• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.5 no.2
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• pp.59-62
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• 1999

After reported that Styrene dimer and Styrene trimer was Endocrine Disrupter, if it was a fact or not, the sales of PSP noodle cup was rapidly decreased and social responsibilities of the substitution materials development was raised. Therefore we had studied many materials like paper, pulp mold, PP injection molding, PP lamination, etc as substitution materials and selected paper cup which was safe in many sides and easy to recycle. Mainly we had checked the shape, safety, stability and recycling possibility of paper cup and secured many data which could prove them.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.2
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• pp.49-54
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• 2002

Cobalt silcides thin films were prepared on Poly-Si/$SiO_2$/Si substrates by Co metal depostion using E-beam evaporation method and rapid thermal annealing for the application of inkjet printing heater. The crystal phases and composition distributions of the films were investigated as functions of the rapid thermal annealing (RTA) temperatures (600~$900^{\circ}C$) and times (20~40 sec). The high temparature thermal stability was also investigated by the analysis of sheet resistance and crystalline properties. The stable $CoSi_2$ phases were obtained by the RTA annealing at $800^{\circ}C$ for 20 seconds showing $0.8 \Omega /\Box$ of sheet resitance. However, the sheet resistances were sharply increased at below $700^{\circ}C$ due to changes of crystalline phases. The temperature resistance coefficient of heating elements was found to be about $0.0014/^{\circ}C$, and the obtained cobalt silicided films can be applied to the printer heating elements.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.19 no.1
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• pp.7-10
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• 2013

A packaging system integrated in primary and secondary packages to deliver consumers fresh peach in the produce supply chain was designed and its effectiveness on quality preservation was tested. The master packaging system was designed to contain 6 individual polypropylene film (PP, $30{\mu}m$ thickness) packages of 300 g peach fruit inside $35{\mu}m$ thick low density polyethylene (LDPE) bag located in a corrugated paperboard box. As a variable to attain the desired package atmosphere around the fruit during cold storage and subsequent retail display at higher temperature, different numbers (1, 3 and 7) of microperforations in $59{\mu}m$ diameter were tested on the individual PP packages. As control treatment, six fruits were placed without wrapping in a corrugated paperboard box. During the storage at $5^{\circ}C$, the control and individual packages were periodically separated from the box or master package, moved to the simulated retail shelf conditions of $20^{\circ}C$ and then stored for 3 more days with package atmosphere and fruit quality being measured. The package with 7 microperforations was the best in the ability to attain beneficial MA of 6~10% $O_2$ and 11~19% $CO_2$ around the fruit during the chilled storage at $5^{\circ}C$ and simulated retail display at $20^{\circ}C$. Packages with smaller number of microperforations resulted in anaerobic atmosphere at the low temperature storage and/or the subsequent high temperature display. Compared to control, all the treatments with master packaging system gave better retention of fruit firmness with significantly less weight loss.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.635-636
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• 2006

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.1-6
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• 2008

Thermoelectric properties of calcium cobalt layer structure oxide system, $Ca_3Co_2O_6$ and $Ca_3Co_4O_9$ were investigated at the temperature range of 300 to 1000K for the application of thermoelectric generation. In the composition, the Ca site was partially substituted with Bi, Sr, La, K and the Co site was partially substituted with Mn, Fe, Ni, Cu, Zn. The thermoelectric properties of Bi substituted $Ca_3Co_4O_9$. $Ca_{2.7}Bi_{0.3}Co_4O_9$ for electrical conductivity, Seebeck coefficient and power factor were $85.4({\Omega}$cm)^{-l}, $176.2{\mu}V/K$ and $265.2{\mu}W/K^m$, respectively. The unit thermoelectric couple was fabricated with the p-type of $Ca_{2.7}Bi_{0.3}Co_4O_9$ and n-type ($Zn_{0.98}Al_{0.02}$)O thermoelectrics whose figure-of-merit(Z) were $0.87{\times}10^{-4}/K$ and $0.41{\times}10^4/K$, respectively. The generated thermoelectric power was about 30mV at the temperature difference of 120K in the unit thermoelectric couple.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.12 no.1
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• pp.63-73
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• 2006

