한국정밀공학회지 (Journal of the Korean Society for Precision Engineering)

  • 제22권6호
  • /
  • Pages.144-151
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  • 2005
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  • 1225-9071(pISSN)
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  • 2287-8769(eISSN)
한국정밀공학회 (Korean Society for Precision Engineering)
권호 표지

화합물 반도체 본딩용 Spin Coater Module의 동특성 평가

Dynamic Characteristic Evaluation of Spin Coater Module for GaAs Wafer Bonding

  • 송준엽 (한국기계연구원 지능형정밀기계연구부) ;
  • 김옥구 (한국기계연구원 지능형정밀기계연구부) ;
  • 강재훈 (한국기계연구원 지능형정밀기계연구부)
  • 발행 : 2005.06.01
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초록

Spin coater is regarded as a major module rotating at high speed to be used build up polymer resin thin film layer fur bonding process of GaAs wafer. This module is consisted of spin unit for spreading uniformly, align device, resin spreading nozzle and et. al. Specially, spin unit which is a component of module can cause to vibrate and finally affect to the uniformity of polymer resin film layer. For the stability prediction of rotation velocity and uniformity of polymer resin film layer, it is very important to understand the dynamic characteristics of assembled spin coater module and the dynamic response mode resulted from rotation behavior of spin chuck. In this paper, stress concentration mode and the deformed shape of spin chuck generated due to angular acceleration process are presented using analytical method for evaluation of structural safety according to the revolution speed variation of spin unit. And also, deformation form of GaAs wafer due to dynamic behavior of spin chuck is presented fur the comparison of former simulated results.

키워드

참고문헌

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