• Title/Summary/Keyword: Coater module

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Dynamic Characteristic Evaluation of Spin Coater Module for GaAs Wafer Bonding (화합물 반도체 본딩용 Spin Coater Module의 동특성 평가)

  • Song Jun Yeob;Kim Ok Koo;Kang Jae Hoon
    • Journal of the Korean Society for Precision Engineering
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    • v.22 no.6 s.171
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    • pp.144-151
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    • 2005
  • Spin coater is regarded as a major module rotating at high speed to be used build up polymer resin thin film layer fur bonding process of GaAs wafer. This module is consisted of spin unit for spreading uniformly, align device, resin spreading nozzle and et. al. Specially, spin unit which is a component of module can cause to vibrate and finally affect to the uniformity of polymer resin film layer. For the stability prediction of rotation velocity and uniformity of polymer resin film layer, it is very important to understand the dynamic characteristics of assembled spin coater module and the dynamic response mode resulted from rotation behavior of spin chuck. In this paper, stress concentration mode and the deformed shape of spin chuck generated due to angular acceleration process are presented using analytical method for evaluation of structural safety according to the revolution speed variation of spin unit. And also, deformation form of GaAs wafer due to dynamic behavior of spin chuck is presented fur the comparison of former simulated results.

A Study on the Control Algorithm for the 300[mm] Wafer Edge Exposure of ArF Type using A Linear CCD Sensor (선형 CCD 센서를 적용한 ArF 파장대 웨이퍼 에지 노광장비의 제어에 관한 연구)

  • Park, Hong-Lae;Lee, Cheol-Gyu
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.22 no.6
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    • pp.148-155
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    • 2008
  • This study presents a process control of the wafer edge exposure (WEE) used in 300[mm] wafer environment. WEE, as a key module of the overall track system (coater and developer) for making patterns on wafer, is a system to expose the UV-ray on the wafer to remove a photo resist around edge of the wafer. It can measure, memorize and control the distance and angles from wafer center to edge. Recently in the 300[mm] semiconductor fabrication, the track system strongly requires that WEE station has a controller with high throughput and accuracy to increase process efficiency. We have designed and developed the controller, and present here a WEE control algorithm and experimental results.