The objective of this study is to develop a highly accurate micro tool alignment system applicable to the micro machining technology. In a specific application such as micro hole punching, radial clearance between micro tools is order of a few micron. Under this micron scale tool clearance, accuracy of tool alignment is very important for ensuring hole quality. In the present study, a two-way image acquisition system was developed, which can produce overlapped image of both micro tools that face each other, and applied to the tool alignment in the micro punching. Also, to meet alignment accuracy of tools within $1\mu\textrm{m}$, the cross correlation image processing algorithm was employed. With this system, $25\mu\textrm{m}$ punching tools with $1\mu\textrm{m}$ radial clearance could be accurately aligned.

The waveguide Bragg gratings have been fabricated by the phase-mask method. An excimer laser with maximum 600mJ output pulse energy and uniform phase masks have been used. Hydrogen loading is often used for enhancing the uv photosensitivity of the core, however, the resultant gratings show significant aging effect. In the present study, high temperature thermal annealing process has been investigated to obtain thermal gratings and process parameters are deduced.

Recently, one of remarkable tends in the development of optical communication industry is the miniaturization and integration of products. The alignment system of micro optical module is a key apparatus for the miniaturization of optical module and the development of optical communication parts with high functionality. In this research, we have developed a system capable of automatic alignment of a $30\mu\textrm{m}$-thick film filter and a lensed fiber in order to improve the speed and losses in the optical fiber-to-filter alignment of optical modules. Using the developed automatic alignment system and silicon optical bench, we have measured optical loss and characteristics of the assembled optical add/drop module before packaging $1{\times}1$ OADM optical module. Whole size of add/drop module was less than $5mm{\times}5mm{\times}1mm$. The measured maximum insertion loss was 0.294㏈ that is below 0.3㏈ which is a standard loss of optical module.

In this study, we have developed a new UV$({\lambda}=355nm)$ laser micromachining technology by direct ablation method without masks. This technology allows that 3D micro parts can be fabricated rapidly and efficiently with a low price. And it has a benefit of reducing fabricating process simply. Due to micro parts' fabrication, such technologies need the control of XYZ stages with high precision, the design of optical devices to maintain micron spot sizes of laser beam and the control technology of laser focus. The developed laser manufacturing process for laser micromachining is that, after extracting coordinates of shape data from CAD model data, a beam path considering manufacturing features of laser beam is created by using genetic algorithm. This generated manufacturing process is sent to stage controller. In order to improve the surface quality of micro parts, we have carried out experiments on iteration manufacturing and beam step-over by using a minimum focus size. Moreover, we have fabricated a micro-channel through the developed laser micromachining technology and verified it through the results.

Chemical Mechanical Polishing(CMP) process becomes one of the most important semiconductor processes. But the basic mechanism of CMP still does not established. Slurry fluid dynamics that there is a slurry film between a wafer and a pad and contact mechanics that a wafer and a pad contact directly are the two main studies for CMP. This paper based on the latter one, especially on the abrasion wear model. Material Removal Rate(MRR) is calculated using the trajectory length of every point on a wafer during the process time. Both the rotational velocity of a wafer and a pad and the wafer oscillation velocity which has omitted in other studies are considered. For the purpose of the verification of our simulation, we used the experimental results of S.H.Li et al. The simulation results show that the tendency of the calculated MRR using the relative velocity is very similar to the experimental results and that the oscillation effect on MRR at a real CMP condition is lower than 1.5%, which is higher than the relative velocity effect of wafer, and that the velocity factor. not the velocity itself, should be taken into consideration in the CMP wear model.

A new design based on the appropriate geometry of molded part and type of runner system under the optimal processing conditions was proposed to minimize the micro weld lines on the sub deco surface molded by two shot molding. Theoretical and experimental studies were conducted to examine the cause of the weld lines during the overmolding process in two shot molding. Various dimensions and geometries of substrate$(1^{st}shot)$ and the wall thickness of overmold$(2^{nd}shot)$ have been proposed to avoid the weld lines which are the most inevitable appearance defects occurred on the sub deco. The each design proposal was analyzed by mold flow analysis after part modeling. The analysis results were compared with molded part from mass production tool. It could be seen that from the analysis that the proper geometry of plastic part and type of runner system considering pressure drop under the optimal processing conditions were the most influential factors to avoid weld lines occured on the sub deco.

