• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.306-306
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• 2013

p-type Si(100)기판위에 Al2O3 박막을 증착하고 Si/SiO2 박막을 연속 증착하여 태양전지를 제작하였다. Si/SiO2 박막을 연속으로 증착하면 양자 구속이 일어나고 이로 인한 유효밴드 갭이 증가하게 되고, tunnel effect와 계면에서의 passivation 효과를 기대할 수 있다. 이런 효과들을 이용하여 고효율 태양전지를 기대 할 수 있다. 본 연구에서는 Remote Plasma Atomic Layer Deposition(RPALD)를 이용하여 Al2O3를 증착하였고 RF-Magnetron Sputter와 e-beam Evaporator 장비를 이용하여 Si/SiO2을 증착하였다. 전극으로는 Ti/Ag와 Al을 이용하였다. Solar simulator 장비를 이용하여 cell의 전기적 특성 평가를 평가하였고(Fig. 1) QE 측정장비를 통해 파장대의 따른 광학적 측정을 하였다(Fig. 2). ellipsometer 장비와 ${\alpha}$-step 장비로 박막과 전극의 두께를 측정하였고 4-point prove 장비를 이용하여 면저항, 저항율을 측정 평가하였다. 또한 I-V, C-V 측정 결과 터널링 현상이 일어나는 것을 확인 하였으며, Si/SiO2 다중 박막을 연속 증착 할수록 cell 효율이 더 좋게 나온다는 것을 확인하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.266-267
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• 2011

질화갈륨(GaN)은 높은 전자이동도 및 높은 항복전계를 가지며 낮은 온저항으로 인하여 에너지효율이 우수하기 때문에 고출력 전력소자 분야에서 많은 관심을 받고 있다. GaN을 이용한 고출력 전력소자의 경우 상용화 수준에 근접할 만한 기술적 진보가 있었으나, 페르미 레벨 고정(Fermi-level pinning) 현상, 소자의 누설전류 등 아직 해결되어야 할 문제를 갖고 있다. 본 연구에서는 실리콘 기판 위에 성장된 GaN 에피탁시를 활용한 고출력 전력소자의 누설전류를 억제시키기 위해 오믹 접합 중 Au의 상호확산을 억제하는 중간층 금속(Mo or Ni)을 변화시켰으며 오믹 열처리 온도에 따른 특성을 비교 연구하였다. $Cl_2$와 $BCl_3$를 이용하여 0.6 ${\mu}m$ 깊이의 메사 구조가 활성영역을 형성하였고, Si 도핑된 n-GaN 위에 Ti/Al/Mo/Au (20/100/25/200 nm) 와 Ti/Al/Ni/Au (20/100/25/200 nm) 오믹 접합을 각각 설계, 제작하였다. 오믹 열처리시의 GaN 표면오염을 방지하기 위해 $SiO_2$ 희생층을 증착하였다. 오믹 접합 형성을 위해 각 750$^{\circ}C$, 800$^{\circ}C$, 850$^{\circ}C$에서 30초간 열처리를 진행 하였으며, 이후 6 : 1 BOE 용액으로 $SiO_2$ 희생층을 제거하였다. 750, 800, 850$^{\circ}C$에서 Ti/Al/Mo/Au 구조의 오믹 접합 저항은 각 2.56, 2.34, 2.22 ${\Omega}$-mm 이었으며, Ti/Al/Ni/Au 구조의 오믹 접합 저항은 각 43.72, 2.64, 1.86 ${\Omega}$-mm이었다. Isolation 누설전류를 측정하기 위해서 두 개의 오믹 접합 사이에 메사 구조가 있는 테스트 구조를 제안하였다. Isolation 누설전류는 Ti/Al/Mo/Au 구조에서 두 오믹 접합 사이의 거리가 25 ${\mu}m$이고 100 V일 때 750, 800, 850 $^{\circ}C$의 열처리 온도에서 각 1.25 nA/${\mu}m$, 2.48 nA/${\mu}m$, 8.76 nA/${\mu}m$이었으며, Ti/Al/Ni/Au 구조에서는 각 1.58 nA/${\mu}m$, 2.13 nA/${\mu}m$, 96.36 nA/${\mu}m$이었다. 열처리 온도가 증가하며 오믹 접합 저항은 감소하였으나 isolation 누설전류는 증가하였다. 750$^{\circ}C$ 열처리에서 오믹 접합 저항은Ti/Al/Mo/Au 구조가 Ti/Al/Ni/Au 구조보다 약 17배 우수하였고, 850$^{\circ}C$ 고온의 열처리 경우 Ti/Al/Mo/Au 구조의 isolation 누설전류는 8.76 nA/${\mu}m$로 Ti/Al/Ni/Au의 누설전류 96.36 nA/${\mu}m$보다 약 11배 우수하였다. Ti/Al/Mo/Au가 Ti/Al/Ni/Au 보다 오믹 접합 저항과 isolation 누설전류 측면에서 전력용 GaN 소자에 적합함을 확인하였다.

