Journal of the Korean Society for Precision Engineering (한국정밀공학회지)

Korean Society for Precision Engineering (한국정밀공학회)
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Velocity Measurements of Slurry Flows in CMP Process by Particle Image Velocimetry

Particle Image Velocimetry 기법을 이용한 CMP 공정의 Slurry유동 분석

  • 김문기 (서울대학교 기계항공공학부 대학원) ;
  • 윤영빈 (서울대학교 기계항공공학부) ;
  • 고영호 ((주)삼성전자 메모리사업부) ;
  • 홍창기 ((주)삼성전자 메모리사업부) ;
  • 신상희 (서울대학교 기계항공공학부)
  • Published : 2006.05.01
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Abstract

Chemical Mechanical Polishing(CMP) in semiconductor production is characterized its output property by Removal Rate(RR) and Non-Uniformity(NU). Some previous works show that RR is determined by production of pressure and velocity and NU is also largely affected by velocity of flowfield during CMP. This study is about the direct measurement of velocity of slurry during CMP and whole flowfield upon the non-groove pad by Particle Image Velocimetry(PIV). Typical PIV system is modified adequately for inspecting CMP and slurry flowfield is measured by changing both pad rpm and carrier rpm. We performed measurement with giving some variation in the kinds of pad. The results show that the flowfield is majorly determined not by Carrier but by Pad in the case of non-groove pad.

Keywords

References

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