• Title/Summary/Keyword: 인쇄기판형 열교환기

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Evaluation of High-Temperature Structural Integrity Using Lab-Scale PCHE Prototype (SUS316L 로 제작된 실험실 수준 인쇄기판형 열교환기 시제품의 고온구조건전성 평가)

  • Song, Kee Nam;Hong, Sung Deok
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.37 no.9
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    • pp.1189-1194
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    • 2013
  • The Intermediate Heat Exchanger (IHX) of a Very High Temperature Reactor (VHTR) is a core component that transfers the high heat of $950^{\circ}C$ generated in the VHTR to a hydrogen production plant. The Korea Atomic Energy Research Institute manufactured a lab-scale prototype of a Printed Circuit Heat Exchanger (PCHE) as a candidate for an IHX. In this study, as a part of a high-temperature structural integrity evaluation of the lab-scale PCHE prototype made of SUS316L, we carried out high temperature structural analysis modeling and macroscopic thermal and elastic structural analysis for the lab-scale PCHE prototype under helium experimental loop (HELP) test conditions as a precedent study prior to the performance test in HELP.

Macroscopic High-Temperature Structural Analysis Model of Small-Scale PCHE Prototype (II) (소형 PCHE 시제품에 대한 거시적 고온 구조 해석 모델링 (II))

  • Song, Kee-Nam;Lee, Heong-Yeon;Hong, Sung-Deok;Park, Hong-Yoon
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.35 no.9
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    • pp.1137-1143
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    • 2011
  • The IHX (intermediate heat exchanger) of a VHTR (very high-temperature reactor) is a core component that transfers the high heat generated by the VHTR at $950^{\circ}C$ to a hydrogen production plant. Korea Atomic Energy Research Institute manufactured a small-scale prototype of a PCHE (printed circuit heat exchanger) that was being considered as a candidate for the IHX. In this study, as a part of high-temperature structural integrity evaluation of the small-scale PCHE prototype, we carried out high-temperature structural analysis modeling and macroscopic thermal and elastic structural analysis for the small-scale PCHE prototype under small-scale gas-loop test conditions. The modeling and analysis were performed as a precedent study prior to the performance test in the small-scale gas loop. The results obtained in this study will be compared with the test results for the small-scale PCHE. Moreover, these results will be used in the design of a medium-scale PCHE prototype.

Numerical Study on Heat Transfer Performance of PCHE With Supercritical CO2 as Working Fluid (초임계 이산화탄소를 작동유체로 하는 인쇄기판형 열교환기의 형상변수에 따른 전열성능 수치모사)

  • Jeon, Sang Woo;Ngo, Ich-long;Byon, Chan
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.40 no.11
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    • pp.737-744
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    • 2016
  • The printed circuit heat exchanger (PCHE) is regarded as a promising candidate for advanced heat exchangers for the next-generation supercritical $CO_2$ power generation owing to its high compactness and rigid structure. In this study, an innovative type of PCHE, in which the channel sizes for the heat source fluid and heat sink fluid are different, is considered for analysis. The thermal performance of the PCHE, with supercritical $CO_2$ as the working fluid, is numerically analyzed. The results have shown that the thermal performance of the PCHE decreases monotonically when the channel size of either the heat source channel or the heat sink channel, because of the decreased flow velocity. On the other hand, the thermal performance of the PCHE is found to be almost independent of the spacing between the channels. In addition, it was found that the channel cross sectional shape has little effect on the thermal performance when the hydraulic diameter of the channel remains constant.

