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  • ahn, hyo-sok(2)
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  • 2010(46)
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  • journal of the microelectronics and packaging society(46)
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[Search Query: (Publication Year:2010)AND(Kojic:MOKRBW)]

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No Article Title /Author/Journal Title/Publication Year Cited
Thermoelectric Properties of the n-type $Bi_2(Te,Se)_3$ Processed by Hot Pressing/
[Park, D.H.;Roh, M.R.;Kim, M.Y.;Oh, T.S.;] / Journal of the Microelectronics and Packaging Society / 2010     		2
The Post Annealing Effect of Organic Thin Film Solar Cells with P3HT:PCBM Active Layer/
[Jang, Seong-Kyu;Gong, Su-Cheol;Chang, Ho-Jung;] / Journal of the Microelectronics and Packaging Society / 2010     		2
Trends on Technology of Eco-friendly Metal and Ceramic Nanoparticle Inks for Direct Printing/
[Hong, Sung-Jei;Kim, Jong-Woong;Han, Chul-Jong;Kim, Young-Sung;Hong, Tae-Whan;] / Journal of the Microelectronics and Packaging Society / 2010     		3
Effects of Heat Treatment on the Microstructure and Whisker Growth Propensity of Matte Tin Finish/
[Kim, K.S.;] / Journal of the Microelectronics and Packaging Society / 2010     		2
Development of Wafer Bond Integrity Inspection System Based on Laser Transmittance/
[Jang, Dong-Young;Ahn, Hyo-Sok;Mehdi, Sajadieh.S.M.;Lim, Young-Hwan;Hong, Seok-Kee;] / Journal of the Microelectronics and Packaging Society / 2010     		4
Mechanical Characteristic Evaluation of Sn-Ag-Cu Lead Free Solder Ball Joint on The Pad Geometry/
[Jang, Im-Nam;Park, Jai-Hyun;Ahn, Yong-Sik;] / Journal of the Microelectronics and Packaging Society / 2010     		4
Temperature Measurement and Contact Resistance of Au Stud Bump Bonding and Ag Paste Bonding with Thermal Heater Device/
[Kim, Deuk-Han;Yoo, Se-Hoon;Lee, Chang-Woo;Lee, Taek-Yeong;] / Journal of the Microelectronics and Packaging Society / 2010     		1
Elastoplastic Behavior and Creep Analysis of Solder in a FC-PBGA Package/
[Choi, Nam-Jin;Lee, Bong-Hee;Joo, Jin-Won;] / Journal of the Microelectronics and Packaging Society / 2010     		3
Dielectric Properties of $Ta_2O_5-SiO_2$ Thin Films Deposited at Room Temperature by Continuous Composition Spread/
[Kim, Yun-Hoe;Jung, Keun;Yoon, Seok-Jin;Song, Jong-Han;Park, Kyung-Bong;Choi, Ji-Won;] / Journal of the Microelectronics and Packaging Society / 2010     		4
A Method for Reducing the Number of Metal Layers for Embedded LSI Package/
[Ohshima, Daisuke;Mori, Kentaro;Nakashima, Yoshiki;Kikuchi, Katsumi;Yamamichi, Shintaro;] / Journal of the Microelectronics and Packaging Society / 2010     		0