The first packaging of Korean market milk dates back to July 1937 when Seoul Dairy Co-operative (Kyung Seong Dairy Co-operative in those days) used 1 hob (180 ml) glass bottles with either paper caps or cork caps. During 1945-1972, 2 hob (360 ml) glass bottles were produced, and iron caps and egret-shaped plastic film replaced the previously used caps. When there were insufficient numbers of milk bottles, other glass bottles such as soda drink bottles and beer bottles were used instead. Seoul Dairy Co-operative was the only dairy company existing in Korea until Nam Yang Dairy Co. Ltd was founded in March 1964, followed by Hae Tae Dairy Co. Ltd(Tae Han Food Public Corporation in those days) in 1969 and Mae-il Dairy Co. Ltd (Korea Dairy Company in those days) in May 1971. As many other dairy companies along with the above-mentioned companies were established, a variety of dairy products were packaged and marketed. In 1971 Seoul Dairy Co-operative first used triangular-shaped polyethylene film wrappers, and in 1972 Nam Yang Diary was the first company importing sterilized Tetra pak for the packaging of milk. Since 1974 rectangular shaped polyethylene film wrappers and plastic bottles were used. In 1977 the gable top carton pack made of paper was first introduced by Seo Joo Industry Co. Ltd, and its market share increased rapidly with gradual increase in its volume, from 180ml to 200ml, to 250ml, to 500ml and finally to 1,000ml, causing change in the volume of milk consumption. And in Sep. 1987 Pasteur market milk Co. Ltd. first used round type high density polyethylene bottle(body) with low density polyethylene cap of 245g, 490g and 980g volumes respectively.

• Korean Journal of Food Science and Technology
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• v.30 no.2
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• pp.272-277
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• 1998

In order to study storage stability of fresh jujube fruits (Zizyphus jujuba Miller) controlled atmosphere storage, polyethylene film packaging and non-packaging were compared. Jujube fruits were stored on the following gas compositions: 1.5% carbon dioxide and 5, 8, 10, 12% oxygen at $7^{\circ}C$, respectively. And 0.05 mm PE packaging and non-packaging were stored at $1^{\circ}C,\;4^{\circ}C\;and\;7^{\circ}C$. Safe storage period of Bokjo jujube fruits was four weeks when stored in CA condition of $O_2\;10%\;and\;CO_2\;1.5%$ in terms of their overall quality. The rate of weight loss was not much changed either by storage method of CA or by PE film packaging. In surface color the a value of jujube fruits increased but L and b values decreased during the storage period. Hardness showed the trend of increase in all the treatment for 2 weeks of storage while in CA it decreased more than the others after 4 weeks of storage. Soluble solids and titratable acidity were changed slightly. Vitamin C contents were gradually decreased in all treatments, but non-packed jujubes at $1^{\circ}C$ were slightly increased.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.22 no.2
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• pp.33-37
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• 2016

One-way degassing valves usually designed for coffee packaging are recently applied to the various food packaging such as fermented health functional food or home meal replacement (HMR) packaging. The optimized degassing pressure by food product is important factor for keeping effective freshness and improving preservation of the food, therefore the development of degassing valves specified with various open pressure is needed. In this study, the mechanical characteristics of the degassing valve with ring type rubber disk were analyzed and a mathematical model was developed to predict the open pressure of the valve. The model was verified with test results derived from several available valves, and it may be useful in designing and developing a new valve.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.41-47
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• 2020

The effect of Co interlayer on the interfacial reliability of SiN_x/Co/Cu thin film structure for advanced Cu interconnects was systematically evaluated by using a double cantilever beam test. The interfacial adhesion energy of the SiN_x/Cu thin film structure was 0.90 J/㎡. This value of the SiN_x/Co/Cu thin film structure increased to 9.59 J/㎡.Measured interfacial adhesion energy of SiN_x/Co/Cu structure was around 10 times higher than SiN_x/Cu structure due to CoSi₂ reaction layer formation at SiN_x/Co interface, which was confirmed by X-ray photoelectron spectroscopy analysis. The interfacial adhesion energy of SiN_x/Co/Cu structure decreased sharply after post-annealing at 200℃ for 24 h due to Co oxidation at SiN_x/Co interface. Therefore, it is required to control the CoO and Co₃O₄ formation during the environmental storage of the SiN_x/Co/Cu thin film to achieve interfacial reliability for advanced Cu interconnections.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.2
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• pp.1-9
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• 2017

Recently, there has been a continuous researches on solders having sophisticated and improved performance due to demand for high-density and miniaturization of electronics, and development of solder for automotive electronics which can be used in harsh environment. When developing a new solder alloy, there is a wettability of solder on substrate for things to consider, and the wetting balance test is one of the methods for measuring that one. In this paper, the wetting balance test is introduced, and the calculus of the surface tension of solder and the contact angle between solder and substrate using wetting curve obtained is introduced too. In detail, the principle and test method of the wetting balance test, the introduction of the parameters with important meaning in the wetting curve, the method of calculating the contact angle as well as the surface tension of the solder using the shape of the solder meniscus.