The estimation of yield for semiconductor devices requires not only establishment of critical area but also a new parameter of process defect density that contains inspection mean defect density related cleanness of manufacure process line, minimum feature size and the total number of mask process. We estimate the repaired yield of memory devide, leads the semiconductor technique, repaired by redundancy scheme in relation with defect density distribution function, and we confirm the repaired yield for different devices as this model. This shows the possibility of the yield estimation as statistical analysis for the condition of device related cleanness of manufacture process line, design and manufacture process.