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http://dx.doi.org/10.6117/kmeps.2016.23.3.069

Effects of Heat Treatment Conditions on the Interfacial Reactions and Crack Propagation Behaviors in Electroless Ni/electroplated Cr Coatings  

Son, Kirak (School of Materials Science and Engineering, Andong National University)
Choi, Myung-Hee (DAEKYUNG CHEM. CO. LTD.)
Lee, Kyu Hawn (Surface Technology Division, Korea Institute of Materials Science)
Byon, Eungsun (Surface Technology Division, Korea Institute of Materials Science)
Rhee, Byong-Ho (VITZROTECH Co., Ltd.)
Park, Young-Bae (School of Materials Science and Engineering, Andong National University)
Publication Information
Journal of the Microelectronics and Packaging Society / v.23, no.3, 2016 , pp. 69-75 More about this Journal
Abstract
This study investigated the effect of heat treatment conditions not only on the Cr surface crack propagation behaviors but also on the Ni/Cr interfacial reaction characteristics in electroless Ni/electroplated Cr double coating layers on Cu substrate. Clear band layer of Ni-Cr solid solutions were developed at Ni/Cr interface after heat treatment at $750^{\circ}C$ for 6 h. Channeling cracks formed in Cr layer after 1 step heat treatment, that is, heat treatment after Ni/Cr plating, while little channeling cracks formed after 2 step heat treatment, that is, same heat treatments after Ni and Cr plating, respectively, due to residual stress relaxation due to crystallization of Ni layer before Cr plating.
Keywords
chromium plating; electroless nickel; micro crack; channeling crack;
Citations & Related Records
Times Cited By KSCI : 3  (Citation Analysis)
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