• Proceedings of the Membrane Society of Korea Conference
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• 1994.04a
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• pp.58-58
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• 1994

슬립캐스팅법으로 제조한 튜브형 $\alpha$-알루미나 담체 (평균기공크기 = $0.1 \mum$)에 졸-겔 침지코팅(dipcoating) 또는 가압코팅 (pressurized coating) 법에 의하여 극미세입자 $\gamma$-AlOOH, $TiO_2, SiO_2$, 및 aluminosilicate diphasic 졸을 코팅한 후 300 ~ 500$\circ$C 에서 열처리하여 세라믹 복합막을 제조하였다. 복합막 전체에 대한 균열유무는 $N_2$ 기체투과율의 평균압력에 대한 의존성으로부터 평가하였으며, 한외여과 (ultrafiltration)에의 응용성을 규명하기 위하여 막의 재질 및 제조조건에 따른 polyethylene glycol (PEG) 수용액의 분획분자량 변화를 측정하였다. 합성 세라믹 복합막의 분획분자량 측정 결과 $SiO_2$의 경우 2,000 정도로 매우 우수하였으며 $\gamma-Al_2O_3, TiO_2$, 그리고 aluminosilcate 막들은 6,000 ~ 10,000 범위 값을 갖고 있었다. 또한 막의 기공크기 및 분획분자량을 제어하기 위한 방법으로서 $TiO_2$ 복합막을 300 ~ 700$\circ$C 에서 열처리하였으며 이들에 대한 분획분자량 변화를 비교 분석하였다.

• Korean Journal of Materials Research
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• v.5 no.2
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• pp.169-177
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• 1995

The diffusion barrier property of 100-nm-thick titanium nitride (TiN) film between Cu and Si was investigated using sheet resistance measurements, etch-pit observation, x-ray diffractometry, Auger electron spectroscopy, and transmission electron microscopy. The TiN barrier fails due to the formation of crystalline defects (dislocations) and precipitates (presumably Cu-silicides) in the Si substrate which result from the predominant in-diffusion of Cu through the TiN layer. In contrast with the case of Al, it is identified that the TiN barrier fails only the in-diffusion of Cu because there is no indication of Si pits in the Si substrate. In addition, it appears that the stuffing of TiN does not improve the diffusion barrier property in the Cu/TiN/Si structure. This indicates that in the case of Al, the chemical effect that impedes the diffusion of Al by the reaction of Al with $TiO_{2}$ which is present in the grain boundaries of TIN is very improtant. On the while, in the case of Cu, there is no chemical effect because Cu oxides, such as $Cu_{2}O$ or CuO, is thermodynamically unstable in comparison with $TiO_{2}$. For this reason, it is considered that the effect of stuffing of TiN on the diffusion barrier property is not significant in the Cu/ TiN/Si structure.

• Journal of Korean Ophthalmic Optics Society
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• v.11 no.2
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• pp.85-89
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• 2006

To research of the improved mechanical properties of materials for spectacle lens cutting, SiC and TiC were used as the main powder. Also, $Al_2O_3$ and $Y_2O_3$ was included as a sintering additive. The weight ratio of the alumina($Al_2O_3$) to yttria($Y_2O_3$) was set to 1:1. The materials for spectacle lens cutting were fabricated by hot-pressing at $1810^{\circ}C$ for 1h and subsequently annealed at $1860^{\circ}C$ for 3, 6 and 12h to initiated grain growth. The longer annealing time is, the bigger the grain size is. The microstructures were observed by scanning electron microscopy (SEM). The SEM images were quantitatively analyzed by image analysis (Image-Pro Plus, Media Cybernetics, Maryland, U.S.A.). Crack deflection by elongated SiC grains was most frequently observed as the dominant toughening mechanism. Crack deflection was generally observed for elongated SiC grains with aspect ratio(AR) > 2.5 and grain thickness < $2.3{\mu}m$. Crack bridging was also observed as one of the operating toughness mechanism.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.263-266
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• 2001

