한국가시화정보학회지 (Journal of the Korean Society of Visualization)

  • 제7권2호
  • /
  • Pages.17-21
  • /
  • 2010
  • /
  • 1598-8430(pISSN)
  • /
  • 2093-808X(eISSN)
한국가시화정보학회 (The Korean Society of Visualization)
권호 표지
DOI QR코드

DOI QR Code

온도장 가시화를 위한 연성회로기판을 이용한 온도센서 어레이 제작 및 성능평가

Fabrication and Performance Evaluation of Temperature Sensor Matrix Using a Flexible Printed Circuit Board for the Visualization of Temperature Field

  • Ahn, Cheol-Hee (School of Mechanical Engineering Pusan National University) ;
  • Kim, Hyung-Hoon (School of Mechanical Engineering Pusan National University) ;
  • Cha, Je-Myung (School of Mechanical Engineering Pusan National University) ;
  • Kwon, Bong-Hyun (School of Mechanical Engineering Pusan National University) ;
  • Ha, Man-Yeong (School of Mechanical Engineering Pusan National University) ;
  • Park, Sang-Hu (School of Mechanical Engineering Pusan National University) ;
  • Jeong, Ji-Hwan (School of Mechanical Engineering Pusan National University) ;
  • Kim, Kui-Soon (Department of Aerospace Engineering Pusan National University) ;
  • Cho, Jong-Rae (Division of Mechanical and Information Engineering Korea Maritime University) ;
  • Son, Chang-Min (Rolls-Royce International limited) ;
  • Lee, Jung-Ho (Korea Institute of Machinery and Materials) ;
  • Go, Jeung-Sang (School of Mechanical Engineering Pusan National University)
  • 발행 : 2010.01.08
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

This paper presents the fabrication and performance measurement of a temperature sensor array on a flexible substrate attachable to a curved surface using MEMS technology. Specifically, the fabrication uses the well-developed printed circuit board fabrication technology for complex electrode definition. The temperature sensor array are lifted off with a $10{\times}10$ matrix in a $50\;mm{\times}50\;mm$ to visualize temperature distribution. Copper is used as temperature sensing material to measure the change in resistances with temperature increase. In a thermal oven with temperature control, the temperature sensor array is Characterized. The constant slope of resistance change is obtained and temperature distribution is measured from the relationship between resistance and temperature.

키워드

참고문헌

  1. Frank P. Incropera, David P. DeWitt, 2001, "Introduction of the heat transfer 4th Edition," John Wiley & Sons Inc, pp.370-406
  2. Ogam technology, www.ogamtech.com
  3. S.Y. Xiao, L.F. Che, X.X. Li, Y.L. Wang, 2007, "A novel fabrication process of MEMS devices on polyimide flexible substrates," Microelectronic Engineering, Vol.85, pp. 452-457 https://doi.org/10.1016/j.mee.2007.08.004
  4. Fukang Jiang, Gwo-Bn Lee, Yu-Chong Tai, Chih-Ming Ho, 1999, "A flexible micromachine-based shear-stress sensor array and its application to separation-point detection," Sensors and Actuators, Vol.79, pp. 194-203
  5. Kui Liu, Wei-zheng Yuan, Jin-jun Deng, Bing-he Ma, Cheng-yu Jiang, 2007, "Detection of the boundary-layer separation point based on the flexible sensor arrays," Microsystem Technology, Vol.14, pp. 1-6 https://doi.org/10.1007/s00542-007-0392-3
  6. Bonnie T. Chia, Duo-Ru Chang, Hsin-Hung Liao, Yao-Joe Yang, Wen-Pin Shih, Fu-Yu Chang, Kuang-Chao Fan, 2007, "Temperature Sensor Array Using Flexible Substrate," IEEE 20th International Conference , pp.589-592
  7. Takao Someya, Tsuyoshi Sekitani, Shingo Iba, Yusaku Kato, Hiroshi Kawaguchi, Takayasu Sakurai, 2004, "A large-area, flexible pressure sensor matrix with organic field-effect transistors for artificial skin applications," Proceedings of National Academy of Sciences of the United States of America, Vol. 101, No. 27, pp.9966-9970 https://doi.org/10.1073/pnas.0401918101

피인용 문헌

  1. Low-Cost Wireless Temperature Measurement: Design, Manufacture, and Testing of a PCB-Based Wireless Passive Temperature Sensor vol.18, pp.2, 2018, https://doi.org/10.3390/s18020532