참고문헌
- O. Kardos, "Current Distribution on Microprofiles Part III", Plating, 61(4), 316 (1974).
마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)
- 제19권4호
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- Pages.39-43
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- 2012
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
DOI QR Code
Development of the Latest High-performance Acid Copper Plating Additives for Via-Filling & PTH
- Nishiki, Shingo (OKUNO CHEMICAL INDUSTRIES CO., LTD.)
- 투고 : 2012.12.10
- 심사 : 2012.12.14
- 발행 : 2012.12.30
초록
Via-filling plating and through-hole plating are absolutely imperative for manufacturing of printed-wiring board. This Paper is introducing the latest developments of our company worked on the high-performance of acid copper plating additives for them.
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