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A Comparative Study on the Influence of Etchant upon the Etching Rate and Quality in Laser Induced Wet Etching of Fused Silica

식각액에 따른 용융실리카의 레이저 습식 식각 특성 비교 연구

  • 이종호 (인덕대학 산업기술연구원) ;
  • 이종길 (한국산업기술대학교 기계공학) ;
  • 전병희 (인덕대학 컴퓨터응용기계계열)
  • Published : 2004.06.01

Abstract

Transparent materials such as fused silica are widely utilized in optical and optoelectronics field because of its outstanding properties, such as transparency in a wide wavelength range, strong damage resistance for laser irradiation, and high thermal and chemical stability. In this study, we made a few micro patterns on the surface of fused silica plate using laser induced wet etching. KrF excimer laser was used as a light source. There were no burrs and micro cracks on the etched surface of fused silica and the flatness of the etched surface was fairly good. We investigated the influence of etchant upon the etch rate and quality in laser induced wet etching. Pyrene-acetone solution and toluene were used as etchant. In the side of etch rate, toluene solution was better than pyrene-acetone solution. But we made in wider range of energy density using pyrene-acetone solution. But pyrene-acetone solution gave us wider window of energy density for successful micro patterning.

Keywords

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