Journal of the Korean Society of Manufacturing Process Engineers (한국기계가공학회지)

The Korean Society of Manufacturing Process Engineers (한국기계가공학회)
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A Study on the ELID Grinding Properties of Single Crystal Sapphire Wafer using Ultrasonic Table

초음파 테이블을 이용한 단결정 사파이어 웨이퍼의 ELID 연삭가공 특성 연구

  • Hwang, JinHa (Graduate School of Pusan National University, Dept. of Nano Fusion Technology) ;
  • Kwak, Tae-Soo (Gyeongnam National Univ. of Sci. and Tech., Dept. of Mechanical Engineering) ;
  • Lee, Deug-Woo (Pusan National Univ., Dept. of Nanomechatronics Engineering) ;
  • Jung, Myung-Won (Graduate School of Gyeongnam National Univ. of Sci. and Tech., Dept. of Mechanical Engineering) ;
  • Lee, Sang-Min (Graduate School of Pusan National University, Dept. of Nano Fusion Technology)
  • Published : 2013.08.30
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Abstract

Single crystal sapphire being used in high technology industry is a brittle material with a high hardness and excellent physical properties. ELID(Electrolytic In-Process Dressing) grinding technology was applied to material removal machining process of single crystal sapphire wafer. Ultrasonic vibration which added to material using ultrasonic table was adopted to efficient ELID grinding of sapphire materials. The evaluation of the ground surface of single crystal sapphire wafer was carried out by means of surface measuring by using AFM(Atomic Force Microscope), surface roughness tester and optical microscope device. As the results of experiment, it was shown that more efficient grinding was conducted when using ultrasonic table. In case of using #170 grinding wheel, surface roughness of ELID ground specimen in using ultrasonic table was superior to ELID ground specimen without ultrasonic table. However, In case of using #2000 grinding wheel, surface roughness of ELID ground specimen in using ultrasonic table was inferior to ELID ground specimen without ultrasonic table.

Keywords

References

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