• 한국전기전자재료학회논문지
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• 제13권6호
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• pp.545-550
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• 2000

In order to synthesize Ba-ferrite particles by molten salt method KCl and NaCl were added to basic composition to 50% by weight. X was varied from 0.0 to 1.0 to control the magnetic properties in $BaFe_{12-2x}$/ $Co_{x}$ / $Ti_{x}$ / $O_{19}$ and 1 mol% of $SiO_2$was added to control the aspect ratio of hexagonal platelets. And the effects of reaction temperatures were examined by varying the temperature from 85$0^{\circ}C$ to 120$0^{\circ}C$ with 5$0^{\circ}C$ intervals. Eutectic composition of NaCl and KCl lowered the crystallizing temperature of Ba-ferrite in molten salts than using KCl and NaCl separatly. The morphology of resulting Ba-ferrite particles was clearly hexagonal-shaped plates. $H_{c}$ and $M_{r}$ were decreased when F $e^{3+}$ was substitued with $Co^{2+}$ and $Ti^{4+}$ from x=0 to x=1.0 in $BaFe_{12-2x}$/ $Co_{x}$ / $Ti_{x}$ / $O_{19}$ . Adding 1mol% $SiO_2$in molten salt method increased the size but shortened c-axis of the hexagonal ferrites and this result is an opposite phenomenon compared with the result in solid-statge reaction.n.ion.n.

• 한국진공학회지
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• 제3권4호
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• pp.466-481
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• 1994

차세대 집적회로 제조공정에 있어 핵심기술인 선택적 단결정 실리콘 성장공정에 대한 이동현상, 열역학, 미시적 전산모사를 수행하여 다각적인 분석과 이해를 시도하였다. 첫째, 실리콘 단결정 성장 공 정에 가장 많이 사용되는 배럴 반응기를 대상으로 유한 요소법을 이용하여 이동현상적 이론연구를 수행 하였다. 반응기내의 기체속도 분포, SiH2Cl2 농도분포를 각각 구하였으며 압력, 기판온도, 총유량 HCl 유 량변화 등의주요공정변수가 증착율과 균일도 지수에 미치는 영햐을 고찰하였다. 이러한 연구를 통하여 저온, 저압, 총유량이 많고 첨가되는 HCl 유량이 작은 경우가 균일도 확보를 위하여 적합한 조업조건임 을 알수 있었다. 둘째 Si-H-Cl 계에 대한 열역학적 기체의 Cl/H비가 낮은 경우가 선택적 실리콘 증착 에 적합함을 알수 있었다. 셋째, Monte Carlo법을 이용한 선택적 실리콘 미세박막 성장패턴에 관한 이 론 연구를 수행하여 종횡비, 재방출, 표면확산에 따른 박막증착 패턴의 변화를 고찰하였으며 표면확산이 선택도 상실 현상의 중요한 원인이 될 수 있음을 발견하였다. 또한 최상의 선택도 확보를위해서는 낮은 부착계수와 낮은 표면확산계수를 유지해야 됨을 알수 있었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1999년도 제17회 학술발표회 논문개요집
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• pp.79-79
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• 1999

The varous techniques for fabrication of si or metal tip as a field emission electron source have been reported due to great potential capabilities of flat panel display application. In this report, 240nm thermal oxide was initially grown at the p-type (100) (5-25 ohm-cm) 4 inch Si wafer and 310nm Si3N4 thin layer was deposited using low pressure chemical vapor deposition technique(LPCVD). The 2 micron size dot array was photolithographically patterned. The KOH anisotropic etching of the silicon substrate was utilized to provide V-groove formation. After formation of the V-groove shape, dry oxidation at 100$0^{\circ}C$ for 600 minutes was followed. In this procedure, the orientation dependent oxide growth was performed to have a etch-mask for dry etching. The thicknesses of the grown oxides on the (111) surface and on the (100) etch stop surface were found to be ~330nm and ~90nm, respectively. The reactive ion etching by 100 watt, 9 mtorr, 40 sccm Cl2 feed gas using inductively coupled plasma (ICP) system was performed in order to etch ~90nm SiO layer on the bottom of the etch stop and to etch the Si layer on the bottom. The 300 watt RF power was connected to the substrate in order to supply ~(-500)eV. The negative ion energy would enhance the directional anisotropic etching of the Cl2 RIE. After etching, remaining thickness of the oxide on the (111) was measured to be ~130nm by scanning electron microscopy.

