• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.1
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• pp.158-166
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• 2003

The paper describes the development and application of advanced evolutionary computing techniques referred to as micro genetic algorithms ($\mu$GA) in the context of engineering design optimization. The basic concept behind $\mu$GA draws from the use of small size of population irrespective of the bit string length in the representation of design variable. Such strategies also demonstrate the faster convergence capability and more savings in computational resource requirements than simple genetic algorithms (SGA). The paper first explores ten-bar truss design problems to see the optimization performance between $\mu$GA and SGA. Subsequently, $\mu$GA is applied to a realistic engineering design problem in the injection molding process optimization.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.1
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• pp.65-70
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• 1994

GaAs power MESFETs with 0.8$\mu$m gate lengths are fabricated using image reversal (IR) methods on the wafer with an undoped surface layer grown by MOCVD. The fabricated GaAs power MESFETs with an undoped surface layer show that an ideality factor 1.17, a built-in potential 0.83 V, a pinch-off voltage -2.7 V, a specfic contact resistance 1.21$\times$10$^{5}$ ~3.42$\times$10$^{2}$$\Omega$-cm$^{2}$ and an extrinsic g$_{m}$ = 103.5 mS/mm. The maximum RF output power densities of the 0.8$\mu$m devices are 360 mW/mm and 499 mW/mm, and power added efficiencies 29.67% and 29.05%, for the unit gate width 150$\mu$m and 200$\mu$m at 12 GHz.

• IE interfaces
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• v.20 no.4
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• pp.504-514
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• 2007

The multicast routing problem lies in the composition of a multicast routing tree including a source node and multiple destinations. There is a trade-off relationship between cost and delay, and the multicast routing problem of optimizing these two conditions at the same time is a difficult problem to solve and it belongs to a multi-objective optimization problem (MOOP). A multi-objective genetic algorithm (MOGA) is efficient to solve MOOP. A micro-genetic algorithm(${\mu}GA$) is a genetic algorithm with a very small population and a reinitialization process, and it is faster than a simple genetic algorithm (SGA). We propose a multi-objective micro-genetic algorithm (MO${\mu}GA$) that combines a MOGA and a ${\mu}GA$ to find optimal solutions (Pareto optimal solutions) of multicast routing problems. Computational results of a MO${\mu}GA$ show fast convergence and give better solutions for the same amount of computation than a MOGA.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.10
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• pp.885-888
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• 2008

We present simulation results on DC characteristics of AlGaN/GaN HEMTs having trench shaped source/drain Ohmic electrodes. In order to reduce the contact resistance in the source and drain region of the conventional AlGaN/GaN HEMTs and thereby to increase their DC output power, we applied narrow-shaped-trench electrode schemes whose size varies from $0.5{\mu}m$ to $1{\mu}m$ to the standard AlGaN/GaN HEMT structure. As a result, we found that the drain current was increased by 13 % at the same gate bias condition and the transconductance (gm) was improved by 11 % for the proposed AlGaN/GaN HEMT, compared with those of the conventional AlGaN/GaN HEMTs.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.220-220
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• 2010

펄스 직류 $BCl_3$ 플라즈마를 이용하여 GaAs와 AlGaAs의 건식식각을 연구하였다. 공정의 주요 변수는 펄스 직류 전압(350~550V), 펄스 직류 시간($0.4{\sim}1.2{\mu}sec$.), 펄스 직류 주파수(100~250kHz)이었다. 식각 실험 후 샘플의 식각률, 식각 선택도, 표면 형상을 비교, 분석하였다. 또한, 광학 발광 분석기(Optical Emission Spectroscopy)를 이용하여 식각하는 동안 플라즈마 방전 특성을 분석하였다. 표면 단차 측정기(Alpha-step IQ, Tencor)로 식각 깊이를 측정해 식각률을 계산하였다. 표면 거칠기 또한 단차 측정기의 표면 거칠기 프로그램을 이용하여 분석하였다. 식각 벽면과 표면 상태는 주사전자현미경(Field-emission scanning electron microscopy)을 이용하여 관찰하였다. 분석 결과는 1) 펄스 직류의 전압이 증가하면 전극에 걸리는 파워가 올라가고 GaAs와 AlGaAs의 식각률도 증가하였다. 2) 76 mTorr 공정 압력, $0.7{\mu}sec$. 펄스 직류 시간과 200 kHz 주파수 일 때 10 sccm $BCl_3$ 펄스 직류 플라즈마에서 GaAs와 AlGaAs 둘 다 약 $0.4{\mu}m/min$ 이상의 식각 속도를 보여주었다. 3) 식각 선택도는 펄스 직류의 전압이 높아지면 증가하였고, 펄스 직류 주파수의 증가도 공정 파워와 GaAs와 AlGaAs의 식각률을 증가시켰다. 4) 그러나 펄스 직류 주파수가 150kHz 이하일 때에는 GaAs와 AlGaAs가 거의 식각되지 않았다. 5) 표면 거칠기는 펄스 직류 주파수가 증가하면 미세하게 좋아졌고 플라즈마는 펄스 직류 주파수가 100~250kHz 일 때 생성되었다. 6) 펄스 직류 시간의 증가는 공정 파워, 식각률, 식각 선택도 모두의 증가를 가져왔다. 7) 광학발광분석기(OES) 데이타는 $BCl_3$ 플라즈마에서 넓은 범위(450~700nm)에서의 염소(Cl) 분자 피크를 나타내었다. 8) 전자 현미경 사진은 펄스 직류 전압이 400 V보다 550 V 일 때보다 더 이방성(Anisotropic)측면과 부드러운 표면을 나타냈지만, 조금의 홈(Trench)이 발견되었다. 결론적으로 펄스 직류 $BCl_3$ 플라즈마는 GaAs와 AlGaAs의 건식식각에서 우수한 결과를 나타냈었다.