Macroscopic High-Temperature Structural Analysis Model for a Small-Scale PCHE Prototype (I) (소형 PCHE 에 대한 거시적 고온 구조 해석 모델링 (I))

  • Song, Kee-Nam;Lee, Heong-Yeon;Kim, Chan-Soo;Hong, Sung-Duk;Park, Hong-Yoon
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.35 no.11
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    • pp.1499-1506
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    • 2011
  • The IHX (intermediate heat exchanger) is a key component of nuclear hydrogen systems for the production of massive amounts hydrogen. The IHX transfers the $950^{\circ}C$ heat generated by the VHTR (very high temperature reactor) to a hydrogen production plant. The Korea Atomic Energy Research Institute established a small-scale gas loop to test the performance of key VHTR components and manufactured a small-scale PCHE (printed circuit heat exchanger) prototype, which is being considered as a candidate for the IHX, for testing in the small-scale gas loop. In this study, as a part of the high-temperature structural integrity evaluation of the small-scale PCHE prototype, we carried out high-temperature structural analysis modeling and macroscopic thermal and structural analysis for the small-scale PCHE prototype under the small-scale gas loop test conditions. This analysis serves as a precedent study to scheduled PCHE performance test in the small-scale gas loop. The results obtained in this study will be compared with the test results for the small-scale PCHE and then used to design the medium-scale PCHE prototype.

Numerical Analysis on Longitudinal Heat Conduction in Printed Circuit Heat Exchanger (인쇄기판형 열교환기의 유동방향 전도열전달에 관한 수치해석 연구)

  • Oh, Dong-Wook;Kim, Young;Choi, Jun Seok;Yoon, Seok Ho
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.26 no.12
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    • pp.600-604
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    • 2014
  • Longitudinal heat conduction is known to be an important factor in the design of a printed circuit heat exchanger(PCHE) for cryogenic applications. Parasitic heat conduction through the heat exchanger frame needs to be considered because it is known to decrease the effectiveness of the heat exchanger. In this paper, a conjugate heat transfer problem in a simple counter-flow PCHE is analyzed by a computational fluid dynamics simulation. The effect of longitudinal conduction in a straight channel is compared with the theoretical effectiveness-NTU relationship that assumes a "thin" heat exchanger frame. The calculation results suggest that the theoretical model is valid in the present calculation conditions where NTU is < 13.

Experimental Study on the Thermal Performance of a Printed Circuit Heat Exchanger in a Cryogenic Environment (극저온 환경의 인쇄기판형 열교환기 열적성능에 대한 실험적 연구)

  • Kim, Dong Ho;Na, Sang Jun;Kim, Young;Choi, Jun Seok;Yoon, Seok Ho
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.27 no.8
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    • pp.426-431
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    • 2015
  • The advantages of a printed circuit heat exchanger (PCHE) are the compactness and efficiency derived from its heat-transfer characteristics; furthermore, a PCHE for which a diffusion bonding method was used during production can be applied to extreme environments such as a cryogenic condition. In this study, a micro-channel PCHE fabricated by diffusion bonding was investigated in a cryogenic environment regarding its thermal performance and the pressure drop. The test rig consists of an LN2 storage tank, vaporizers, heaters, and a cold box, whereby the vaporized cryogenic nitrogen flows in hot and cold streams. The overall heat-transfer coefficients were evaluated and compared with traditional correlations. Lastly, we suggested the modified heat-transfer correlations for a PCHE in a cryogenic condition.

Channel Structure and Header Design of Printed Circuit Heat Exchanger by Applying Internal Fluid Pressure (유체 내압을 고려한 인쇄기판형 열교환기의 채널구조 및 헤더 설계)

  • Kim, Jungchul;Shin, Jeong Heon;Kim, Dong Ho;Choi, Jun Seok;Yoon, Seok Ho
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.41 no.11
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    • pp.767-773
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    • 2017
  • Printed Circuit Heat Exchanger (PCHE) has an advantage for exchanging thermal energy between high-pressure and high-temperature fluids because its core is made by diffusion bonding method of accumulated metal thin-plates which are engraved of flow channel. Moreover, because it is possible that the flow channel can be micro-size hydraulic diameter, the heat transfer area per unit volume can be made larger than traditional heat exchanger. Therefore, PCHE can have higher efficiency of heat transfer. The smaller channel size can make the larger heat transfer area per unit volume. But if high pressure fluid flows inside the channel, the channel wall can be deformed, the structure and shape of flow channel and header have to be designed appropriately. In this study, the design methodology of PCHE channel in high pressure environment based on pressure vessel codes was investigated. And this methodology was validated by computational analysis.