• Transactions on Electrical and Electronic Materials
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• 제10권4호
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• pp.131-134
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• 2009

The electrical properties and the microstructure of nitrogen-doped poly 3C-SiC films used for micro thermal sensors were studied according to different thicknesses. Poly 3C-SiC films were deposited by LPCVD (low pressure chemical vapor deposition) at $900^{\circ}C$ with a pressure of 4 torr using $SiH_2Cl_2$ (100%, 35 sccm) and $C_2H_2$ (5% in $H_2$, 180 sccm) as the Si and C precursors, and $NH_3$ (5% in $H_2$, 64 sccm) as the dopant source gas. The resistivity of the poly SiC films with a 1,530 ${\AA}$ thickness was 32.7 ${\Omega}-cm$ and decreased to 0.0129 ${\Omega}-cm$ at 16,963 ${\AA}$. The measurement of the resistance variations at different thicknesses were carried out within the $25^{\circ}C$ to $350^{\circ}C$ temperature range. While the size of the resistance variation decreased when the films thickness increased, the linearity of the resistance variation improved. Micro heaters and RTD sensors were fabricated on a $Si_3N_4$ membrane by using poly 3C-SiC with a 1um thickness using a surface MEMS process. The heating temperature of the SiC micro heater, fabricated on 250 ${\mu}m$${\times}$250 ${\mu}m$ $Si_3N_4$ membrane was $410^{\circ}C$ at an 80 mW input power. These 3C-SiC heaters and RTD sensors, fabricated by surface MEMS, have a low power consumption and deliver a good long term stability for the various thermal sensors requiring thermal stability.

• 한국재료학회지
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• 제16권10호
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• pp.619-623
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• 2006

Selective vapor deposition of conductive poly(3,4-ethylenedioxythiophene) (PEDOT), thin films has been carried out on self assembled monolayers patterned oxide substrate. Since the 3,4-ethylenedioxythiophene(EDOT) monomer can be polymerized only in the presence of oxidant such as $FeCl_3$, the PEDOT thin film is selectively deposited on patterned $FeCl_3$, which only adsorbs on the partly removed SAMs region due to the inability of $FeCl_3$ to adsorb on SAMs. Therefore, the partly removed SAMs can act as an adsorption layer for the $FeCl_3$ and also as a glue layer for the deposition of PEDOT, resulting in the significantly increased adhesion of PEDOT to $SiO_2$ substrate. The use of UV lithography and Cr patterned quartz mask provided the formation of SAMs patterns on oxide substrates, which allowed for the selective deposition of conductive PEDOT thin films.$^{oo}The$ new process was successfully developed for the selective deposition of PEDOT thin films on SAMs patterned oxide substrate, providing a new way for the patterning of vapor phase deposition of PEDOT thin films with accurate alignment and addressing the inherent adhesion issues between PEDOT and dielectrics.

• 청정기술
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• 제7권3호
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• pp.215-223
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• 2001

A present semiconductor cleaning technology is based upon RCA cleaning technology which consumes vast amounts of chemicals and ultra pure water(UPW) and is the high temperature process. Therefore, this technology gives rise to the many environmental issues, and some alternatives such as electrolyzed water(EW) are being studied. In this work, intentionally contaminated Si wafers were cleaned using the electrolyzed water. The electrolyzed water was generated by an electrolysis system which consists of three anode, cathode, and middle chambers. Oxidative water and reductive water were obtained in anode and cathode chambers, respectively. In case of NH4Cl electrolyte, the oxidation-reduction potential and pH for anode water(AW) and cathode water(CW) were measured to be +1050mV and 4.8, and -750mV and 10.0, respectively. AW and CW were deteriorated after electrolyzed, but maintained their characteristics for more than 40 minutes sufficiently enough for cleaning. Their deterioration was correlated with CO2 concentration changes dissolved from air. Contact angles of UPW, AW, and CW on DHF treated Si wafer surfaces were measured to be $65.9^{\circ}$, $66.5^{\circ}$ and $56.8^{\circ}$, respectively, which characterizes clearly the eletrolyzed water. To analyze the amount of metallic impurities on Si wafer surface, ICP-MS was introduced. It was known that AW was effective for Cu removal, while CW was more effective for Fe removal. To analyze the number of particles on Si wafer surfaces, Tencor 6220 were introduced. The particle distributions after various particle removal processes maintained the same pattern. In this work, RCA consumed about $9{\ell}$ chemicals, while EW did only $400m{\ell}$ HCl electrolyte or $600m{\ell}$ NH4Cl electrolyte. It was hence concluded that EW cleaning technology would be very effective for promoting environment, safety, and health(ESH) issues in the next generation semiconductor manufacturing.

