Effects of Heat Treatment Conditions on the Interfacial Reactions and Crack Propagation Behaviors in Electroless Ni/electroplated Cr Coatings |
Son, Kirak
(School of Materials Science and Engineering, Andong National University)
Choi, Myung-Hee (DAEKYUNG CHEM. CO. LTD.) Lee, Kyu Hawn (Surface Technology Division, Korea Institute of Materials Science) Byon, Eungsun (Surface Technology Division, Korea Institute of Materials Science) Rhee, Byong-Ho (VITZROTECH Co., Ltd.) Park, Young-Bae (School of Materials Science and Engineering, Andong National University) |
1 | D. Nava, C. E. Davalos, A. M. Hernandez, F. Manriquez, Y. Meas, R. O. Borges, J. J. Bueno and G. Trejo, "Effects of Heat Treatment on the Tribological and Corrosion Properties of Electrodeposited Ni-P Alloys", Int. J. Electrochem. Sci., 8, 2670 (2013). |
2 | B. Lim, K. J. Lee, Y. M. Han and H. S. Choi, "Results of Repeated Thermal Shock Tests on Coating Methods for Combustion Chamber of Liquid Rocket Engine(in Kor.)", Korea Aerospace Research Institute symposium, 16 (2008). |
3 | C. F. Malfatti, J. Z. Ferreira, C. T. Olveira, E. S. Rieder and J. P. Bonino, "Electrochemical behavior of Ni-P-SiC composite coatings: Effect of heat treatment and SiC particle incorporation", Materials and Corrosion, 63(1), 36 (2012). DOI |
4 | D. B. Lewis and G. W. Marshall, "Investigation into the structure of electrodeposited nickel-phosphorus alloy deposits", Surf. Coat. Technol., 78, 150 (1996). DOI |
5 | E. Menthe and K.-T. Rie, "Plasma nitriding and plasma nitrocarburizing of electroplated hard chromium to increase the wear and the corrosion properties", Surface & coating tech., 112, 217 (1999). DOI |
6 | K. H. Lee, "Application of Plating Simulation for PCB and Packaging Process(in Kor.)", J. Microelectron. Packag. Soc., 19(3), 1 (2012). DOI |
7 | K. Y. Lee, H. J. Won, S. W. Jun, T. S. Oh, J. Y. Byun and T. S. Oh, "Electrical Resistivity and Solder-Reaction Characteristics of Ni Films Fabricated By Electroplating(in Kor.)", J. Microelectron. Packag. Soc., 12(3), 253 (2005). |
8 | S. Y. Chun, I. S. Kang, Y. M. Rhym, D. H. Kim and J. H. Lee, "Comparison of Acidic and Alkaline Bath in Electroless Nickel Plating on Porous Carbon Substrate(in Kor.)", J. Kor. Inst. Surf. Eng., 43(2), 105 (2010). DOI |
9 | S. Alirezaei, S.M. Monirvaghefi, M. Salehi and A. Saatchi, "Wear behavior of Ni-P and Ni-P- electroless coatings", Wear, 262, 978 (2007). DOI |
10 | Y. S. Huang and F. Z. Cui, "Effect of complexing agent on the morphology and microstructure of electroless deposited Ni-P alloy", Surf. Coat. Tech., 201, 5416 (2007). DOI |
11 | P. L. Neto, A. N. Correia and G. P. Silva, "Structural and Morphological Investigations of the Electrodeposited Cr and Ni-Cr-P Coatings and their Electrochemical Behaviors in Chloride Aqueous Medium", J. Braz. Chem. Soc., 17(7), 1419 (2006). DOI |
12 | W. Pfeiffer, C. Koplin, E. Reisacher and J. Wenzel, "Residual Stresses and Strength of Hard Chromium Coatings", Materials Science Forum, 681, 133 (2011). DOI |
13 | M. H. Sohi, A. A. Kashi and S. M. M. Hadavi, "Comparative tribological study of hard and crack-free electrodeposited chromium coatings", J. Mat. Pro. Tech., 138, 219 (2003). DOI |
14 | M. Kohl, "A process for the direct or indirect electrodeposition of a highly corrosion resisting crack free technical hard chromium plating layer", UK Patent, GB2236763A (1991). |
15 | H. R. Cho, J. S. Bang, B. H. Rhee, K. J. Lee, B. Lim, Y. M. Han and H. S. Choi, "Development of Ni/Cr Plating Process for LRE Thrust Chamber(in Kor.)", KSPE Fall Conference, 603 (2009). |
16 | M. H. Choi, Y. B. Park, B. H. Rhee, E. Byon and K. H. Lee, "Effect of Heat Treatment on Interface Behavior in Ni-P/Cr Double Layer(in Kor.)", J. Kor. Inst. Surf. Eng., 48(6), 260 (2015). DOI |
17 | S. R. Ryu, S. J. Myung, B. K. Koo, B. D. Kang, J. C. Ryu and D. J. Kim, "Effect of Annealing Conditions on Properties of Ni-Cr Thin Film Resistor(in Kor.)", J. Microelectron. Packag. Soc., 11(1), 37 (2004). |