In this paper, we investigated dielectric properies for BST thin films that was deposited on MgO/Si substrates using RF magnetron sputtering. In here, MgO film was used to perform that a diffusion b arrier between the BST film and Si substrate and a buffer layer to assist the BST film growth. A d eposition condition for MgO films was RF Power of 50W, substrate temperature of room temperature and the working gas ratio of Ar:O$_2$ were varied from 90:10 to 60:47. Finally we manufactured the cap acitor of Al/BST/MgO/Si/Al structure to know electrical properties of this capacitor through I-V, C-V measurement. In the results, C-V aha racteristic curves was shown a ferroelectric property so we measured P-E. A remanent poliazation and coerceive electric field was present 2$\mu$C/cm$^2$ and -27kV/cm respectively at Ar:O$_2$=90:10. And a va clue of dielectric constant was 86 at Ar:02=90:10.

• Korean Journal of Materials Research
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• v.9 no.3
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• pp.315-321
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• 1999

Metal matrix composites have been extensively studied because of their excellent characteristics for structural application. $Al_2O_3$ and SiC have been used as a common reinforcement owing to their good mechanical properties. However the manufacturing cost of these ceramic reinforcement is expensive, so the use of the composites has been restricted to special purposes. In this study, we tested the application possibility as a reinforcement of $Al_2O_3$-TiC powder synthesized by SHS(Self-propagating High-temperature Synthesis) process to Al alloy matrix composite. Also, $Al_2O_3$ short fibers were added with the synthesized powders in order to apply to the Al matrix hybrid composites. Squeeze infiltration casting process was used to make the composite with 25vol% of reinforcement. Microstructure and crystal structure were examined by SEM, OM and XRD, also the mechanical properties were studied by the compressive test and wear test.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.11 no.1
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• pp.38-42
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• 2001

Electric and dielectric(Ba,Sr)$TiO_3$[BST] thin films for emtal-Insulator-Semiconductor(MIS) capacitors have been studied. BST thin films wre deposted on p-Si(100) substrates bythe RF magnetron sputtering with tempratue range of 500~$600^{\circ}C$. The dielectric properties of MIS capacitors consisting of Al/BST/$SiO_2$/Si sandwich structure were evaluated ot redcue the leakage current density. The charge state densities of the MIS capacitors were determined by high frequency (1 MHz) C-V measurement. In order to reduce the leakage current in MIS capacitor, high quality $SiO_2$ layer was deposited on bare p-Si substrate. Depending on the oxygen pressure and substrate temperature both positive and negative polarities of effective oxide charge in the MIS capacitors were evaluated. It is considered that the density of electronic states, generated at the BST/$SiO_2$/p-Si interface due to the asymmetric structure within BST/$SiO_2$/Si structure, and the oxygen vacancy content has influence on the behavior of oxide charge.

• Journal of Powder Materials
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• v.10 no.1
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• pp.15-20
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• 2003

Hybrid $A1_2O_3-TiC$ ceramic particle reinforced 6061 and 5083 Al composite powders were prepared by the combination of twin rolling and stone mill crushing process, followed by consolidating processes of cold compaction, degassing and hot extrusion. The composite bar consists of lamellar structure of ceramic particle rich area and matrix area, in which the hybrid was decomposed into each TiC of about $3-4\mutextrm{m}$ and $AI_2O_3$ particles of about $1-2\mutextrm{m}$ in diameter. It also found that fine $Mg_2Si$ precipitates of about 30 nm were embedded in the matrix, which have grains of about 3 $\mutextrm{m}$. Higher UTS was measured at the 5083 composite bar compared to the conventionally fabricated composite, due to again refinement effect by the rapid solidification. No particle was shown to form in the interface between the matrix and reinforcement, whereas carbon was diffused into the matrix.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.139-142
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• 2002

Characteristics of piezoelectric thick films prepared by screen printing were investigated. The piezoelectric thick films were fabricated using Pb(Al,Nb)O$_3$-Pb(Zr,Ti)O$_3$ system on Si-substrate. The fabricated thick films were burned out at 400$^{\circ}C$ and sintered at 850∼1000$^{\circ}C$ using rapid thermal annealing(RTA) precess. The thickness of piezoelectric thick films were 10$\mu\textrm{m}$. PAN-PZT thick film on Ag-Pd/SiO$_2$/Si prepared at 900$^{\circ}C$/1300sec had remanent polarization of 19.70 ${\mu}$C/$\textrm{cm}^2$.