• Title/Summary/Keyword: $CO_2$ packaging

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Electrical Properties of RFID Tag Antenna Fabricated by Si CMOS Process (Si CMOS 공정을 적용한 RFID 태그 안테나 제작 및 전기적 특성)

  • Lee, Seok-Jin;Park, Seung-Beom;Jung, Tae-Hwan;Lim, Dong-Gun;Park, Jae-Hwan;Kim, Yong-Ho;Mun, Nam-Su
    • Journal of the Microelectronics and Packaging Society
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    • v.16 no.1
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    • pp.21-25
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    • 2009
  • By using Si CMOS process, small RFID tag antenna were fabricated on Si substrate and their electrical properties were evaluated. Firstly, tag antenna pattern and the electromagnetic properties were simulated with HFSS. The frequency was 13.56 MHz, the line-width and line-gap were modeled in the range of $50{\sim}200{\mu}m$. S parameters, SRF, and Q value were calculated from geometry. When the line-width and line-gap were $100{\mu}m$ and $100 {\mu}m$, respectively and the loop-turn was 10, the SRF was 80 MHZ and the Q value was ca. 9. When the microstrip antenna pattern of aluminum $2{\mu}m$ was fabricated by using DC sputtering, Vpp of ca. 4.3 V was obtained when the reader and tag were closely contacted.

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Effects of Temperature/Humidity Treatment Conditions on the Peel Strength between Screen-printed Ag and Polyimide Films (고온/고습 조건이 스크린 프린팅 Ag와 Polyimide의 필 강도에 미치는 영향)

  • Lee, Hyeonchul;Bae, Byeong-Hyun;Son, Kirak;Kim, Gahui;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
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    • v.29 no.2
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    • pp.43-48
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    • 2022
  • Effect of temperature/humidity (T/H) treatment conditions on the peel strength of screen-printed Ag/polyimide (PI) structures was evaluated by peeling PI films in 90° peel test. Initial peel strength was 25.99±1.47 gf/mm, and then decreased to 6.05±0.54 gf/mm after 500 h at 85℃/85% relative humidity T/H condition. And, the peeled locus was changed from Ag/PI interface to shallow cohesive inside PI near interface. X-ray photoelectron spectroscopy analysis on the peeled surfaces showed that the long-term moisture penetration into the Ag/PI interface during T/H treatment led to hydrolytic degradation of PI to form weak boundary layer inside PI near Ag/PI interface, which are responsible for large decrease in peel strength.

Quality Changes of Retorted Samgyetang During Storage Depending on the Degassing Methods (탈기 포장 방법에 따른 레토르트 삼계탕의 저장 중 품질 변화)

  • Jang, Min Jun;Lee, Jin Ho;Lee, Keun Taik
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.19 no.2
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    • pp.67-73
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    • 2013
  • This study investigated the quality changes of Samgyetang during storage, resulting from various degassing methods used at the packaging stage. Three different samples were prepared, one without any treatment (CON), a second with reduced head space volume by squeezing the pouch (RHS), and a third by flushing with nitrogen gas (NGF). These were retorted at $120^{\circ}C$ for 65 min under the F-value of approx. 8.0, and stored at $25^{\circ}C$ for 9 months. The oxygen ratio in the head space and the dissolved oxygen content of NGF samples tended to be lower than those of other samples over the storage period. Compared to the CON, the acid values of NGF and RHS samples were lower than the CON from month 3 and 6 (p<0.05). During storage, volatile basic nitrogen values of NGF and RHS samples increased slowly compared to the CON. To delay quality deterioration and extend the shelf-life of Samgyetang products, the reduction of oxygen content in the head space of the retort pouch (preferably by flushing with nitrogen gas) is recommended, even though no significant differences in sensory evaluation were observed among the samples during 9 months of storage (p>0.05).