UV-molded microlens arrays with high replication quality were fabricated using a parametric design method. It is important to maximize the replication quality, because one can obtain the replicated micro-optical components with desired properties by accurate control of the shape. In the present study, nickel mold inserts for microlens arrays with lenses having diameters between $3\mu\textrm{m}$ and $230\mu\textrm{m}$ were fabricated by electroforming process. An UV-molding system was designed and constructed, a simple technique to avoid micro-air bubbles was first suggested, and the effects of the compression pressure and UV-curing dose on the replication quality of UV-molded microlens arrays with a diameter of $14\mu\textrm{m}$ were examined experimentally. Finally, geometrical and optical properties of the replicated microlens arrays were measured and analyzed.

Literature review on reliability test method for developing high performance optical/thermofluidic components. Since the miniaturization by the conventional mechanical process is limited to milli-structure, i.e. $10^{-3}m$, new technology for fabricating of mechanical components is needed to match cost, reliability, and integrability criteria of micro-structure. Although numbers of various researches on MEMS/MOEMS devices and components, including material characterization, design and optimization, system validation, etc., the lack of standards and specifications make the researches and developments difficult. For that reason, this paper is intended to propose the methods of reliability test for measuring the mechanical property of optical/ thermofluidic components.

The mechanical properties of polycrystalline thin-films, critical for Micro-Electro-Mechanical Systems (MEMS) components, are known to have the size effect and the scatter in the length scale of microns by the numbers of intensive investigation by experiments and simulations. So, the consideration of the microstructure is essential to cover these length scale effects. The lattice based stochastic model for the microstructure evolution is used to simulate the actual microstructure, and the fast and reliable algorithm is described in this paper. The kinetics parameters, which are the key parameters for the microstructure evolution based on the nucleation and growth mechanism, are extracted from the given micrograph of a polycrystalline material by an inverse method. And the method is verified by the comparison of the quantitative measures, the number of grains and the grain size distribution, for the actual and simulated microstructures. Finite element mesh is then generated on this lattice based microstructure by the developed code. And the statistical finite element analysis is accomplished for selected microstructure.

The machining technology for the brittle materials such as ceramics are applied to the fields of MEMS(micro electromechanical system) by the progress of new machining technologies such as Etching, Diamond machining, Micro drilling, EDM(Electro discharge machining), ECDM(Electro discharge machining), USM(Ultrasonic machining), LBM(Laser beam machining), EBM(Electron beam machining). Especially, the USM technology can be applied to the dieletric brittle materials such as silicon, borosilicate glass, silicon nitride, quartz and ceramics with high aspect ratio. The micro machining system with machining force controlled position servo is developed in this paper and the optimized ultrasonic machining algorithm is constructed by the force controlled position servo control. The load cell is adapted in the force measuring and the servo control algorithm, suit for the ultrasonic machining characteristics, is estabilished with using the PID auto-tunning functions at the PMAC system which is generally adapted in the field of robot industries. The precision force signal amplifier is constructed with high precision operational amplifier AD524. The vacuum adsorption chuck which is made of titanum and internal flow line is engraved, is used in the workpiece fixing. The mahining results by USM shows that there are some deviation between the force command and the actual machining force that the servo control algorithm should be applied in the machining procedures. Therefore, the constant force controlled position servo system is developed for the micro USM system and by the examination machining process in USM, the stable USM system is realized by tracking the average value of machining force.

