• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.8
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• pp.461-465
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• 2016

n-type silicon shows the better tolerance towards metal impurities with a higher minority carrier lifetime compared to p-type silicon substrate. Due to better lifetime stability as compared to p-type during illumination made the photovoltaic community to switch toward n-type wafers for high efficiency silicon solar cells. We fabricated the front electrode of the n-type solar cell with AgAl paste. The electrodes characteristics of the AgAl paste depend on the contact junction depth that is closely related to the firing temperature. Metal contact depth with p+ emitter, with optimized depth is important as it influence the resistance. In this study, we optimize the firing condition for the effective formation of the metal depth by varying the firing condition. The firing was carried out at temperatures below $670^{\circ}C$ with low contact depth and high contact resistance. It was noted that the contact resistance was reduced with the increase of firing temperature. The contact resistance of $5.99m{\Omega}cm^2$ was shown for the optimum firing temperature of $865^{\circ}C$. Over $900^{\circ}C$, contact junction is bonded to the Si through the emitter, resulting the contact resistance to shunt. we obtained photovoltaic parameter such as fill factor of 76.68%, short-circuit current of $40.2mA/cm^2$, open-circuit voltage of 620 mV and convert efficiency of 19.11%.

• Korean Journal of Chemical Engineering
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• v.35 no.12
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• pp.2452-2463
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• 2018

Surface treatment of sol-gel bioglass is required to increase its biomedical applications. In this study, a dielectric barrier discharge (DBD) plasma treatment in atmospheric pressure was performed on the surface of [$SiO_2-CaO-P_2O_5-B_2O_3$] sol-gel derived glass. The obtained bioglass was treated by plasma using discharge current 12 mA with an exposure period for 30 min. The type of discharge can be characterized by measuring the discharge current and applied potential waveform and the power dissipation. Apatite formation on the surface of the DBD-treated and untreated samples after soaking in simulated body fluid (SBF) at $37^{\circ}C$ is characterized by Fourier transform infrared spectroscopy (FTIR), X-Ray diffraction (XRD), inductively coupled plasma (ICP-OES) and scanning electron microscopy coupled with energy dispersive spectroscopy (SEM/EDS). We observed a marked increase in the amount of apatite deposited on the surface of the treated plasma samples than those of the untreated ones, indicating that DBD plasma treatment is an efficient method and capable of modifying the surface of glass beside effectively transforming it into highly bioactive materials.

• Transactions of the Korean hydrogen and new energy society
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• v.9 no.4
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• pp.169-176
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• 1998

An experimental study on effect of vapor-cooled heat stations in a 5.5 liter cryogenic vessel has been performed. The cryogenic vessel is made of stainless steel of thickness of 1mm and insulated by the combined insulation of vacuum, MLI(multi-layer insulation) and vapor-cooled radiation shield. Vapor-cooled heat stations are also constructed based on the 1-dimensional thermal analysis to reduce the heat inleak through a filling tube. Thermal analysis indicates that the vapor-cooled heat stations can substantially enhance the performance of vessel for cryogenic fluids with high $C_p/h_{fg}$ where $C_p$ the specific heat and $h_{fg}$ the heat of vaporization, such as $LH_2$ and LHe. The experimental results for $LN_2$ shows that the total heat inleak into inner vessel consists of 14% radiation and 86% conduction through the filling tube. Therefore, it is expected that the conduction heat in leak of the vessel for high $C_p/h_{fg}$ cryogenic fluids can be significantly reduced. powders. The amount of copper coating was 20wt%. In order to examine corrosion behavior of the electrodes, the corrosion current and the current density, in 6M KOH aqueous solution after removal of oxygen in the solution, were measured by potentiodynamic and cyclic voltamo methods. The results showed that Co in the alloy increased corrosion resistance of the electrode whereas Ni decreased the stability of the electrode during the charge-discharge cycles. The electrode used Si sealant as a binder showed a lower corrosion current density than the electrode used PTFE and the electrode used Cu-coated alloy powders showed the best corrosion resistance.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.1760-1762
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• 2000

본 논문은 기존의 $Si_{3}N_4$, SiN 물질 대신 Pt를 사용해 HF 용액속에서 다공질 실리콘과 전극을 동시에 형성하는 기술을 개발하였다. Pt를 실리콘 웨이퍼 위에 직접 증착한 후 습식 에칭과 Lift-off 공정을 사용하여 Pt를 패터닝하였다. 습식 에칭은 에칭용액의 온도를 일정하게 유지하는 것이 중요하며, 증착한 Pt 박막이 BOE 에칭에 견디고, Lift-off 공정이 가능하기 위해서는 기판온도를 l100$^{\circ}C$ 이하로 해야한다. Pt를 사용하면 기존의 mask에서 발생하는 가장자리 부분에서의 전류 집중이 방지되기 때문에 다공질 실리콘이 일정한 깊이로 형성되고, Al대신 오믹 전극으로 사용할 수 있다. 현재 Pt를 mask와 전극으로 이용한 P-I-N UV detector, 광 바이오센서, 습도센서 제작등에 응용 연구가 진행되고 있다.