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Effect of MeOH/IPA Ratio on Coating and Fluxing of Organic Solderability Preservatives (유기 솔더 보존제의 코팅 및 플럭싱에 대한 메탄올/이소프로필알콜 비율의 영향)

  • Lee, Jae-Won;Kim, Chang Hyeon;Lee, Hyo Soo;Huh, Kang Moo;Lee, Chang Soo;Choi, Ho Suk
    • Korean Chemical Engineering Research
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    • v.46 no.2
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    • pp.402-407
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    • 2008
  • Recent popularity in mobile electronics requires higher standard on the mechanical strength of electronic packaging. Thus, the method of soldering between chip and substrate in electronic packaging process is changing from conventional method using intermetallic compound to a new method using organic solderability preservative (OSP) in order to improve the stability and the reliability of final product. Since current organic solder preservatives have several serious problems like thermo-stability during packaging process, however, it is necessary to develop new OSPs having thermo-stability. The main purpose of this study is to investigate the effect of MeOH/IPA (Isopropyl alcohol) ratio on the fluxing of a new OSP, developed in previous research, andto find out an optimum formulation of flux components for the application of the OSP in current packaging process. As a result of this study, it was revealed that higher MeOH/IPA ratio in flux showed better performance of fluxing a new OSP.

Sterilization Test of Microorganisms of Slow-released ClO2 Gas Gel-Pack (서방출형 이산화염소 가스 젤팩의 미생물 살균 시험)

  • Lee, Kyung-Haeng;Kim, Hong-Gil
    • The Korean Journal of Food And Nutrition
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    • v.31 no.2
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    • pp.308-312
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    • 2018
  • Even though chlorine dioxide ($ClO_2$) is utilized in a pre-treatment due to its effective sterilizing activity for microorganisms and its safety for food, it has a limitation in maintaining freshness of the food product. In this study, a low-concentration $ClO_2$ gas was produced in a packaging form of air-permeable gel pack so that it could be released continuously over several days. The amount of $ClO_2$ gas emission and microbial inactivation effect against foodborne pathogens were measured during the release of $ClO_2$ gas. As a result of measuring the change of color in order to confirm whether the chlorine dioxide gas was eluted in the form of a sustained release, the yellowness was significantly higher at higher gel pack concentration and higher value during storage periods. The slow-released $ClO_2$ gel-pack showed clear inactivation effect against Escherichia coli and Staphylococcus aureus with 99.9% inactivation efficiency. As a result of measuring the sterilization effect of Listeria monocytogenes by the concentration of chlorine dioxide gas, the sterilization effect was increased as the concentration was increased. Therefore, the slow-released $ClO_2$ gel-pack is feasible to apply for industry usages.

Study of the breathable film processing techniques for microwave oven using a laser (레이저를 이용한 전자렌지용 숨쉬는 필름 가공 기술 연구)

  • Sohn, Ik-Bu;Choi, Hun-Kook;Yoo, Dong-Yoon;Noh, Young-Chul;Kim, Joung-Nyon;Kang, Ho-Min
    • Laser Solutions
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    • v.16 no.2
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    • pp.16-18
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    • 2013
  • In this paper, we fabricated breathable films on the use of microwave oven by using UV nanosecond laser micromachining, and the number of micro-grooves on the film is controlled for different oxygen transfer rate(OTR). As different number of micro-groove, the breath films of 100,000cc, 120,000cc, and 150,000cc can be fabricated. The breath film package of 120,000cc is used for the experiment of steaming a sweet potato. At the result, the sweet potato is well-cooked with enough moisture in the package not bursted.

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Wetting Properties of Biopolyester Films Prepared by Thermo-Compression Method

  • Rhim, Jong-Whan;Hong, Seok-In
    • Food Science and Biotechnology
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    • v.16 no.2
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    • pp.234-237
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    • 2007
  • Water resistance of three biopolyester films, such as poly-L-lactate (PLA), poly-hydroxybutyrate-co-valerate (PHBV), and Ecoflex, and low density polyethylene (LDPE) film was investigated by measuring contact angle of various probe liquids on the films. The properties measured were initial contact angle of water, dynamic change of the water contact angle with time, and the critical surface energy of the films. Water contact angle of the biopolyester films ($57.62-68.76^{\circ}$) was lower than that of LDPE film ($85.19^{\circ}$) indicating biopolyester films are less hydrophobic. The result of dynamic change of water contact angle also showed that the biopolyester films are less water resistant than LDPE film, but much more water resistant than cellulose-based packaging materials. Apparent critical surface energy for the biopolyester films (35.15-38.55 mN/m) was higher than that of LDPE film (28.59 mN/m) indicating LDPE film is more hydrophobic.