Ultrasonic machining has been known as one of the conventional machining methods in the glass fabrication processes. In ultrasonic machining, typically, glass is removed by the impulse energy of the abrasive generated by the ultrasonic power. However, when the machining feature decrease under hundreds of micrometers, as conventional ultrasonic machining uses only the impulse energy of the abrasive, the speed of ultrasonic machining decreases significantly and the surface roughness becomes deteriorated. To overcome this size effect, the chemicals which can erode glasses, such as HF, XF, etc, are added to the slurry. The chemical-assisted ultrasonic machining method, so called, is another alternating effective way for micro machining of glasses. In previous work, we used the hydrofluoric acid (HF) as an additive chemical. But, as the HF solution is too poisonous to be used as a ultrasonic process additive, it is needed to be substituted by other safe chemicals. As results of the machinability comparison of several chemicals, the GST-500F was selected to replace the HF. The GST-500F (pH $4.0{\pm}1.0$) is non-volatile, odorless. During experimental works, it was shown that the machining rate increases 1.5 times faster than the conventional ultrasonic machining. The machining load also decreases. However, the enlargement of the hole diameter and significant tool wear are still the problems to be solved.

Transparent materials such as fused silica are widely utilized in optical and optoelectronics field because of its outstanding properties, such as transparency in a wide wavelength range, strong damage resistance for laser irradiation, and high thermal and chemical stability. In this study, we made a few micro patterns on the surface of fused silica plate using laser induced wet etching. KrF excimer laser was used as a light source. There were no burrs and micro cracks on the etched surface of fused silica and the flatness of the etched surface was fairly good. We investigated the influence of etchant upon the etch rate and quality in laser induced wet etching. Pyrene-acetone solution and toluene were used as etchant. In the side of etch rate, toluene solution was better than pyrene-acetone solution. But we made in wider range of energy density using pyrene-acetone solution. But pyrene-acetone solution gave us wider window of energy density for successful micro patterning.

This paper subscribes the measurement system that can position the target to measure by moving 2-axis stage, which is controlled by the data from image processing technique. The high resolution camera and lens are used in measurement of micro mechanical part, but the region of measurement is very small. It is necessary the re-positioning to measure several regions in one part. The system described in this paper has the accuracy with about $0.9\mu\textrm{m}$ resolution per one pixel and can be applied to measure micro mechanical part.

Electroforming is the highly specialized use of electrodeposition for the manufacture of metal parts and basically a specialized form of electroplating. So, we can apply electrochemical system analysis for electroforming process. Electrochemical systems are concerned with the interplay between electricity and chemistry, namely the measurements of electrical quantities, such as current density, potential, and charge, and their relationship to chemical parameters. This paper based on the basic equations of electrics and electrochemical kinetics, was employed for a theoretical explanation of the current density distribution on electroforming process. We calculated current density distribution and potential distribution on cathode. Also, calculated current density distribution of vertical direction. It was shown that current density is related with distance of between anode and cathode and mass transfer process.

Micro tensile test specimens of thin film single crystal silicon for the most useful structural materials in MEMS (Micro Electro Mechanical System) devices were fabricated using SOI (Silicon-on-Insulator) wafers and MEMS processes. Dimensions of micro tensile test specimens were thickness of $7\mu\textrm{m}$, width of 50~$350\mu\textrm{m}$, and length of 2mm. Top and bottom silicon were etched using by deep RIE (Reactive Ion Etching). Thin film aluminum markers on testing region of specimens with width of $5\mu\textrm{m}$, lengths of 30~$180\mu\textrm{m}$ and thickness of 200 nm for measuring tensile strain were fabricated by aluminum wet etching method. Fabricated side wall angles of aluminum marker were about $45^{\circ}~50^{\circ}$. He-Ne laser with wavelength of 633nm was used for checking fringed patterns.

Mircolens and microlens V-groove are realized using a novel fabrication technology based on the exposure of a resist, usually PMMA, to deep X-rays and subsequent thermal treatment and inclined deep X-ray lithography, respectively. The fabrication technology is very simple and produces microlenses and microlens V-groove with good surface roughness of several nm. The molecular weight and glass transition temperature of PMMA is reduced when it is irradiated with deep X-rays. The microlenses were produced through the effects of volume change, surface tension, and reflow during thermal treatment of irradiated PMMA. Microlenses were produced with diameters ranging from 30 to $1500\mu\textrm{m}$. The surface X-ray mask is also fabricated to realize microlens arrays on PMMA sheet with a large area. The size of the micro V-groove is fabricated in the range of 12~$60\mu\textrm{m}$.