• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.7
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• pp.617-624
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• 2000

Zinc Oxide(ZnO) thin films on Si(100) substrate were deposited by RF magnetron reactive sputtering. The charcteristics of ZnO thin films on argon/oxygen(Ar/O$_2$)gas ratios RF power and substrate temperature were investigated by XRD, SEM, and AFM analyses. C-axis preferred orientation resistivity and surface roughness highly depended on Ar/O$_2$gas ratios. The resistivity of ZnO thin films rapidly increased with increasing oxygen ratio and the resistivity value of 9$\times$10$^{7}$ $\Omega$cm was obtained at a working pressure of 10 mTorr with Ar/O$_2$=50/50. The surface roughness was also improved with increasing oxygen ratio and the ZnO films deposited with Ar/O$_2$=50/50 showed the excellent roughness value of 28.7$\AA$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.607-610
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• 2004

The Pb $(Zr_{0.52}Ti_{0.48})O_3/(Ba_{0.6}Sr_{0.4}TiO_3$ [PZT(52/48)/BST(60/40)] heterolayered thin films were fabricated on the Pt/Ti/$SiO_2$/Si by RF sputtering method. The structural properties of the PZT(52/48)/BST(60/40) heterolayered thin films were investigated with Ar/$O_2$ ratio condition. All the PZT(52/48)/BST(60/40) heterolayered thin films had shown the PZT(111), (200) and BST(200) Peaks of the tetragonal structure. Increasing the Ar/$O_2$ ratio, the average roughness was increased. The thickness ratio of the to the PZT and BST thin film was 1:2. In the case of the PZT(52/48)/BST(60/40) heterolayered thin films with Ar/$O_2$ ratio of 80/20, the average roughness was 3.4 [nm].

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.22 no.3
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• pp.122-126
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• 2012

The properties of Al-doped ZnO (AZO) films were investigated as a function of $H_2/(Ar+H_2)$ gas ratio using an AZO (2 wt% $Al_2O_3$) ceramic target in a radio frequency (RF) magnetron sputtering system. The deposition process was done at $200^{\circ}C$ and in $2{\times}10^{-2}$ Torr working pressure and with various ratios of $H_2/(Ar+H_2)$ gas. During the AZO film deposition process, partial $H_2$ gas affected the AZO film characteristics. The electron resistivity (${\sim}9.21{\times}10^{-4}\;{\Omega}cm$) was lowest and mobility (${\sim}17.8\;cm^2/Vs$) was highest in AZO films when the $H_2/(Ar+H_2)$ gas ratio was 2.5 %. When the $H_2/(Ar+H_2)$ gas ratio was increased above 2.5 %, the electron resistivity increased and mobility decreased with increasing $H_2/(Ar+H_2)$ gas ratio in AZO films. The carrier concentration increased with increasing $H_2/(Ar+H_2)$ gas ratio from 0 % to 7.5 %. This phenomenon was explained by reaction of hydrogen and oxygen and additional formation of oxygen vacancy. The average optical transmission in the visible light wavelength region over 90 % and an orientation of the deposition was [002] orientation for AZO films grown with all $H_2/(Ar+H_2)$ gas ratios.

• Proceedings of the Korean Institute of Navigation and Port Research Conference
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• 2000.11a
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• pp.21-24
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• 2000

Ferroelectric YMnO$_3$thin films are excellent dielectric materials for high integrated ferroelectric random access memory (FRAM) with metal-ferroelectric-silicon field effect transistor (MFSFET) structure. In this study, YMnO$_3$thin films were etched with Cl$_2$/Ar gas chemistries in inductively coupled plasma (ICP). The maximum etch rate of YMnO$_3$thin films is 285 $\AA$/min under Cl$_2$/Ar of 10/0, 600 W/-200 V and 15 mTorr. The selectivities of YMnO$_3$over CeO$_2$and $Y_2$O$_3$are 2.85, 1.72, respectively. The results of x-ray photoelectron spectroscopy (XPS) reflect that Y is removed dominantly by chemical reaction between Y and Cl, while Mn is removed more effective by Ar ion bombardment than chemical reaction. The results of secondary ion mass spectrometer (SIMS) were equal to these of XPS. The etch profile of the etched YMnO$_3$film is approximately 65$^{\circ}$and free of residues at the sidewall.

• Korean Journal of Materials Research
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• v.7 no.1
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• pp.3-7
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• 1997

VO$_{2}$ 써모크로믹 원도우의 가시광 투과율을 높히기 위하여 내마모성이 우수한 SiO$_{2}$박막을 이용하여 AR(anti-rdflection)코팅을 하였다. 두가지 중요한 공정변수인 기판온도와 증착속도가 AR효과에 미치는 영향을 조사하였다. 그리고 SiO$_{2}$박막의 AR효과는 낮은 기판온도와 높은 증착속도에서 더 우수한 것으로 나타났으며, 이는 SiO$_{2}$AR 박막의 굴절율과 상관관계가 있는 것으로 나타났다. VO$_{2}$ 써모크로믹 유리 위에 SiO$_{2}$AR-코팅을 했을 때 약 30% 정도의 가시광 투과율의 향상이 있었다. 그리고 AR-코팅을 하지 않은 경우보다 더 뚜렷한 써모크로미즘을 나타냈다. 또한 천이온도는 7$0^{\circ}C$정도로 AR-코팅을 하지 않은 VO$_{2}$써모크로믹 유리의 경우와 같게 나타났다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2009.05a
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• pp.264-265
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• 2009