Quality Changes in Oyster Mushrooms during Modified Atmosphere Storage as Affected by Temperatures and Packaging Materials (저장 온도와 포장재에 따른 느타리버섯의 MA 저장 중 품질변화)

  • Choi, Mi-Hee;Kim, Gun-Hee
    • Korean Journal of Food Science and Technology
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    • v.35 no.6
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    • pp.1079-1085
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    • 2003
  • Modified atmosphere packaging was applied to oyster mushrooms (Pleurotus ostreatus) to study the effect of storage temperatures and packaging materialso. Whole mushrooms (200g) were package with polyethylene film $(PE,\;60{\mu}m\;thickness)$, ethylene vinyl acetate (EVA), or ceramic film (containing 5% zeolite) and stored at 0, 5, 10 and $20^{\circ}C$. Weight loss, color, firmness, gas composition $(O_2,\;CO_2)$ inside the film package and ethanol content in the tissue of MA packaged mushrooms were examined. Mushroom that were packed unwrapped in a conventional hardboard box (2 kg) lost marketability at a very early stage of storage due to weight loss, shrinkage, browning, and spore formation. During storage, film packaging prevented or retarded the deterioration of the mushrooms in the aspects of appearance, texture, and discoloration. Firmness slightly decreased with storage time. Total color difference was much higher in the control than in the film-packaged mushroom and rapidly increased at the early of storage. Correlation analysis showed a high correlation between total color difference and b values. These results were characterized by the reduced respiration rate resulting from elevated carbon dioxide and reduced oxygen levels in the package. At all storage temperatures, ethanol content in the tissue increased slightly at the early part of storage and rose considerably towards the end of the storage period. Ethanol content in the oyster mushrooms was higher in the stipe than in pileus tissues. The shelf life of the oyster mushrooms was about $8{\sim}11$ days at $0^{\circ}C$, about $4{\sim}6$ day at $5^{\circ}C$, about $2{\sim}3$ days at $10^{\circ}C$, and about $1{\sim}2$ days at $20^{\circ}C$.

A Micro Fluxgate Magnetic Sensor with Closed Magnetic Path (폐자로를 형성한 마이크로 플럭스게이트 자기 센서)

  • 최원열;황준식;강명삼;최상언
    • Journal of the Microelectronics and Packaging Society
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    • v.9 no.3
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    • pp.19-23
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    • 2002
  • This paper presents a micro fluxgate magnetic sensor in printed circuit board (PCB). In order to observe the effect of the closed magnetic path, the magnetic cores of rectangular-ring and two bars were each fabricated. Each fluxgate sensor consists of five PCB stack layers including one layer magnetic core and four layers of excitation and pick-up coils. The center layer as a magnetic core is made of a Co-based amorphous magnetic ribbon with extremely high DC permeability of ~100,000. Four outer layers as an excitation and pick-up coils have a planar solenoid and are made of copper foil. In case of the fluxgate sensor having the rectangular-ring shaped core, excellent linear response over the range of -100 $\mu$T to + 100 $\mu$T is obtained with 540 V/Tsensitivity at excitation square wave of 3 $V_{p-p}$ and 360 KHz. The chip size of the fabricated sensing element is $7.3 \times 5.7\textrm{mm}^2$. The very low power consumption of ~8 mW was measured. This magnetic sensor is very useful for various applications such as: portable navigation systems, telematics, VR game and so on.n.

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Effects of Heat Treatment Conditions on the Interfacial Reactions and Crack Propagation Behaviors in Electroless Ni/electroplated Cr Coatings (열처리 조건에 따른 무전해 Ni/전해 Cr 이중도금의 계면반응 및 균열성장거동 분석)

  • Son, Kirak;Choi, Myung-Hee;Lee, Kyu Hawn;Byon, Eungsun;Rhee, Byong-Ho;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
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    • v.23 no.3
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    • pp.69-75
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    • 2016
  • This study investigated the effect of heat treatment conditions not only on the Cr surface crack propagation behaviors but also on the Ni/Cr interfacial reaction characteristics in electroless Ni/electroplated Cr double coating layers on Cu substrate. Clear band layer of Ni-Cr solid solutions were developed at Ni/Cr interface after heat treatment at $750^{\circ}C$ for 6 h. Channeling cracks formed in Cr layer after 1 step heat treatment, that is, heat treatment after Ni/Cr plating, while little channeling cracks formed after 2 step heat treatment, that is, same heat treatments after Ni and Cr plating, respectively, due to residual stress relaxation due to crystallization of Ni layer before Cr plating.