wafer c carner를 1$\alpha$)() rpm이상의 고속으로 회전시킬 수 있는 장치로서 원료 가스의 반웅 기 내에서의 흐름을 균일하게 하여 uniformity가 높은 질화물 반도체를 성장시킬 수 있다 .. GaN 에피충은 c-plane 사파이어를 기판으로 하여 11 00 "C 이상의 고온 에서 수소를 이용하여 기판을 cleaning하고, 500 "C 부근에서 핵생성충올 성장시 킨 후 1050 "C에서 trimethylgallium(TMGa)과 NI-h를 이용하여 성장시켰다. n n -GaN를 성장시키기 위해서는 SiH4을 사용하였으며, InGaN의 경우는 t trimethylindium(TMIn)을 In원 료 가스로 하여 635 - 725 "C 범 위 에 서 성 장시 켰 다. 성 장된 undoped GaN, n-GaN, InGaN는 X -ray di잔raction(XRD), H떠l m measurement, Photoluminescence(PU동올 이용하여 결정성과 전기적 및 광학적 특성올 고찰하였다 .. 2ttm 두께로 성장된 undoped G값V박막의 경우 Hall 측정결과 6 6 X lOI6/e며 정도의 낮은 도핑 농도를 보였으며, V!lII ratio(2500 - 5000)증가에 따라 결정성이 향상됨을 GaN (102)면의 X -ray e -rocking분석올 통하여 확인하 였다 .. n-GaN의 경우 SiH4양올 3 - 13 sccm으로 증가시킴에 따라 n -type 도명농 도가 선형적으로 증가하였고, 1017/c며 범위 내로 도평이 된 경우 상온에서 300 e마 N Ns 이상의 high mobility를 얻올 수 있었다 .. PL 관측 결과로부터 Si 도핑으로 인 하여 GaN bandedge emission이 강화됨을 알 수 있었다 .. InGaN 박막의 경우 성 장온도를 낮춤에 따라서 m의 양을 증가시킬 수 있었다. 또한 유량비(TMIn I T TMGa)가 1에 가까운 경 우에서도 온도를 635 "C 정도로 낮훈 경우 410 nm정도에 서 PL bandedge peak올 얻을 수 있었으며, 이 때의 반치폭은 50 meV정도의 낮 은 값을 보였다. 반치폭은 50 meV정도의 낮 은 값을 보였다.

• Journal of the Korean Ceramic Society
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• v.29 no.5
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• pp.410-418
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• 1992

Si3N4, AlN and Y2O3 powder mixtures of the Y0.1(Si, Al)12(N, O)16 composition were hot-pressed at 1900℃ for 0 to 60 min under 30 MPa in order to fabricate the partially-stabilized α-Sialon ceramics (X=0.1). Room and high temperature flexural strengths of the specimens were compared with those of Si3N4-5 wt%Y2O3, Si3N4-5 wt%Y2O3-2 wt%Al2O3, and β-Sialon (Z=0.5) ceramics. The flexural strength of the α-Sialon ceramics which was hot-pressed for 15 min showed the highest value of 820 MPa at 1400℃ that is relatively higher temperature. It is guessed that a little amount of glassy phase existed in grain boundary because Y2O3 and AlN components were incoperated in Si3N4 grains, or transient liquid phase sintering, and microstructure with the smaller grain size and the interlocked grains of α'-and β-Si3N4 was obtained by the hot-pressing at high temperature of 1900℃ for the short time (15 min).

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.50 no.10
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• pp.504-508
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• 2001

The$(Sr_{1-x}Ca_x)TiO_3$(SCT) thin films are deposited on Pt-coated electrode $(Pt-TiN /SiO_2Si)$ using RF sputtering method at various deposition temperature. The crystallinity of thin films was increased with increased of deposition temperature n the temperature range of 200~500 $[^{\circ}C]$. The capacitance changes almost linearly in temperature ranges of -80~+90$[^{\circ}C]$. All SCT thin films used in the study the phenomena of dielectric relaxation with the increase of frequency, and the relaxation frequency is observed above 200[kHz]. V-I characteristics of SCT thin films show the increasing leakage current with the increases of deposition temperature.

• ETRI Journal
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• v.26 no.3
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• pp.257-261
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• 2004

We grew amorphous SiCN films by pulsed laser deposition using mixed targets. The targets were fabricated by compacting a mixture of SiC and $SiC-{Si_3}{N_4}$ powders. We controlled the film stoichiometry by varying the mixing ratio of the target and the target-to-substrate distance. The mixing ratio of the target had a dominant effect on the film composition. We consider the structures of the SiCN films deposited using 30~70 wt.% SiC in the target to be an intermediate phase of SiC and $SiN_x$. This provides the possibility of growing homogeneous SiCN films with a mixed target at a moderate target-to-substrate distance.

• Journal of the Korean Ceramic Society
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• v.41 no.6
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• pp.435-438
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• 2004

MOCVD is one of the major deposition techniques for Cu thin films and Ta-Si-N is one of promising barrier metal candidates for Cu with high thermal stability. Effects of hydrogen plasma pretreatment of the underlying Ta-Si-N film surface on the Cu nucleation in Cu MOCVD were investigated using scanning electron microscopy, X-ray photoelectron spectroscopy and Auger electron emission spectrometry analyses. Cu nucleation in MOCVD is enhanced as the rf-power and the plasma exposure time are increased in the hydrogen plasma pretreatment. The optimal plasma treatment process condition is the rf-power of 40 Wand the plasma exposure time of 2 min. The hydrogen gas flow rate in the hydrogen plasma pretreatment process does not affect Cu nucleation much. The mechanism through which Cu nucleation is enhanced by the hydrogen plasma pretreatment of the Ta-Si-N film surface is that the nitrogen and oxygen atoms at the Ta-Si-N film surface are effectively removed by the plasma treatment. Consequently the chemical composition was changed from Ta-Si-N(O) into Ta-Si at the Ta-Si-N film surface, which is favorable for Cu nucleation.