• Korean Journal of Optics and Photonics
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• v.7 no.3
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• pp.287-294
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• 1996

An optical phase modulator is fabricated in GaAs/AlGaAs doble heterostructure wafer grown by MOCVD. A self-aligned process, in which the same photoresist pattern is used for both the waveguide etching and the insulation layer formation, is developed and is found to be very useful, Fabry-Perot interference technique is applied to the measurement and the phase modulation efficiency is measured to be 22.5$^{\circ}$/Vmm at 1.31 ${\mu}{\textrm}{m}$ for TE polarization.

• Korean Journal of Materials Research
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• v.9 no.3
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• pp.295-300
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• 1999

액상의 Ga으로부터 공급되느 기체상태의 Ga과 $NH _3$를 $1050~1150^{\circ}C$의 온도범위에서 직접 반응시켜 사파이어 기판위에 직경이 5~27$\mu\textrm{m}$이고, 높이가 $2~27\mu\textrm{m}$인 육각기둥 형태의 GaN 결정을 성장하였다. GaN 결정의 성장 초기에는 c-축 방향으로 우선 성장된 후 성장시간과 성장온도 및 $NH_3$의 유량이 증가함에 따라 기체상태의 Ga공급이 제한됨으로써 성장률이 둔화됨과 동시에 $\alpha$-축 방향으로 우선 성장되었다. GaN 결정의 크기가 증가함에 따라 결정의 품질이 개선되어 X-선 회절강도와 중성도너에 구속된 엑시톤 관력 발광밴드 (I\ulcorner)의 강도가 증가하고, I\ulcorner 발광밴드의 반치폭이 감소하였다.

• YAKHAK HOEJI
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• v.59 no.4
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• pp.164-169
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• 2015

In the present study, we determined the effect of $18{\beta}$-glycyrrhetinic acid ($18{\beta}$-GA) in the mice model bearing xenografts of HT-29 human colon cancer cell line. Data from the cytotoxicity assay displayed that $18{\beta}$-GA induced cell death in HT-29. The cytotoxicity was enhanced as the $18{\beta}$-GA treatment was prolonged. In case of 72 hrs treatment, $LD_{50}$ of $18{\beta}$-GA was approximately $90{\mu}M$, and the efficacy at $100{\mu}M$ of $18{\beta}$-GA appeared to be equivalent to that of doxorubicin at $1{\mu}M$. Based on the in vitro data, we tested the anti-tumor effect of $18{\beta}$-GA in thymic mice (Balb/c strain). Xenograft tumors were generated by subcutaneous injection of HT-29 ($3{\times}10^6cells/mouse$) to mice and the mice were treated intraperitoneally with $18{\beta}$-GA ($50{\mu}g/time/mouse$) every other day for 4 times. The tumor volumes were measured for a period of 14 days. Data displayed that the $18{\beta}$-GA treatment reduced the tumor volumes (P < 0.05) as compared to control mice. However, this activity was demolished when athymic mice (Balb/c nu/nu) were used instead of thymic mice. This observation appeared that T lymphocyte played an important role in the anti-tumor activity. In conclusion, our results indicate that $18{\beta}$-GA has anti-tumor activity in HT-29 tumor-bearing mice, which may be associated with T cells.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.159-159
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• 2010