• Journal of the korean academy of Pediatric Dentistry
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• v.30 no.3
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• pp.530-539
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• 2003

The aim of this study was to evaluate the resistance to degradation of four commercial composite resins in an alkaline solution. The brands studied were Charisma, Filtek P 60, Palpique Estelite, and Spectrum. Preweighed discs of each brand were exposed to 0.1N NaOH solution at $60^{\circ}C$. After 2 weeks they were removed, neutralized with HCl, washed with water and dried. Resistance to degradation was evaluated on the basis of following parameters: (a) mass loss(%) - determined from pre-and post-exposed specimen weights; (b) Si loss(ppm) - obtained from ICP-AE analysis of solution exposed to specimens; and (c) degradation depth(${\mu}m$) - measured SEM and CLSM from polished circular sections of exposed specimens. The results were as follows: 1. The sequence of mass loss was in descending order by Palpique Estelite, Filtek P 60, Charisma, and Spectrum. 2. The sequence of the degree of degradation layer depth was in descending order by Filtek P 60, Charisma, Palpique Estelita, and Spectrum. 3. The sequence of the Si loss was in descending order by Chrisma, Spectrum, Palpique Estelite, and Filtek P 60. 4. The correlation coefficient between mass loss and degradation layer depth was relatively high(r=0.704, p<0.05). 5. When observed with SEM, destruction of bonding was observed between resin matrix and filler. 6. When observed with CLSM, degradation layer depth of composite resin surface was observed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.148-148
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• 2008

Low-k dielectric materials are an alternative plan to improve the signal propagation delay, crosstalk, dynamic power consumption due to resistance and parasitic capacitance generated the decrease of device size. Now, various materials is studied for the next generation. Diethoxymethlysiliane (DEMS) precursor using this study has two ethoxy groups along with one methyl group attached to the silicon atoms. SiCOH thin films were deposited on p-type Si(100) substrate by Plasma Enhanced Chemical Vapor Deposition (PECVD) using DEMS. In this study, we studied the effect of oxygen($O_2$) flow rate for DEMS to characteristics of thin films. The characteristics of thin films deposited using DEMS and $O_2$ evaluated through refractive index, dielectric constant(k), surface roughness, I-V(MIM:Al / SiCOH / Ag), C-V(MIM), deposition rate.

• Applied Chemistry for Engineering
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• v.21 no.4
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• pp.417-423
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• 2010

In this study, an effective method to prepare granular binderless ZSM-5 which is as efficient p-xylene separatory adsorbent was explored. Colloidal silica sol 30 wt% solution as an inorganic binder and microcrystalline cellulose as an organic additive were added to ZSM-5 powder ($SiO_2/Al_2O_3$ = 50). Adsorbent with enough strength (0.721 kgf), high crystallinity (94.6%) and high BET specific surface area ($379.2m^2$/g) was obtained by calcination, binderless treatment, ${NH_4}^+$ ion exchange, and activation after spherical granulation process. A batch type adsorption experiment was proceeded with solutions comprising 3 xylene isomers by 1 : 1 : 1 weight ratio to evaluate adsorption characteristics of prepared absorbent. As a result, the obtained binderless ZSM-5 granule showed a higher selective adsorption performance for para-xylene than that of commercial adsorbent.

• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.106-106
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• 2000

반도체 소자가 미세화 됨에 따라 게이트 유전막으로 사용되는 SiO2의 박막화가 요구되나, boron penetration에 의한 Vt shift, 게이트 누설전류, 다결정 실리콘 게이트의 depletion effect 그리고 quantum mechanical effect 때문에 ~20 급에서 한계를 나타내고 있다. 이에 0.1$\mu\textrm{m}$이상의 design rule을 갖는 logic이나 memory 소자에서 요구되어지는 ~10 급 게이트 산화막은 SiO2(K=3.9)를 대신하여 고유전율을 갖는 재료의 채택이 필수 불가결하게 되었다. 고유전 박막 재료를 사용하면, 두께를 두껍게 해도 동일한 inversion 특성이 유지되고 carrier tunneling 이 덜하여 등가 산화막의 두께를 줄일 수 있다. 이러한 고유전박막 재료중 가장 활발히 연구되고 있는 재료는 Ta2O5, Al2O3, STO 그리고 BST 등이 있으나 Ta2O5, STO, BST 등은 실리콘 기판과 직접 반응을 한다는 문제를 가지고 있으며, Al2O3는 유전율이 낮의 재료가 최근 주목받고 있다. 본 실험에서는 ZrO2, HfO2 또는 그 silicates 등의 재료가 최근 주목 받고 있다. 본 실험에서는 ZrO2 박막의 증착조건에 따른 물리적, 전기적 특성 변화에 대하여 연구하였다. RCA 방식으로 세정한 P-type (100) 실리콘 기판위에 reactive DC sputtering 방법으로 압력 5mtorr, power 100~400W, 기판온도는 100-50$0^{\circ}C$로 변화시켜 ZrO2 박막을 증착한 후 산소와 아르곤 분위기에서 400-80$0^{\circ}C$, 10-120min으로 열처리하였다. 증착직후의 시편들과 열처리한 ZrO2 박막의 미세구조와 전기적 특성 변화를 관찰하였다. 우선 굴절율(RI)를 이용해 ZrO2 박막의 밀도를 예측하여 power와 기판온도에 따라 이론값 2.0-2.2 에 근접한 구조를 얻은 후 XRD, XPS, AFM, 그리고 TEM을 사용하여 ZrO2 박막의 chemical bonding, surface roughness 그리고 interfacial layer의 특성을 관찰하였다. 그리고 C-V, I-V measurement를 이용해 capacitance, 유전율, 누설전류 등의 전기적 특성을 관찰해 최적 조건을 설정하였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2003.10a
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• pp.119-119
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• 2003

