Korean Journal of Air-Conditioning and Refrigeration Engineering (설비공학논문집)

The Society of Air-Conditioning and Refrigerating Engineers of Korea (대한설비공학회)
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A Study of Diffusion Bonding Process for High Temperature and High Pressure Micro Channel Heat Exchanger Using Inconel 617

인코넬 617을 이용한 고온고압용 미세채널 열교환기의 확산접합 공정에 관한 연구

  • Song, Chan Ho (Department of Extreme Thermal Systems, Korea Institute of Machinery and Materials) ;
  • Yoon, Seok Ho (Department of Extreme Thermal Systems, Korea Institute of Machinery and Materials) ;
  • Choi, Joon Seok (Department of Extreme Thermal Systems, Korea Institute of Machinery and Materials)
  • 송찬호 (한국기계연구원 열공정극한기술연구실) ;
  • 윤석호 (한국기계연구원 열공정극한기술연구실) ;
  • 최준석 (한국기계연구원 열공정극한기술연구실)
  • Received : 2014.11.17
  • Accepted : 2014.12.09
  • Published : 2015.02.10
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Abstract

Recently, the heat exchangers are requiring higher performance and reliability since they are being used under the operating condition of high temperature and pressure. To satisfy these requirements, we need special materials and bonding technology. This study presents a manufacturing technology for high temperature and high pressure micro channel heat exchanger using Inconel 617. The bonding performance for diffusion bonded heat exchanger was examined and analyzed. The analysis were conducted by measuring thermal and mechanical properties such as thermal diffusivity and tensile strength, and parametric studies about bonding temperature and pressing force were also carried out. The results provided insight for bonding evaluation and the bonding condition of $1200^{\circ}C$, and 50 tons was found to be suitable for this heat exchanger. From the results, we were able to establish the base technology for the manufacturing of Inconel 617 heat exchanger through the application of the diffusion bonding.

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References

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