Thermal Performance of a Printed Circuit Heat Exchanger considering Longitudinal Conduction and Channel Deformation (축방향 열전도와 유로 변형을 고려한 인쇄기판형 열교환기 열적 성능)

  • Park, Byung Ha;Sah, Injin;Kim, Eung-seon
    • Transactions of the Korean Society of Pressure Vessels and Piping
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    • v.14 no.1
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    • pp.8-14
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    • 2018
  • Printed circuit heat exchangers (PCHEs) are widely used with an increasing demand for industrial applications. PCHEs are capable of operating at high temperatures and pressure. We consider a PCHE as a candidate intermediate heat exchanger type for a high temperature gas-cooled reactor (HTGR). For conventional application using stainless steels, design and manufacturing of PCHEs are well established. For applications to HTGR, knowledge of longitudinal conduction and deformation of channel is required to estimate design margin. This paper analyzes the effects of longitudinal conduction and deformation of channel on thermal performance using a code internally developed for design and analysis of PCHEs. The code has a capability of two dimensional simulations. Longitudinal conduction is estimated using the code. In HTGR operating condition, about ten percent of design margin is required to compensate thermal performance. The cross-sectional images of PCHE channels are obtained using an optical microscope. The images are processed with computer image process technique. We quantify the deformation of channel with dimensional parameters. It is found that the deformation has negative effect on structural integrity. The deformation enhances thermal performance when the shape of channel is straight in laminar flow regime. It reduces thermal performance in cases of a zigzag channel and turbulent flow regime.

Structural Design for Key Dimensions of Printed Circuit Heat Exchanger (인쇄기판형열교환기 핵심치수 구조설계)

  • Kim, Yong Wan;Kang, Ji Ho;Sah, In Jin;Kim, Eung Seon
    • Transactions of the Korean Society of Pressure Vessels and Piping
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    • v.14 no.1
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    • pp.24-31
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    • 2018
  • The mechanical design procedure is studied for the PCHE(printed circuit heat exchanger) with electrochemical etched flow channels. The effective heat transfer plates of PCHE are assembled by diffusion bonding to make a module. PCHE is widely used for industrial applications due to its compactness, cost efficiency, and serviceability at high pressure and/or temperature conditions. The limitations and technical barriers of PCHE are investigated for application to nuclear components. Rules for design and fabrication of PCHE are specified in ASME Section VIII but not in ASME Section III of nuclear components. Therefore, the calculation procedure of key dimensions of PCHE is defined based on ASME section VIII. The effective heat transfer region of PCHE is defined by several key dimensions such as the flow channel radius, edge width, wall thickness, and ridge width. The mechanical design procedure of key dimensions was incorporated into a program for easy use in the PCHE design. The effect of assumptions used in the key dimension calculation on stress values is numerically investigated. A comparative analysis is done by comparing finite element analysis results for the semi-circular flow channels with the formula based sizing calculation assuming rectangular cross sections.

A Study of Diffusion Bonding Process for High Temperature and High Pressure Micro Channel Heat Exchanger Using Inconel 617 (인코넬 617을 이용한 고온고압용 미세채널 열교환기의 확산접합 공정에 관한 연구)

  • Song, Chan Ho;Yoon, Seok Ho;Choi, Joon Seok
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.27 no.2
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    • pp.87-93
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    • 2015
  • Recently, the heat exchangers are requiring higher performance and reliability since they are being used under the operating condition of high temperature and pressure. To satisfy these requirements, we need special materials and bonding technology. This study presents a manufacturing technology for high temperature and high pressure micro channel heat exchanger using Inconel 617. The bonding performance for diffusion bonded heat exchanger was examined and analyzed. The analysis were conducted by measuring thermal and mechanical properties such as thermal diffusivity and tensile strength, and parametric studies about bonding temperature and pressing force were also carried out. The results provided insight for bonding evaluation and the bonding condition of $1200^{\circ}C$, and 50 tons was found to be suitable for this heat exchanger. From the results, we were able to establish the base technology for the manufacturing of Inconel 617 heat exchanger through the application of the diffusion bonding.