Plasma polymerized organic thin films were deposited on Si(100) glass and Copper substrates at 25 ∼ 100 $^{\circ}C$ using cyclohexane and ethylcyclohexane precursors by PECVD method. In order to compare physical and electrochemical properties of the as-grown thin films, the effects of the RF plasma power in the range of 20∼50 W and deposition temperature on both corrosion protection efficiency and physical properties were studied. We found that the corrosion protection efficiency (P$\_$k/), which is one of the important factors for corrosion protection in the interlayer dielectrics of microelectronic devices application, was increased with increasing RF power. The highest P$\_$k/ value of plasma polymerized ethylcyclohexane film (92.1% at 50 W) was higher than that of the plasma polymerized cyclohexane film (85.26% at 50 W), indicating inhibition of oxygen reduction. Impedance analyzer was utilized for the determination of I-V curve for leakage current density and C-V for dielectric constants. To obtain C-V curve, we used a MIM structure of metal(Al)-insulator(plasma polymerized thin film)-metal(Pt) structure. Al as the electrode was evaporated on the ethylcyclohexane films that grew on Pt coated silicon substrates, and the dielectric constants of the as-grown films were then calculated from C-V data measured at 1㎒. From the electrical property measurements such as I-V ana C-V characteristics, the minimum dielectric constant and the best leakage current of ethylcyclohexane thin films were obtained to be about 3.11 and 5 ${\times}$ 10$\^$-12/ A/$\textrm{cm}^2$ and cyclohexane thin films were obtained to be about 2.3 and 8 ${\times}$ 10$\^$-12/ A/$\textrm{cm}^2$.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.92-92
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• 1999

양자우물 무질서화 기술은 양자우물구조의 성장후 그 구조의 밴드갭을 국부적으로 변화시킬 수 있는 기술적 특성으로 인해 기존의 광기능 소자 제작을 위한 결정재성장방법을 대체 혹은 보완할 수 있는 장점이 있기 때문에 최근 활발히 연구되고 있다. 여러 가지 양자우물 무질서화공정중 유전체 박막을 사용하는 impurity free vacancy disordering (IFVD) 공정은 불순물이 개입하지 않는 공정으로 공정후 양질의 반도체 표면을 유지할 수 있는 장점이 있으며 고아소자 제작시 광손실의 증가를 초래하지 않는다. 이 공정은 vacancy의 source로 작용하는 유전체박막의 특성에 크게 의존하며 GaAs/AlGaAs 계열의 양자우물에서는 많은 연구가 진행되었으나, 광통신용 광소자의 제작에 사용되는 InGaAs/InGaAsP 계열의 양자우물에 대한 연구는 충분하지 않다. 그림 1은 IFVD를 위해 본 연구에서 사용된 CBE로 성장한 InGaAs/InGaAsP SQW 구조이다. 성장된 구조는 상온에서의 QW peak, λpl=1550nm 이었다. IFVD를 위한 유전체 덮개층으로는 PECVD로 성장 조정하여 박막성장시의 조건을 변화시킴으로써 유전체 덮개층 박막의 특성을 변화시켰다. 그림 2는 질소 분위기의 furnace에서 75$0^{\circ}C$로 8분간 IFVD를 수행한후 측정한 무질서화된 양자우물의 상온 PL spectrum을 보여준다. 그림에서 보는바와 같이 동일한 SiNx 덮개층을 사용하는 경우에도 적어도 24meV의 bandgap차를 갖는 양자우물을 영역을 동일한 기판상에 제작할 수 있음을 알 수 있다. 일반적으로 IFVD 방법으로 국부적으로 양자우물을 무질서화 하기 위해서는 SiNx/SiO2와 같은 강이한 박막을 사용하였지만 이 방법을 사용하는 경우 상이한 박막을 사용하는 데서 야기되는 제반 문제를 해결할 수 있을 것으로 판단된다. 따라서 이 기술은 기존의 광소자 제작을 위한 IFVD 방법의 문제점을 해결할 뿐만 아니라 결정 재성장 없이 도일한 기판상에 국부적으로 상이한 bandgap 영역을 만들 수 있기 때문에 광소자 제작에 적극 이용될 수 있다.