Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Effects of Heat Treatment Conditions on the Interfacial Reactions and Crack Propagation Behaviors in Electroless Ni/electroplated Cr Coatings

열처리 조건에 따른 무전해 Ni/전해 Cr 이중도금의 계면반응 및 균열성장거동 분석

  • Son, Kirak (School of Materials Science and Engineering, Andong National University) ;
  • Choi, Myung-Hee (DAEKYUNG CHEM. CO. LTD.) ;
  • Lee, Kyu Hawn (Surface Technology Division, Korea Institute of Materials Science) ;
  • Byon, Eungsun (Surface Technology Division, Korea Institute of Materials Science) ;
  • Rhee, Byong-Ho (VITZROTECH Co., Ltd.) ;
  • Park, Young-Bae (School of Materials Science and Engineering, Andong National University)
  • 손기락 (안동대학교 신소재공학부 청정에너지소재기술연구센터) ;
  • 최명희 (대경화학(주)) ;
  • 이규환 (한국기계연구원 부설 재료연구소 표면기술본부) ;
  • 변응선 (한국기계연구원 부설 재료연구소 표면기술본부) ;
  • 이병호 ((주) 비츠로테크) ;
  • 박영배 (안동대학교 신소재공학부 청정에너지소재기술연구센터)
  • Received : 2016.08.26
  • Accepted : 2016.09.29
  • Published : 2016.09.30
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Abstract

This study investigated the effect of heat treatment conditions not only on the Cr surface crack propagation behaviors but also on the Ni/Cr interfacial reaction characteristics in electroless Ni/electroplated Cr double coating layers on Cu substrate. Clear band layer of Ni-Cr solid solutions were developed at Ni/Cr interface after heat treatment at $750^{\circ}C$ for 6 h. Channeling cracks formed in Cr layer after 1 step heat treatment, that is, heat treatment after Ni/Cr plating, while little channeling cracks formed after 2 step heat treatment, that is, same heat treatments after Ni and Cr plating, respectively, due to residual stress relaxation due to crystallization of Ni layer before Cr plating.

무전해 Ni/전해Cr이중도금 구조에서 무전해 Ni의 결정화 열처리 조건이 Cr도금의 균열성장 및 Ni/Cr계면반응에 미치는 영향을 분석하였다. 비정질 무전해 Ni/전해 Cr 도금 후 $750^{\circ}C$에서 6시간 동안 1회 열처리한 시편을1단계 열처리 조건으로 정했다. 또한, 무전해 Ni도금 후 동일 열처리를 통해 결정화 시킨 후, 전해 Cr도금 후 한번 더 동일조건 열처리한 경우를 2단계 열처리 조건으로 정하여 상호 비교하였다. 두 가지 열처리 조건 모두에서 공통적으로 Ni/Cr계면에서 상호확산에 의한 Ni-Cr고용체band layer가 관찰되었다. 1단계 열처리 조건의 경우 Cr도금에 관통균열이 발생하였으며, 2단계 열처리 조건의 경우 Cr도금에 표면 미소균열만 형성되고 관통균열은 거의 발생하지 않았다. 이는 무전해 Ni도금 직후 열처리에 의해 Ni-P비정질 구조에서 Ni, $Ni_3P$상으로 결정화되면서 급격한 체적 감소가 발생하여 Cr층의 잔류응력 완화에 영향을 끼쳐서, 상부 전해 Cr도금의 관통균열 형성에 영향을 미치는 것으로 판단된다.

Keywords

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  1. 전해 Cr/Ni-P 도금막의 열 사이클 신뢰성 및 균열거동 분석 vol.26, pp.4, 2016, https://doi.org/10.6117/kmeps.2019.26.4.133