• Corrosion Science and Technology
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• 제23권4호
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• pp.315-323
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• 2024

This work examined pitting corrosion failure of a copper heat-return pipe used in a district heating system. The copper pipe was corroded with a 48% reduction in thickness due to localized corrosion on the inner surface exposed to heating water of 20 ~ 40 ℃. Fe and Si elements as corrosion products were found around pits. Cl element was also observed, which accelerated oxidation of copper inside pits. Cu₂O deposits on the pit's bottom surface decreased the pH inside the pit. X-ray diffraction analysis revealed hematite, cuprite, malachite and brochantite as corrosion products. Chemical analysis demonstrated that Fe and Si elements did not exist in the copper, supply water, or heating water, indicating that Fe and Si species might have entered into the pipe from the exterior. These results indicated that pits were initiated due to ion concentration gradient near Fe and Si species. Moreover, the interior of pits had lower pH due to Cl^- concentration and Cu₂O reactions, which accelerated the pit's growth and led to formation of pinholes. Additionally, we confirmed that the type of pitting corrosion was a complex combination of types I and II based on the HCO₃^-/SO₄^2- ratio, pH, temperature, and corrosion products.

• 한국재료학회지
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• 제18권2호
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• pp.77-83
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• 2008

Green-emitting $Ba_{1.468}Sr_{0.5}SiO_4\;:\;Eu_{0.012},\;Y_{0.02}$ phosphor powders under long-wavelength ultraviolet light were prepared via high-temperature flame spray pyrolysis from spray solutions with and without $NH_4Cl$ flux. The effects of the temperature of the diffusion flame and the $NH_4Cl$ flux on the morphologies, crystal structures and photoluminescence intensities of the $Ba_{1.468}Sr_{0.5}SiO_4\;:\;Eu_{0.012},\;Y_{0.02}$ phosphor powders were investigated. The phosphor powders obtained from the spray solution with the $NH_4Cl$ flux had higher photoluminescence intensities compared to phosphor powders obtained from the spray solution without the flux. The photoluminescence intensity of the phosphor powders obtained from the spray solution without the flux decreased as the flow rate of the fuel gas increased. On the other hand, the photoluminescence intensity of the phosphor powders obtained from the spray solution with the flux increased as the flow rate of the fuel gas increased. The difference of in the phase purity and morphology of the powders affected the photoluminescence intensities of the phosphor powders.

• Transactions on Electrical and Electronic Materials
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• 제11권3호
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• pp.116-119
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• 2010

The etching characteristics of zinc oxide (ZnO) were investigated, including the etch rate and the selectivity of ZnO in a $Cl_2/BCl_3$/Ar plasma. It was found that the ZnO etch rate, the RF power, and the gas pressure showed non-monotonic behaviors with an increasing Cl2 fraction in the $Cl_2/BCl_3$/Ar plasma, a gas mixture of $Cl_2$(3 sccm)/$BCl_3$(16 sccm)/Ar (4 sccm) resulted in a maximum ZnO etch rate of 53 nm/min and a maximum etch selectivity of 0.89 for ZnO/$SiO_2$. We used atomic force microscopy to determine the roughness of the surface. Based on these data, the ion-assisted chemical reaction was proposed as the main etch mechanism for the plasmas. Due to the relatively low volatility of the by-products formed during etching with $Cl_2/BCl_3$/Ar plasma, ion bombardment and physical sputtering were required to obtain the high ZnO etch rate. The chemical states of the etched surfaces were investigated using X-ray photoelectron spectroscopy (XPS). This data suggested that the ZnO etch mechanism was due to ion enhanced chemical etching.

• 한국세라믹학회지
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• 제25권4호
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• pp.397-407
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• 1988

Spinel, mullite and cordierite powders have synthesized from Mg(NO3)2.6H2O, Al(NO3).9H2O and SiCl4 solution by spray pyrolysis method. The two-fluid nozzle was used as an atomizer. The powders of sinel and mullite were synthesized above 80$0^{\circ}C$, but the cordierite composition was noncrystalline for all synthersizing temperature. Those noncrystalline powders were crystallized to $\alpha$-cordierite during calcining at 130$0^{\circ}C$ for 2hrs. The synthesized spinel, mullite and cordierite powders seem to be consisted of agglomerated hollow spherical particles. For all powders, the particle size ranged from submicron to about 3${\mu}{\textrm}{m}$ and mean particle size was about 1.4${\mu}{\textrm}{m}$ in diameter. The specific surface area values of spinel, mullite and cordierite powders were maximum for powders prepared at 100$0^{\circ}C$, and those were 45.9, 25.8 and 13.6$m^2$/gr, respectively.