본 연구에서 유도결합 플라즈마 식각 장치외 $BCl_3/Ar/Cl_2$ 가스 혼합비를 이용하여 ZnO 박막을 식각 하였을 때, 식각 된 ZnO 박막의 표면 반응에 관하여 관찰하였다. ZnO 박막의 식각 실험 조건은 RF 전력 700 W, 직류바이어스 전압 - 150 V, 공정 압력 15 mTorr로 고정하였고, $Cl_2/(Cl_2+BCl_3+Ar)$ 가스 혼합비를 변경하면서 식각 실험을 수행하였다. $Cl_2$ 가스가 3 sccm 일 때, ZnO 박막의 식각속도는 53 nm/min으로 가장 높았으며, 이때 ZnO 박막에 대한 $SiO_2$의 선택비는 0.89 이었다. 식각된 ZnO 박막의 표면은 XRD (X-ray diffraction)와 AFM(atomic force microscopy)를 이용하여 결정상의 변화와 표면의 거칠기를 분석하였다. AFM 분석 결과에서 Ar, $BCl_3$와 $Cl_2$ 플라즈마를 이용하여 식각된 시료의 표면 거칠기 근 값이 식각전의 시료나 $BCl_3/Ar/Cl_2$ 플라즈마로 식각된 시료보다 큰 것을 확인하였다. 이는 식각된 시료에서의 Zn 양의 감소나 비휘발성 식각 잔류물에 의한 영향으로 판단된다. SIMS(secondary ion mass spectrometery) 분석을 통해 검증 하였다.

• Journal of the Semiconductor & Display Technology
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• v.20 no.4
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• pp.157-160
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• 2021

As an insulator for a thin film transistor(TFT) and an encapsulation material of organic light emitting diode(OLED), aluminum oxide (Al₂O₃) has been widely studied using several technologies. Especially, in spite of low deposition rate, atomic layer deposition (ALD) has been used as a process method of Al₂O₃ because of its low process temperature and self-limiting reaction. In the Al₂O₃ deposition by ALD method, Ar Purge had some crucial effects on the film properties. After reaction gas is injected as a formation of pulse, an inert argon(Ar) purge gas is injected for gas desorption. Therefore, the process parameter of Ar purge gas has an influence on the ALD deposited film quality. In this study, Al₂O₃ was deposited on glass substrate at a different Ar purge time and its structural characteristics were investigated and analyzed. From the results, the growth rate of Al₂O₃ was decreased as the Ar purge time increases. The surface roughness was also reduced with increasing Ar purge time. In order to obtain the high quality Al₂O₃ film, it was known that Ar purge times longer than 15 sec was necessary resulting in the self-limiting reaction.

• Korean Journal of Materials Research
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• v.12 no.9
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• pp.740-746
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• 2002

In this study, the polycarbonate surface was treated by $O_2$/ Ar gases plasma for the enhancement of adhesion with Cu electrode. From the point of view of hydrophilicity and the functionality, the micro-roughness, new functional groups and oxygen content of the polycarbonate surface were increased by the $O_2$/ Ar gases plasma treatment. The Cu films deposited on the as-received polycarbonate were easily detached while, after the$ O_2$/ Ar gases plasma treatment the adhesive Cu films on polycarbonate could be obtained. These results can be explained that the polycarbonate had a hydrophilic surface with uniform micro-roughness and new functional groups by $O_2$/ Ar gases plasma treatment. Therefore,$O_2$/ Ar gases plasma treatment is a promising method for improvement of adhesion between polycarbonate and Cu electrode.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.15-20
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• 2007

Low temperature processed ZnO-TFTs on glass below $270^{\circ}C$ for plastic substrate applications were fabricated and their electrical properties were investigated. Films in ZnO-TFTs with bottom gate configuration were made by RF magnetron sputtering system except for $SiO_2$ gate oxide deposited by ICP-CVD. ZnO channel films were grown on glass with various Ar and $O_2$ flow ratios. All of the fabricated ZnO-TFTs showed perfectly the enhancement mode operation, a high optical transmittance of above 80% in visible ranges of the spectrum. In the ZnO-TFTs with pure Ar process, the field effect mobility, threshold voltage, and on/off ratio were measured to be $1.2\;cm^2/Vs$, 8.5 V, and $5{\times}10^5$, respectively. These characteristic values are much higher than those of the ZnO-TFTs of which ZnO channel layers were processed with additional $O_2$ gas. In addition, ZnO-TFT with pure Af process showed smaller swing voltage of 1.86v/decade compared to those with $Ar+O_2$ process.

• The Korean Journal of Ceramics
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• v.2 no.1
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• pp.43-47
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• 1996

$RuO_2$ thin films deposited directly on Si substrate by RF magnetron sputtering method using $RuO_2$ target have been investigated. Special interest was focused on the effect of process parameter on the surface roughness of $RuO_2$ films. Crystallization behavior and electrical properties of the films deposited at $300^{\circ}C$ were superior to those deposited at room temperature. Metallic Ru phase was formed in pure Ar and this phase had resulted poor adhesion after post annealing process in oxidizing ambient. Microstructural analysis reveals that the size of the $RuO_2$ crystallites gets smaller and the surface becomes smoother as the $O_2$ partial pressure or film thickness decreases. Irrespective of the $O_2/Ar$ ratio, resistivity of $RuO_2$ films ranged in $50~70 {\mu}{\Omega}-cm$. As the film thickness decreases, there is a thickness where the resistivity rises abruptly. Such an onset thickness turned out to be dependent n the $O_2$/Ar ratio.