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http://dx.doi.org/10.3740/MRSK.2002.12.9.740

Adhesion of Cu on Polycarbonate Modified by O2/ Ar Plasma Treatment  

Park, Jun-Kyu (Department of Materials Engineering, Kyonggi University)
Kim, Dong-Won (Department of Materials Engineering, Kyonggi University)
Kim, Sang-Ho (Department of Materials Engineering, Korea University of Technology and Education)
Lee, Youn-Seoung (Division of Information Communication &Compyter Engineering, Hanbat National University)
Publication Information
Korean Journal of Materials Research / v.12, no.9, 2002 , pp. 740-746 More about this Journal
Abstract
In this study, the polycarbonate surface was treated by $O_2$/ Ar gases plasma for the enhancement of adhesion with Cu electrode. From the point of view of hydrophilicity and the functionality, the micro-roughness, new functional groups and oxygen content of the polycarbonate surface were increased by the $O_2$/ Ar gases plasma treatment. The Cu films deposited on the as-received polycarbonate were easily detached while, after the$ O_2$/ Ar gases plasma treatment the adhesive Cu films on polycarbonate could be obtained. These results can be explained that the polycarbonate had a hydrophilic surface with uniform micro-roughness and new functional groups by $O_2$/ Ar gases plasma treatment. Therefore,$O_2$/ Ar gases plasma treatment is a promising method for improvement of adhesion between polycarbonate and Cu electrode.
Keywords
plasma treatment; surface modification; polycarbonate; adhesion; surface functional group;
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1 M. Charbonnier, M. Alami, M. Romand, J.P. GirardeauMontaut, M. Afif, Appl. Sur. Sci. 109/110,206 (1997)   DOI   ScienceOn
2 Archita Patnaik and Changlin Li, Appl, Surf. Sci 140, 197 (1999)   DOI   ScienceOn
3 J.O. Olowolafe, J. Li and J.W. Mayer, J. Appl. Phys., 68 (12),6207 (1990)   DOI
4 Seok-Keun Koh, Seok-Kyun Song, Won-Kook Choi, Hyung-Jin Jung, and Sung -Nam Han, J. Mater. Res., 10, 2390 (1995)   DOI
5 N. Inagaki, S. Tasaka and H. Kawai, J. Appl. Polym. Sci., Polymer, Chem. Ed., 33. 201 (1995)
6 M. Keil, C.S. Rastomjee, A. R ajag opal, H. Sotobayashi, A.M. Bradshaw, C.L.A. Lamont, D. Gador, C. Buchberger, R. Fink, and E. Umbach, Appl, Sruf. Sci. 125, 273 (1998)   DOI   ScienceOn
7 Y.S. Lee and C.N. Whang, J. Korea Vacuum Society 6, 187 (1997)   과학기술학회마을
8 N. Inagaki, S. Tasaka, H. Kawai and Y. Yasuda, J. Appl. Polym. Sci., 64, 831 (1997)   DOI   ScienceOn
9 G. Beamson, D. Briggs, High Resolution XPS of Organic Polymer, Wiley, New York, pp.180 (1992)
10 J.L. Droulas, Y. Jugnet, and T.M. Due, Metallized plastics 3 edited by K.L. Mittal and J.R. Susko, Plenum press, New York, pp. 303-318 (1989)
11 H. Yasuda, 'Plasma Polymerization', Academic Press, Orlando, Fl (1985)
12 Won Kook Choi, Seok- Keun Koh, and Hyung-Tin Jung, J. Vac. Sci. Technol. A 14, 2366 (1996)   DOI   ScienceOn
13 E.T. Kang, K.L. Tan, K. Kato, Y. Uyama and Y. Ikada, Macromolecules, 29, 6872 (1996)   DOI   ScienceOn
14 A. Nihlstrand, T. Hjertberg and K. Johansson, Polymer, 38, 3581 (1997)   DOI   ScienceOn
15 J.R. Chen and T. Wakida, J. Appl, Polym. Sci., 63, 1733 (1997)   DOI   ScienceOn
16 R.J. Good, J. Adhesion Sci. Technol. 6 (12), 1269 (992)   DOI
17 Jun-Sik Cho, Won-Kook Choi, Ki Hyn Yoon, Hyung-Jin Jung, and Seok-Keun Koh, Mat. Res. Soc. Symp, Pro. 396, 341 (1996)