펄스 직류 전원 $BCl_3$/He 플라즈마를 사용하여 GaAs의 건식 식각을 연구하였다. 공정 변수는 가스 유량 (0~100% $BCl_3$ in $BCl_3$/He), 펄스 파워 ($450{\sim}600\;{\nu}$), 펄스 주파수 (100~250 KHz), 펄스 시간 ($0.4{\sim}1.2\;{\mu}s$)이었다. 식각 공정 후 식각률, 포토레지스트에 대한 식각 선택도, 표면 거칠기는 표면 단차 측정기를 이용하였다. 식각 공정 동안 플라즈마 광 특성 분석은 광학 발광분석기 (Optical emission spectroscopy)를 사용하였다. 실험 후 주사 전자 현미경을 이용, 식각 후 시료의 단면과 표면을 관찰하였다. 실험 결과에 의하면 1) 펄스 파워, 주파수, 시간을 고정 ($500\;{\nu}$, $0.7\;{\mu}s$, 200 KHz)하고 10% He 가스가 혼합되어 있는 조건에서 GaAs의 식각률이 순수한 $BCl_3$를 사용한 것보다 높았다. 이를 통해 식각 공정에서 일정량 이하의 He 혼합은 GaAs 식각률을 증가시키는 시너지효과가 있음을 알 수 있었다. 2) 그러나 약 20% 이상의 He 가스의 혼합은 GaAs의 식각 속도를 저하시켰다. 3) 10% He (9 sccm $BCl_3/1$ sccm He), 200 KHz 펄스 주파수, $0.7\;{\mu}s$ 펄스 시간의 조건에서 펄스 파워가 증가함에 따라 GaAs의 식각률 또한 선형적으로 증가하였다. 4) 특히, $600\;{\nu}$의 파워에서 식각률은 ${\sim}0.5\;{\mu}m/min$로 가장 높았다. 5) 표면 단차 측정기와 전자현미경을 이용하여 식각한 GaAs를 분석한 결과 10% He이 혼합되어 있는 조건에서는 우수한 수직 측벽과 매끈한 표면 (RMS roughness <1 nm)을 관찰할 수 있었다. 6) 10% He이 혼합된 $BCl_3$/He 펄스 직류 플라즈마 식각 후 XPS 분석결과에서도 기준 샘플과 비교하였을 때, 공정 후의 GaAs 표면이 화학적으로 깨끗하며 잔류물이 거의 검출되지 않았다. 위의 결과를 정리하였을 때, 펄스 직류 $BCl_3$/He 플라즈마는 GaAs의 식각에서 매우 우수한 공정 결과를 나타내었다.

• Journal of the Korean Vacuum Society
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• v.18 no.4
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• pp.288-295
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• 2009

We report the etch characteristics of GaAs and AlGaAs in the diffusion pump-based capacitively coupled $BCl_3$ plasma. Process variables were chamber pressure ($50{\sim}180$ mTorr), CCP power ($50{\sim}200\;W$) and $BCl_3$ gas flow rate ($2.5{\sim}10$ sccm). Surface profilometry was used for etch rate and surface roughness measurement after etching. Scanning electron microscopy was used to analyze the etched sidewall and surface morphology. Optical emission spectroscopy was used in order to characterize the emission peaks of the $BCl_3$ plasma during etching. We have achieved $0.25{\mu}m$/min of GaAs etch rate with only 5 sccm $BCl_3$ flow rate when the chamber pressure was in the range of 50{\sim}130 mTorr. The etch rates of AlGaAs were a little lower than those of GaAs at the conditions. However, the etch rates of GaAs and AlGaAs decreased significantly when the chamber pressure increased to 180 mTorr. GaAs and AlGaAs were not etched with 50 W CCP power. With $100{\sim}200\;W$ CCP power, etch rates of the materials increased over $0.3{\mu}m$/min. It was found that the etch rates of GaAs and AlGaAs were not always proportional to the increase of CCP power. We also found the interesting result that AlGaAs did not etched at 2.5 sccm $BCl_3$ flow rate at 75 mTorr and 100 W CCP power even though it was etched fast like GaAs with more $BCl_3$ gas flow rates. By contrast, GaAs was etched at ${{\sim}}0.3{\mu}m$/min at the 2.5 sccm $BCl_3$ flow rate condition. A broad molecular peak was noticed in the range of $500{\sim}700\;mm$ wavelength during the $BCl_3$ plasma etching. SEM photos showed that 10 sccm $BCl_3$ plama produced more undercutting on GaAs sidewall than 5 sccm $BCl_3$ plasma.